摘要:
A mask is configured for projecting a structure pattern onto a semiconductor substrate in an exposure unit. The exposure unit has a minimum resolution limit for projecting the structure pattern onto the semiconductor substrate. The mask has a substrate, at least one raised first structure element on the substrate which has a lateral extent which is at least the minimum lateral extent that can be attained by the exposure unit, a configuration second raised structure elements which are arranged in an area surrounding the at least one first structure element on the substrate in the form of a matrix with a row spacing and a column spacing, whose shape and size are essentially identical to one another, and which have a respective lateral extent that is less than the minimum resolution limit of the exposure unit.
摘要:
A projected image is formed during a material substrate. A photolithographic mask is illuminated with substantially coherent light at an oblique angle of incidence with respect to a surface of the photolithographic mask. The photolithographic mask includes a substantially transparent mask substrate and one or more lines and spaces patterns formed on the mask substrate and having a periodicity P. The mask substrate includes at least one phase shifting region. At least part of the light that is transmitted through the photolithographic mask is collected using one or more projection lenses which project the portion of the transmitted light onto the material substrate. The material substrate is disposed substantially parallel with, but at a distance from, a focal plane of the projection lens system. The phase shifting region of the mask substrate and the distance from the focal plane are selected such that a substantially focused image is projected onto the material substrate that includes the lines and spaces patterned but with a periodicity P/2.
摘要:
A mask (118) and method for patterning a semiconductor wafer. The mask (118) includes apertures (122) and assist lines (124) disposed between apertures (122). The assist lines (124) reduce the diffraction effects of the lithographic process, resulting in improved depth of focus and resolution of patterns on a semiconductor wafer.
摘要:
Methods and reticles for evaluating lenses are disclosed. In one instance, a reticle which permits light to pass therethrough is provided which includes a first surface with a grating profile formed thereon. The grating profile includes a plurality of grouped stepped portions. Each group of the stepped portions includes a first step which prevents light from propagating therethrough, a second step which propagates light therethrough and a third step which propagates light therethrough at an angle 60 degrees out of phase with the light propagated through the second step.
摘要:
An active area pattern is formed atop a deep trench pattern with a single exposure using an alternative phase-shift mask. To prevent adjacent spaces of opposite phase from intersecting one another at the ends of substantially opaque features of the active area pattern, one or more connectors are used to connect the ends of the substantially opaque patterns. Trench regions of the deep trench pattern are arranged such that the conduction path of the connectors are interrupted and prevent the lines from shorting to one another. Alternatively, a bit line pattern or a word line pattern having a lines and spaces array and a support region are printed with a single exposure using an alternating phase-shift mask. At one end of the array region, lines having a respective phase shift extend into the support region, and lines of the opposite phase shift are terminated. At the opposite end of the array, the lines that have the opposite phase shift extend into the support region, and the lines of having the respective phase shift are terminated.
摘要:
A method and system for detecting the quality of an alternating phase shift mask having a number of 180-degree phase shift areas alternating with a number of 0-degree phase shift areas is disclosed. In operation, a light source which provides wavelength-adjustable incident lights illuminates the incident lights on the alternating phase shift mask. The light outputs from boundaries between the 0-degree phase shift areas and the 180-degree phase shift areas of the alternating phase shift mask are detected. Relation curves of the wavelength of the incident light and a light intensity of the boundaries are then calculated. Phase errors of the alternating phase shift mask can thus be measured from the relation curves.
摘要:
An active area pattern is formed atop a deep trench pattern with a single exposure using an alternative phase-shift mask. To prevent adjacent spaces of opposite phase from intersecting one another at the ends of substantially opaque features of the active area pattern, one or more connectors are used to connect the ends of the substantially opaque patterns. Trench regions of the deep trench pattern are arranged such that the conduction path of the connectors are interrupted and prevent the lines from shorting to one another. Alternatively, a bit line pattern or a word line pattern having a lines and spaces array and a support region are printed with a single exposure using an alternating phase-shift mask. At one end of the array region, lines having a respective phase shift extend into the support region, and lines of the opposite phase shift are terminated. At the opposite end of the array, the lines that have the opposite phase shift extend into the support region, and the lines of having the respective phase shift are terminated.
摘要:
The properties of features formed in a substrate are measured. Interferometric illumination is used to illuminate regions of a substrate so that the features of interest occupy a greater proportion of the illuminated area. The signal-to-noise ratio of the measurement signal is therefore increased, and the sensitivity of the measurement is thus improved.
摘要:
A method of forming a trench can be used in the fabrication of dynamic random access memory (DRAM) cells. In one aspect, a first layer of a first material (e.g., polysilicon) is formed over a semiconductor region (e.g., a silicon substrate). The first layer is patterned to remove portions of the first material. A second material (e.g., oxide) can then be deposited to fill the portions where the first material was removed. After removing the remaining portions of the first layer of first material, a trench can be etched in the semiconductor region. The trench would be substantially aligned to the second material.
摘要:
A method for etching a surface includes the steps of providing an under layer formed on the surface and a top layer formed on the under layer. The top layer is patterned to expose portions of the under layer, and a layer including silicon is formed on the exposed portions of the under layer. The top layer is removed to expose the under layer in portions other than the portions of the under layer having the silicon layer thereon, and the under layer is etched in portions other than the portions of the under layer having the silicon layer thereon to expose the surface.