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    Electroless metal deposition for micron scale structures
    1.
    发明授权
    Electroless metal deposition for micron scale structures 有权
    用于微米级结构的无电金属沉积

    公开(公告)号：US09260783B2

    公开(公告)日：2016-02-16

    申请号：US13203622

    申请日：2010-02-25

    申请人： Michael Dunleavy ,  Sajad Haq ,  Martyn John Hucker

    发明人： Michael Dunleavy ,  Sajad Haq ,  Martyn John Hucker

    IPC分类号： C23C18/16 ,  C23C18/44

    CPC分类号： C23C18/44 ,  C23C18/1616 ,  C23C18/1678

    摘要： A method for electroless metal deposition on a surface in a finely dimensioned space (e.g. the bore of a hollow fiber) includes introducing into the space an electroless plating solution that has a nil or relatively low plating rate at normal room temperature, and thereafter heating the structure to an elevated temperature for a period sufficient to cause metal to plate on the wall surface. The introducing and heating may be repeated as necessary or desired to build up a specified thickness.

    摘要翻译： 在精细尺寸的空间（例如中空纤维的孔）中的表面上的无电金属沉积的方法包括将在正常室温下具有零或相对低的电镀速率的无电镀溶液引入到该空间中，然后加热 结构到升高的温度足以使金属板在壁表面上的时间。 引导和加热可以根据需要或期望重复以形成规定的厚度。

    ELECTROLESS METAL DEPOSITION FOR MICRON SCALE STRUCTURES
    3.
    发明申请
    ELECTROLESS METAL DEPOSITION FOR MICRON SCALE STRUCTURES 有权
    用于微尺度结构的电解金属沉积

    公开(公告)号：US20110305825A1

    公开(公告)日：2011-12-15

    申请号：US13203622

    申请日：2010-02-25

    申请人： Michael Dunleavy ,  Sajad Haq ,  Martyn John Hucker

    发明人： Michael Dunleavy ,  Sajad Haq ,  Martyn John Hucker

    IPC分类号： B05D5/12

    CPC分类号： C23C18/44 ,  C23C18/1616 ,  C23C18/1678

    摘要： A method for electroless metal deposition on a surface in a finely dimensioned space (e.g. the bore of a hollow fibre) includes introducing into the space an electroless plating solution that has a nil or relatively low plating rate at normal room temperature, and thereafter heating the structure to an elevated temperature for a period sufficient to cause metal to plate on the wall surface. The introducing and heating may be repeated as necessary or desired to build up a specified thickness.

    摘要翻译： 在精细尺寸的空间（例如中空纤维的孔）中的表面上的无电金属沉积的方法包括将在正常室温下具有零或相对低的电镀速率的无电镀溶液引入到该空间中，然后加热 结构到升高的温度足以使金属板在壁表面上的时间。 引导和加热可以根据需要或期望重复以形成规定的厚度。

    Forming nanostructures
    4.
    发明授权
    Forming nanostructures 有权
    形成纳米结构

    公开(公告)号：US07794784B2

    公开(公告)日：2010-09-14

    申请号：US10517257

    申请日：2004-11-04

    申请人： Sajad Haq ,  Ioannis Alexandrou ,  Gehan A J Amaratunga ,  Khai H Ang

    发明人： Sajad Haq ,  Ioannis Alexandrou ,  Gehan A J Amaratunga ,  Khai H Ang

    IPC分类号： B05D7/00

    CPC分类号： C04B35/62277 ,  B82Y30/00 ,  C01B32/914 ,  C04B35/62227 ,  C04B2235/405 ,  C04B2235/5264 ,  C04B2235/5284

    摘要： A method of forming a nanowire comprising: providing nanoparticles of a metallic material; providing a vapor of fluorocarbon molecules by heating a solid polymer; depositing at least some of the carbon of said molecules onto an exterior of one of said particles to form a deposit of carbon which surrounds at least part of the exterior of said one particle and assembling further of said particles with said one particle to form an elongate configuration of material in the form of a nanowire. Similar methods of production of nanotubes are also disclosed.

