摘要:
A method for reactive ion etching of SiO2 and an etch stop barrier for use in such an etching is provided. A silicon nitride (SixNy) barrier having a Six to Ny ratio (x:y) of less than about 0.8 and preferably the stoichiometric amount of 0.75 provides excellent resilience to positive mobile ion contamination, but poor etch selectivity. However, a silicon nitride barrier having a ratio of Six to Nx (x:y) of 1.0 or greater has excellent etch selectivity with respect to SiO2 but a poor barrier to positive mobile ion contamination. A barrier of silicon nitride is formed on a doped silicon substrate which barrier has two sections. One section has a greater etch selectivity with respect to silicon dioxide than the second section and the second section has a greater resistance to transmission of positive mobile ions than the first section. One section adjacent the silicon substrate has a silicon to nitrogen ratio of less than about 0.8. The second section, formed on top of the first section is formed with the ratio of the silicon to nitrogen of greater than about 0.8. Preferably the two sections together are from about 50 to about 100 nanometers thick.
摘要:
An improved field effect transistor (FET) structure is disclosed. It comprises a first insulator layer containing at least one primary level stud extending through the layer; an undoped cap oxide layer disposed over the insulator layer and abutting the upper region of each stud; a primary level thin film transistor (TFT) disposed over the undoped cap oxide layer; and a planarized oxide layer disposed over the TFT. Multiple TFT's can be stacked vertically, and connected to other levels of studs and metal interconnection layers. Another embodiment of the invention includes the use of a protective interfacial cap over the surface of tungsten-type studs. The FET structure can serve as a component of a static random access memory (SRAM) cell. Related processes are also disclosed.
摘要:
Apparatus (200) for sorting mixed waste materials, comprising: a housing (260) configured to be vibrated to assist sorting; a screen (210) supported by the housing (260) and having an inlet end (212) for receiving waste materials and an outlet end (214) for discharging at least some waste received at the inlet end (212), the screen (210) comprising at least one portion (220) pivotally coupled adjacent the inlet end (212) to a substantially horizontal axle (222) mounted in the housing (260); and drive means (224,228) configured to pivot the at least one portion (222) of the screen (210) about the axle (222) with a controlled reciprocating action.
摘要:
Apparatus (200) for sorting mixed waste materials, comprising: a housing (260) configured to be vibrated to assist sorting; a screen (210) supported by the housing (260) and having an inlet end (212) for receiving waste materials and an outlet end (214) for discharging at least some waste received at the inlet end (212), the screen (210) comprising at least one portion (220) pivotally coupled adjacent the inlet end (212) to a substantially horizontal axle (222) mounted in the housing (260); and drive means (224,228) configured to pivot the at least one portion (222) of the screen (210) about the axle (222) with a controlled reciprocating action.
摘要:
An e-mail sender is provided with an option to send a notification to the prospective recipient(s) of an e-mail indicating to the recipient that an e-mail has been sent to his or her attention or to a business or other entities attention. The notification can be advantageously sent by a different communications route, such as by mail, courier, telephone call, facsimile, social network, or other method. Back up notifications can also be sent on an automated basis. The notification can be sent automatically and/or sent a period of time after the e-mail is sent if an acknowledgment or reply is not received.
摘要:
Circuits, systems, and methods are disclosed to eliminate the requirement for an external electromechanical contactor. Integrating contactor circuits with a motor controller reduces cost. Additionally, the cost of the contactor circuit may be reduced by providing transistors designed to block current in only one direction in the event of an electrical fault corresponding to an electrical drive direction.
摘要:
Circuits, systems, and methods are disclosed to eliminate the requirement for an external electromechanical contactor. Integrating contactor circuits with a motor controller reduces cost. Additionally, the cost of the contactor circuit may be reduced by providing transistors designed to block current in only one direction in the event of an electrical fault corresponding to an electrical drive direction.
摘要:
A trench decoupling capacitor is formed using RIE lag of a through silicon via (TSV) etch. A method includes etching a via trench and a capacitor trench in a wafer in a single RIE process. The via trench has a first depth and the capacitor trench has a second depth less than the first depth due to RIE lag.
摘要:
A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a deep trench capacitor disposed under the body/channel region of the semiconductor device. The deep trench capacitor electrically connects with and contacts the body/channel region of the semiconductor device, and is located adjacent to the gate of the semiconductor device. The semiconductor structure increases a critical charge Qcrit, thereby reducing a soft error rate (SER) of the semiconductor device.
摘要:
A trench capacitor, method of forming a trench capacitor and a design structure for a trench capacitor. The trench capacitor including: a trench in a single-crystal silicon substrate, a conformal dielectric liner on the sidewalls and the bottom of the trench; an electrically conductive polysilicon inner plate filling regions of the trench not filled by the liner; an electrically conductive doped outer plate in the substrate surrounding the sidewalls and the bottom of the trench; a doped silicon region in the substrate; a first electrically conductive metal silicide layer on a surface region of the doped silicon region exposed at the top surface of the substrate; a second electrically conductive metal silicide layer on a surface region of the inner plate exposed at the top surface of the substrate; and an insulating ring on the top surface of the substrate between the first and second metal silicide layers.