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    INSULATOR AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT
    3.
    发明申请
    INSULATOR AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT 审中-公开
    具有电子元件的印刷电路板的绝缘体和制造方法

    公开(公告)号：US20110123808A1

    公开(公告)日：2011-05-26

    申请号：US12774432

    申请日：2010-05-05

    申请人： Sang-Chul Lee ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

    发明人： Sang-Chul Lee ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

    IPC分类号： B32B9/04 ,  B29C65/52 ,  B32B27/00

    CPC分类号： H05K1/185 ,  H01L21/568 ,  H05K3/4602 ,  H05K2201/0195 ,  Y10T156/10 ,  Y10T428/31504

    摘要： An insulator and a manufacturing method of an electronic component embedded printed circuit board using the insulator are disclosed. The method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer covering the cavity to a lower surface of the core board, disposing an electronic component on an upper surface of the adhesive layer, in which the upper surface corresponds to the cavity, and stacking an insulator on an upper surface of the core board so as to fill the cavity, in which the insulator has an upper resin layer and a lower resin layer formed on an upper surface and a lower surface of a reinforcing material, respectively. The insulator has an asymmetric structure in which the lower resin layer is thicker than the upper resin layer.

    摘要翻译： 公开了一种使用绝缘体的电子部件嵌入式印刷电路板的绝缘体和制造方法。 该方法包括提供具有形成在其表面上的电路图案的芯板，其中芯板被腔体穿透，将覆盖空腔的粘合剂层粘附到芯板的下表面，将电子部件放置在 粘合剂层的上表面，其上表面对应于空腔，并且在芯板的上表面上堆叠绝缘体以填充空腔，绝缘体具有上树脂层和下树脂层 分别形成在增强材料的上表面和下表面上。 绝缘体具有不对称结构，其中下树脂层比上树脂层厚。

    PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF 审中-公开
    具有电子元件的印刷电路板及其制造方法

    公开(公告)号：US20110005823A1

    公开(公告)日：2011-01-13

    申请号：US12774397

    申请日：2010-05-05

    申请人： Sang-Chul LEE ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

    发明人： Sang-Chul LEE ,  Yul-Kyo Chung ,  Doo-hwan Lee ,  Sang-Jin Baek

    IPC分类号： H05K1/16 ,  H05K3/30

    CPC分类号： H05K3/305 ,  H01L21/568 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2924/3511 ,  H01L2924/35121 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49139

    摘要： An electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a core board having a circuit pattern formed on a surface thereof, in which the core board is penetrated by a cavity, adhering an adhesive layer to a lower surface of the core board so as to cover the cavity, disposing an electronic component on an upper surface of the adhesive layer, the upper surface corresponding to the cavity, covering the circuit pattern by stacking a first insulator on an upper surface of the core board such that the cavity is filled, the first insulator having no backing material filled therein, and stacking a second insulator on both upper and lower sides of the cord board, in which the second insulator has a backing material filled therein.

    摘要翻译： 公开了电子部件嵌入式印刷电路板及其制造方法。 根据本发明的实施例，该方法包括提供一种具有形成在其表面上的电路图案的芯板，其中芯板被空腔穿透，将粘合剂层粘附到芯板的下表面 以覆盖空腔，将电子部件设置在粘合剂层的上表面上，与空腔对应的上表面，通过在芯板的上表面上堆叠第一绝缘体来覆盖电路图案，使得空腔为 填充有第一绝缘体，其中没有填充衬垫材料，并且在电缆板的上下两侧堆叠第二绝缘体，其中第二绝缘体具有填充在其中的背衬材料。