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    Polishing pad conditioner
    2.
    发明授权
    Polishing pad conditioner 有权
    抛光垫调理剂

    公开(公告)号：US08550879B2

    公开(公告)日：2013-10-08

    申请号：US12256845

    申请日：2008-10-23

    申请人： Hung Chih Chen ,  Sen-Hou Ko ,  Shou-Sung Chang

    发明人： Hung Chih Chen ,  Sen-Hou Ko ,  Shou-Sung Chang

    IPC分类号： B24B1/00 ,  B24B21/18

    CPC分类号： B24B53/017

    摘要： Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a conditioning disk having a compliant backing member is provided. In one embodiment, the compliant backing member comprises a semi-rigid backing member cut into a spiral shape to provide compliancy. In another embodiment, the compliant backing member comprises a fluid-pressurized, flexible membrane. Each embodiment of the present invention provides an improved pressure distribution across the face of each conditioning disk, resulting in increased disk life as well as increased conditioning rate and uniformity.

    摘要翻译： 本发明的实施例通常提供改进的调节模块和调节盘，用于在调节化学机械抛光（CMP）系统的抛光垫的过程中改善压力分布。 在一个实施例中，提供了包括多个小调节盘的调节模块。 在一个实施例中，提供了具有柔顺背衬构件的调节盘。 在一个实施例中，柔顺背衬构件包括切割成螺旋形状以提供符合性的半刚性背衬构件。 在另一个实施例中，顺从背衬构件包括流体加压的柔性膜。 本发明的每个实施例提供了在每个调节盘的表面上的改进的压力分布，导致增加的盘寿命以及增加的调节速率和均匀性。

    CLEANING MODULE AND PROCESS FOR PARTICLE REDUCTION
    3.
    发明申请
    CLEANING MODULE AND PROCESS FOR PARTICLE REDUCTION 审中-公开
    清洁模块和减少颗粒过程

    公开(公告)号：US20130185884A1

    公开(公告)日：2013-07-25

    申请号：US13749116

    申请日：2013-01-24

    申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

    IPC分类号： B08B1/00

    CPC分类号： B08B1/006 ,  B08B1/04 ,  H01L21/67046 ,  H01L21/67051

    摘要： A method and apparatus for cleaning a substrate are provided. In one embodiment, a particle cleaning module is provided that includes a substrate holder and a pad holder disposed in a housing, and an actuator operable to move the pad holder relative to the substrate holder. The substrate holder is configured to retain and rotate a substrate in a substantially vertical orientation. The pad holder has a pad retaining surface that faces the substrate holder in a parallel and spaced apart relation. The pad holder is rotatable on an axis parallel to an axis on which the substrate holder rotates. The actuator is operable to move the pad holder relative to the substrate holder as to change a distance defined between the first axis and the second axis.

    摘要翻译： 提供了一种用于清洁基板的方法和装置。 在一个实施例中，提供了一种颗粒清洁模块，其包括衬底保持器和设置在壳体中的衬垫保持器，以及可操作以相对于衬底保持器移动衬垫保持器的致动器。 衬底保持器被构造成以基本垂直的方向保持和旋转衬底。 焊盘保持器具有以平行和间隔的关系面对衬底保持器的焊盘保持表面。 衬垫支架可以在平行于衬底支架旋转的轴线的轴线上旋转。 致动器可操作以相对于基板保持器移动焊盘保持器，以改变限定在第一轴线和第二轴线之间的距离。

    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
    6.
    发明申请
    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE 审中-公开
    用于处理基板的方法和装置

    公开(公告)号：US20090017731A1

    公开(公告)日：2009-01-15

    申请号：US12239730

    申请日：2008-09-26

    申请人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

    发明人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

    IPC分类号： B24B1/00

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/002 ,  H01L21/02021

    摘要： Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.

    摘要翻译： 提供了用于清洁基板边缘的方法和设备。 本发明包括具有抛光侧和第二面的抛光膜; 邻近抛光膜的第二侧设置的可充气垫; 适于支撑抛光膜和可充气垫的框架; 以及衬底旋转驱动器，其适于将衬底旋转抵靠所述抛光膜的抛光侧，其中所述抛光膜设置在所述衬底的边缘和所述可充气垫之间，使得所述可充气衬垫和抛光膜轮廓到所述衬底的边缘 抛光膜与基板的边缘接触。 提供了许多其他方面。

    METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE BY SUBSTRATE VIBRATION
    7.
    发明申请
    METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE BY SUBSTRATE VIBRATION 审中-公开
    用于通过基板振动抛光基板的方法和装置

    公开(公告)号：US20080293337A1

    公开(公告)日：2008-11-27

    申请号：US12124133

    申请日：2008-05-20

    申请人： Zhenhua Zhang ,  Sen-Hou Ko

    发明人： Zhenhua Zhang ,  Sen-Hou Ko

    IPC分类号： B24B1/00

    CPC分类号： B24B1/04 ,  B24B9/065

    摘要： Apparatus and methods are provided for polishing a notch on an edge of a substrate. An exemplary apparatus may include a substrate support adapted to support a substrate; a polishing head adapted to contact a notch in an edge of the substrate; and a controller adapted to oscillate the substrate between at least first and second oscillatory positions while the polishing head contacts the substrate notch. Numerous other aspects are provided.

    摘要翻译： 提供了用于抛光衬底边缘上的凹口的装置和方法。 示例性装置可以包括适于支撑衬底的衬底支撑件; 抛光头，其适于接触所述基板的边缘中的凹口; 以及控制器，其适于在所述抛光头接触所述基板凹口的同时在至少第一和第二振荡位置之间振荡所述基板。 提供了许多其他方面。

    METHOD FOR CONDITIONING PROCESSING PADS
    9.
    发明申请
    METHOD FOR CONDITIONING PROCESSING PADS 失效
    调节加工垫的方法

    公开(公告)号：US20070128992A1

    公开(公告)日：2007-06-07

    申请号：US11671818

    申请日：2007-02-06

    申请人： PAUL BUTTERFIELD ,  Sen-Hou Ko

    发明人： PAUL BUTTERFIELD ,  Sen-Hou Ko

    IPC分类号： B24B1/00

    CPC分类号： B24B53/017 ,  B24B53/12

    摘要： Embodiments of a flexible pad conditioner for conditioning a processing pad are provided. The pad conditioner includes an arc-shaped member having an abrasive bottom surface configured for conditioning the processing pad. Means are provided to apply a downward force as well as to oscillate the pad conditioner. Further means may be provided to vary the downward force along the length of the pad conditioner. In one embodiment, a plurality of actuators may be coupled to a top surface of the member and adapted to selectively provide an independently controllable force against the member to finely control the conditioning profile.

    摘要翻译： 提供了一种用于调理处理垫的柔性垫调节器的实施例。 垫调节器包括具有用于调理处理垫的研磨底面的弧形构件。 提供装置以施加向下的力以及使垫调节器振荡。 可以提供另外的装置来改变沿衬垫调节器的长度的向下的力。 在一个实施例中，多个致动器可以联接到构件的顶表面并且适于选择性地提供抵靠构件的独立可控的力以精细地控制调节轮廓。