    摘要翻译： 一种形成纳米线的方法，包括：提供金属材料的纳米颗粒; 通过加热固体聚合物提供氟碳分子的蒸气; 将所述分子的至少一些碳沉积到所述颗粒之一的外部上以形成碳沉积物，所述沉积物围绕所述一个颗粒的外部的至少一部分并且与所述一个颗粒进一步组装所述颗粒以形成细长的 配置纳米线形式的材料。 还公开了类似的纳米管生产方法。

    THERMOELECTRIC DEVICE
    5.
    发明申请
    THERMOELECTRIC DEVICE 有权
    热电装置

    公开(公告)号：US20140083477A1

    公开(公告)日：2014-03-27

    申请号：US14115500

    申请日：2012-05-01

    申请人： Sajad Haq ,  Michael Dunleavy ,  Martyn John Hucker ,  Joseph Maurice Davies

    发明人： Sajad Haq ,  Michael Dunleavy ,  Martyn John Hucker ,  Joseph Maurice Davies

    IPC分类号： H01L35/32 ,  H01L35/34 ,  H01L35/24

    CPC分类号： H01L35/32 ,  B64D41/00 ,  H01L35/24 ,  H01L35/34

    摘要： The disclosed relates to a thermoelectric device for generating electrical currents exploiting the Seebeck effect, more specifically a structural thermoelectric device which can replace a structural component of a body. The structural thermoelectric device can include a first conductor layer, a second conductor layer and located therebetween a polymer thermocouple layer having a reinforcement formed from a structural support, wherein the internal surface of the support includes at least one layer of at least one conducting polymer. The reinforcement can be is porous material with a plurality of voids, wherein the internal surfaces of the voids are coated with a conducting polymer, which is capable of providing the Peltier effect.

    摘要翻译： 所公开的涉及一种用于产生采用塞贝克效应的电流的热电装置，更具体地说，一种能代替主体结构部件的结构热电装置。 结构热电装置可以包括第一导体层，第二导体层，并且位于其间具有由结构支撑件形成的增强件的聚合物热电偶层，其中载体的内表面包括至少一层至少一种导电聚合物。 加强件可以是具有多个空隙的多孔材料，其中空隙的内表面涂覆有能够提供珀尔帖效应的导电聚合物。

    Fibre Structure for the Identification of Defects In the Structure
    8.
    发明申请
    Fibre Structure for the Identification of Defects In the Structure 审中-公开
    用于识别结构缺陷的光纤结构

    公开(公告)号：US20090121121A1

    公开(公告)日：2009-05-14

    申请号：US11988060

    申请日：2006-06-22

    申请人： Michael Dunleavy ,  Sajad Haq

    发明人： Michael Dunleavy ,  Sajad Haq

    IPC分类号： G01J5/08

    CPC分类号： G01N21/91 ,  G01M5/0033 ,  G01M5/0083 ,  G01M5/0091 ,  G01M11/08

    摘要： This invention is concerned with means for detecting potential fracturing, such as stress fractures, or damage to, a fibre based structure, by incorporating either hollow fibres containing coloured fluids, or solid fibres, or hollow fibres containing coloured fluids or fluids, which are capable of changing their visual appearance when exposed to external forces, and/or by incorporating fibres within the structure which can change a property such as electrical resistance, capacitance or inductance so that there is an indication whenever and wherever and the extent when a fracture occurs. Where coloured fluids are used, detection is by leakage of the fluid around the fracture. Where colour changing fluids are employed, detection is by observation of change of colour of the fluid. Different fluids can be used for different levels in the strata of tubes in the structure and where these are embedded within the structure, they can be observed where the fibres emanate from the body of the structure. Where fibres are incorporated into the structure that rely on electrical properties to sense a fracture, these fibres may be solid and formed from electrically conductive material and may be coated with such material. Alternatively, though used together with solid fibres, hollow fibres may be used where those hollow fibres contain and/or are coated with electrically conductive material. Appropriate detector means are associated with these fibres to detect the occurrence of a fracture.

    摘要翻译： 本发明涉及通过掺入含有着色流体的中空纤维或含有有色液体或固体纤维的中空纤维来检测潜在的压裂，例如应力断裂或损坏纤维基结构的方法 在暴露于外力时改变其视觉外观，和/或通过在结构内结合纤维，其可以改变诸如电阻，电容或电感的性质，使得当断裂发生时每当和任何地方和程度都有指示。 在使用彩色液体的情况下，检测是通过裂缝周围的流体泄漏。 在使用变色流体的情况下，通过观察流体颜色的变化来进行检测。 不同的流体可以用于结构中的管的层中的不同水平，并且其中嵌入结构中的那些，可以观察到纤维从结构体发出的位置。 当纤维结合到依赖于电性能以感测断裂的结构中时，这些纤维可以是固体的并且由导电材料形成并且可以用这种材料涂覆。 或者，尽管与固体纤维一起使用，但是当中空纤维含有和/或涂覆有导电材料时，可以使用中空纤维。 合适的检测器装置与这些纤维相关联以检测骨折的发生。

