摘要:
A reinforced polyamide composites comprising polyamide resin, 1 to 60 weight percent fiber and/or talc, and 0.1 to 5 phr (part per hundred by resin) interfacial modifier, based on the weight of the polyamide composites; wherein the interfacial modifier are functional organic compounds of structural formula:R.sub.1 (CO.sub.2 H)x;R.sub.1 (CO).sub.2 NH; andR.sub.1 (CO).sub.2 O,whereR.sub.1, R.sub.2, R.sub.3 may be aliphatic or aromatic hydrocarbyl group; the number of carbon atoms in R.sub.1, R.sub.2 and R.sub.3 is in the range of 2 to 16, preferably 2 to 12; and x=1 to 4.The interfacial modifier can be mixed with glass and/or talc and polyamide simultaneously and compounded directly; or, premix the interfacial modifier and polyamide, melt the premix, then incorporate glass fiber and/or talc and compound to form the reinforced polyamide composites. The physical properties of the instant composites can be improved significantly.
摘要:
Interpenetrating polymer network composition, of shaped solid polyester material, e.g. new or reused polyester containing particles, sheeting, fiber or fiber fabric, in a matrix of curable prepolymer resin, e.g. a thermosetting phenol-aldehyde resin of basic pH for providing a flame retardant composition, an interfacial dissolving agent for the polyester material, e.g. an aromatic alcohol and/or a halohydrocarbon, optionally an accelerator for the resin, e.g. a weak acid, and optionally a filler, e.g. in a weight ratio of matrix to polyester material of about 0.25-15:1, wherein the polyester material is distributed, e.g. dissolved, in the manner of a filler in random directional spatial orientation in the matrix and/or preferably is polyester containing linear fiber or fiber fabric arranged as structually reinforcing material in definite directional spatial orientation in the matrix, the composition being consolidated and heat cured to form a prepreg product, and then hot compression molded to form a finally cured, especially flame retardant, structural product.
摘要:
Poly(butylene terephthalate) is prepared in a two-stage process wherein terephthalic acid and 1,4-butanediol are esterified in the presence of a catalytic amount of a catalyst having an organo-metallic component which is an organo-titanate compound, an organo-tin compound or a combination thereof and a salt component which is an organic acid salt or an inorganic salt. In a second step, the esterification product is subject to polycondensation. By following the foregoing procedure, the formation of tetrahydrofuran is significantly suppressed and the percent conversion of esterification products increased.
摘要:
Production of a lightweight, flame retardant, sound absorption composition in the form of a phenol-aldehyde/polyurethane hybrid polymer foam of open cell structure and interconnected continuous porous architecture, by reacting 100 parts by weight phenolic resin, such as a resole resin of an aldehyde and a phenol, e.g. formaldehyde and phenol, having an aldehyde to phenol mole ratio greater than about 1:1; about 50-300 parts by weight aromatic or aliphatic polyisocyanate; about 0-100 parts by weight aliphatic group containing polyol, e.g. a polyether, polyester, polycaprolactone or polybutadiene polyol; and about 0-100 parts by weight filler; in the presence of a catalyst, e.g. a basic and/or metal salt catalyst in an amount of about 0.01-2 parts by weight, and a blowing agent, especially with all reactants but the polyisocyanate being premixed and then combined with the polyisocyanate for reaction in an open mold, e.g. with the resole resin having a pH of about 4.5-9.5, a solid content of about 50-98%, and a viscosity of not greater than about 100,000 cps at 25.degree. C., and optionally with a surfactant being included in the premixed reactants.
摘要:
A light-emitting device module comprising a substrate, a light-emitting device chip and a heat-dissipating unit. The substrate has a cavity formed in the surface, has an insulator layer and metal layers, with layers of metal on the top and bottom surfaces. The light-emitting device chip is placed inside the cavity and is bonded onto the top metal layer of the substrate. The electrodes of the device chip are wired-bonded to electrodes formed on the top metal layer of the substrate. The cavity is filled with an encapsulating material to encapsulate the device chip. A heat-dissipating unit is bonded onto the bottom metal layer of the substrate.
摘要:
Modified polyurethane products, exhibiting good physical strength and excellent heat resistance, and especially improved heat sag properties, are prepared by blending a polyol component containing at least 1% of at least one polynuclear aromatic polyol or a derivative thereof, or a mononuclear diol or a derivative thereof, at a temperature of 100.degree.-180.degree. C., to form a first liquid component; admixing the first liquid component with a second liquid component containing a diisocyanate or polyisocyanate, one of the two liquid components containing a catalyst; and reacting and molding the admixture in a mold kept at a temperature of from 80.degree.-140.degree. C. by reaction injection molding.