公开(公告)号：US08310023B2

公开(公告)日：2012-11-13

申请号：US12360444

申请日：2009-01-27

申请人： Ho Joon Park ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

发明人： Ho Joon Park ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

IPC分类号： H01L23/52

CPC分类号： H01L33/641 ,  H01L33/46 ,  H01L2224/16225 ,  H01L2224/97

摘要： The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种LED封装及其制造方法。 本发明提供了一种LED封装，其包括基座硅基板和绝缘膜以及形成在基座硅基板上的电极图案。 LED封装还包括形成在电极图案上的具有通孔的间隔物。 LED封装还包括接收在通孔中的LED，与芯片接合的倒装芯片，以及附着到间隔物的上表面的光学元件。

公开(公告)号：US07816156B2

公开(公告)日：2010-10-19

申请号：US11882167

申请日：2007-07-31

申请人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

发明人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

IPC分类号： H01L29/22 ,  H01L23/498

CPC分类号： H01L33/641 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

公开(公告)号：US07649208B2

公开(公告)日：2010-01-19

申请号：US11313508

申请日：2005-12-21

申请人： Sung Jun Lee ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sang Hyun Choi ,  Chang Hyun Lim

发明人： Sung Jun Lee ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sang Hyun Choi ,  Chang Hyun Lim

IPC分类号： H01L27/15

CPC分类号： H01L31/147 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2924/00014

摘要： The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.

摘要翻译： 本发明涉及一种包括光电二极管的LED封装。 LED封装包括硅衬底，并且在其上部形成光电二极管。 而且，除了光电二极管的光接收面积以外，在硅基板上形成绝缘层。 在LED封装中，在绝缘层上形成LED端子以连接到光电二极管。 第一和第二LED连接焊盘形成在绝缘层上，并布置在光电二极管的两侧。 此外，LED芯片安装在硅衬底上，并连接到第一和第二LED连接焊盘。

公开(公告)号：US20090137073A1

公开(公告)日：2009-05-28

申请号：US12360444

申请日：2009-01-27

申请人： Ho Joon PARK ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

发明人： Ho Joon PARK ,  Woong Lin Hwang ,  Seog Moon Choi ,  Sung Jun Lee ,  Sang Hyun Choi ,  Chang Hyun Lim

IPC分类号： H01L33/00

CPC分类号： H01L33/641 ,  H01L33/46 ,  H01L2224/16225 ,  H01L2224/97

摘要： The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种LED封装及其制造方法。 本发明提供了一种LED封装，其包括基座硅基板和绝缘膜以及形成在基座硅基板上的电极图案。 LED封装还包括形成在电极图案上的具有通孔的间隔物。 LED封装还包括接收在通孔中的LED，与芯片连接的倒装芯片，以及附着到间隔物的上表面的光学元件。

公开(公告)号：US07326964B2

公开(公告)日：2008-02-05

申请号：US11312365

申请日：2005-12-21

申请人： Chang Hyun Lim ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Sang Hyun Choi

发明人： Chang Hyun Lim ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Sang Hyun Choi

IPC分类号： H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H02H3/20 ,  H02H9/04 ,  H02H3/00 ,  H02H7/00 ,  H02H9/02

CPC分类号： H01L33/62 ,  H01L24/17 ,  H01L25/167 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The LED package includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.

摘要翻译： 一种具有由静电力操作的MEMS开关的LED封装，能够连续地保护LED免受由静电放电引起的过大电流的影响。 LED封装包括其上形成有第一和第二电极图案的基座; 安装在所述基座上的LED，具有电连接到所述第一电极图案的n电极和与所述第二电极图案电连接的p电极; 以及包括第一导电板和第二导电板的MEMS开关，所述第一导电板和第二导电板被弯曲成具有与所述第一导电板上方并垂直分开的面积，其中所述第一和第二导电板电连接到所述第一和第二电极图案， 导电板通过施加高于预定电压电压的静电力与第一导电板接触。

公开(公告)号：US07262440B2

公开(公告)日：2007-08-28

申请号：US11320968

申请日：2005-12-30

申请人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

发明人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

IPC分类号： H01L29/22 ,  H01L23/498 ,  H01L21/00

CPC分类号： H01L33/641 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

公开(公告)号：US07582496B2

公开(公告)日：2009-09-01

申请号：US11312412

申请日：2005-12-21

申请人： Sung Jun Lee ,  Woong Lin Hwang ,  Sang Hyun Choi ,  Chang Hyun Lim ,  Ho Joon Park ,  Seog Moon Choi

发明人： Sung Jun Lee ,  Woong Lin Hwang ,  Sang Hyun Choi ,  Chang Hyun Lim ,  Ho Joon Park ,  Seog Moon Choi

IPC分类号： H01L21/00 ,  H01L33/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.

摘要翻译： 提供了使用Si衬底的LED封装和LED封装的制造方法。 在LED封装中，支撑结构包括Si衬底和形成在Si衬底的顶表面和底表面上的绝缘层，并且支撑结构通过部分去除Si衬底和绝缘层而在底表面中限定至少一个凹槽 。 多个上电极形成在支撑结构的顶表面上。 至少一个LED安装在支撑结构的顶表面上，并且LED包括电连接到上电极的两个端子。 金属填料填充在支撑结构的底面中限定的槽中。

公开(公告)号：US08686295B2

公开(公告)日：2014-04-01

申请号：US12614407

申请日：2009-11-07

申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K7/20

CPC分类号： H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

公开(公告)号：US08502374B2

公开(公告)日：2013-08-06

申请号：US13281285

申请日：2011-10-25

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Sung Keun Park ,  Seog Moon Choi ,  Chang Hyun Lim

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Sung Keun Park ,  Seog Moon Choi ,  Chang Hyun Lim

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：具有形成在多个半导体器件安装区域之间的沟槽的基底基板; 安装在基底基板的半导体器件安装区域上的半导体器件; 以及形成在基底基板上和凹槽的内部中的模制件。

公开(公告)号：US20130009290A1

公开(公告)日：2013-01-10

申请号：US13247603

申请日：2011-09-28

申请人： Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

发明人： Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

IPC分类号： H01L25/065 ,  H01L21/98

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/291 ,  H01L2224/29187 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.

摘要翻译： 本文公开了一种功率模块封装，包括：第一基板; 第二基板，其具有用于连接到其一个表面的一侧或两侧上的第一基板的焊盘，并且具有用于连接到形成在其另一个表面上的外部的外部连接端子; 以及引线框架，其一端接合到第一基板，另一端接合到第二基板的焊盘，从而使第一和第二基板彼此垂直连接。