    Method for manufacturing a filled hollow fibre composite material
    9.
    发明授权
    Method for manufacturing a filled hollow fibre composite material 有权
    填充中空纤维复合材料的制造方法

    公开(公告)号：US06478913B1

    公开(公告)日：2002-11-12

    申请号：US09622404

    申请日：2000-08-17

    申请人： Michael Dunleavy ,  Christopher Somerton ,  Jennifer Hudd ,  Sajad Haq

    发明人： Michael Dunleavy ,  Christopher Somerton ,  Jennifer Hudd ,  Sajad Haq

    IPC分类号： B29C6714

    CPC分类号： B29C70/00 ,  B29C70/16 ,  B29C70/545 ,  Y10T156/11

    摘要： A filled hollow fibre composite material is made by laying up a plurality of prepreg plies (1) of hollow fibre composite material and non-stick film material (2) one on top of another with the non-stick film material (2) interleaving successive plies (1) at selected areas thereof. The laid up interleaved plies are treated to resin bond the ply areas (3) not interleaved with the non-stick film material and leave the interleaved areas (4) unbonded. The so formed laminate is treated at edge regions to expose open unfilled hollow fibre ends (5, 6) and the plies in the unbonded interleaved areas (4) are separated at the non-stick film material (2) to provide access to the open hollow fibre ends (7) in each ply for the introduction of a film material into the hollow fibres through the open hollow fibre ends (7) in one or more of the separated plies (1) to form a filled hollow fibre composite material.

    摘要翻译： 填充中空纤维复合材料通过将不粘膜材料（2）交替连续地铺设多个中空纤维复合材料和不粘膜材料（2）的预浸料层（1）而形成， （1）在其选定区域。 将铺设的交织层处理成树脂粘合不与不粘膜材料交织的层区域（3），并使交错区域（4）未粘合。 在边缘区域处理如此形成的层压体以暴露开放的未填充中空纤维端部（5,6），并且未粘合交织区域（4）中的层在不粘膜材料（2）处分离以提供通向开口 每个层中的中空纤维端部（7），用于通过一个或多个分离层（1）中的开口中空纤维端部（7）将膜材料引入中空纤维中，以形成填充的中空纤维复合材料。

    Fabrication of chiral composite material
    10.
    发明授权
    Fabrication of chiral composite material 失效
    手性复合材料的制作

    公开(公告)号：US5728346A

    公开(公告)日：1998-03-17

    申请号：US698390

    申请日：1996-08-15

    申请人： Sajad Haq

    发明人： Sajad Haq

    IPC分类号： H01Q17/00 ,  H05K9/00 ,  B29C39/12

    CPC分类号： H05K9/009 ,  H01Q17/00 ,  Y10S425/033

    摘要： Chiral composite material is made using an apertured plate (2) having apertures (3) therethrough corresponding to the desired locations of chiral elements (4) in the composite material. The plate (2) is located to overlie a substrate (1) with or without the intermission of spacer (10) which may be apertured in correspondence with the plate (2) or which may be ring like in form. The chiral elements (4) are held in position by locating means such as a tab (5) which may be magnetic in, on or associated with the plate (2) and a first layer (8) of liquid host material is placed in the apertures (3) around the elements (4) against the substrate (1), allowed to set and the plate (2) removed. A second layer (9) of liquid host material is then applied to the set first layer (8) and allowed to set to produce the desired composite material.

    摘要翻译： 手性复合材料使用具有孔（3）的开孔板（2）制成，所述开口孔对应于复合材料中手性元件（4）的期望位置。 板（2）位于与基板（1）相叠合的位置，可以有或没有间隔件（10）的中间间隔，该间隔件可以与板（2）对应地开孔，或者可以是环形的。 手性元件（4）通过定位装置（例如可以是磁性的，在板或与板相关联的片）（5）保持在适当的位置，并且液体主体材料的第一层（8）被放置在 围绕元件（4）围绕基板（1）的孔（3）被允许固定并且板（2）被移除。 然后将液体主体材料的第二层（9）施加到固化的第一层（8）上，并允许其设置以产生所需的复合材料。