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公开(公告)号：US08970051B2
公开(公告)日：2015-03-03
申请号：US13930889
申请日：2013-06-28
IPC分类号： H01L23/52 , H01L23/48 , H01L23/02 , H01L23/488 , H01L21/44 , H01L21/50 , H01L21/768 , H01L23/498
CPC分类号： H01L24/14 , H01L23/3114 , H01L23/49811 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L25/0657 , H01L2224/03462 , H01L2224/0347 , H01L2224/0401 , H01L2224/05555 , H01L2224/05647 , H01L2224/0603 , H01L2224/113 , H01L2224/11428 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/1403 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2924/3511 , H01L2924/00014 , H01L2924/014
摘要： A method including forming a contact pad array on an integrated circuit substrate, the contact pad array including a first plurality of contact pads and a second plurality of contact pads, wherein an accessible area of each of the first plurality of contact pads is different than an accessible area of each of the second plurality of contact pads; and depositing solder on the accessible area of the contact pads. An apparatus including an integrated circuit substrate including a body having a nonplanar shape and a surface including a first plurality of contact pads and a second plurality of contact pads, wherein an accessible area of each of the first plurality of contact pads is different than an accessible area of each of the second plurality of contact pads.
摘要翻译： 一种包括在集成电路基板上形成接触焊盘阵列的方法，所述接触焊盘阵列包括第一多个接触焊盘和第二多个接触焊盘，其中所述第一多个接触焊盘中的每一个的可访问区域不同于 第二多个接触垫中的每一个的可访问区域; 以及将焊料沉积在接触垫的可接近区域上。 一种装置，包括集成电路基板，其包括具有非平面形状的主体和包括第一多个接触焊盘和第二多个接触焊盘的表面，其中，所述第一多个接触焊盘中的每一个的可访问区域不同于可访问的 每个第二多个接触垫的面积。
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2.发明申请公开(公告)号：US20150001740A1
公开(公告)日：2015-01-01
申请号：US13930889
申请日：2013-06-28
IPC分类号： H01L21/768 , H01L23/498
CPC分类号： H01L24/14 , H01L23/3114 , H01L23/49811 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L25/0657 , H01L2224/03462 , H01L2224/0347 , H01L2224/0401 , H01L2224/05555 , H01L2224/05647 , H01L2224/0603 , H01L2224/113 , H01L2224/11428 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/1403 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2924/3511 , H01L2924/00014 , H01L2924/014
摘要： A method including forming a contact pad array on an integrated circuit substrate, the contact pad array including a first plurality of contact pads and a second plurality of contact pads, wherein an accessible area of each of the first plurality of contact pads is different than an accessible area of each of the second plurality of contact pads; and depositing solder on the accessible area of the contact pads. An apparatus including an integrated circuit substrate including a body having a nonplanar shape and a surface including a first plurality of contact pads and a second plurality of contact pads, wherein an accessible area of each of the first plurality of contact pads is different than an accessible area of each of the second plurality of contact pads.
摘要翻译： 一种包括在集成电路基板上形成接触焊盘阵列的方法，所述接触焊盘阵列包括第一多个接触焊盘和第二多个接触焊盘，其中所述第一多个接触焊盘中的每一个的可访问区域不同于 第二多个接触垫中的每一个的可访问区域; 以及将焊料沉积在接触垫的可接近区域上。 一种装置，包括集成电路基板，其包括具有非平面形状的主体和包括第一多个接触焊盘和第二多个接触焊盘的表面，其中，所述第一多个接触焊盘中的每一个的可访问区域不同于可访问的 每个第二多个接触垫的面积。
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公开(公告)号：US20090020869A1
公开(公告)日：2009-01-22
申请号：US11779110
申请日：2007-07-17
申请人： Qing Xue , Shengquan E. Ou , Sairam Agraharam
发明人： Qing Xue , Shengquan E. Ou , Sairam Agraharam
IPC分类号： H01L23/48
CPC分类号： H05K3/4015 , H01L24/13 , H01L2224/05571 , H01L2224/05647 , H01L2224/13017 , H01L2224/13018 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2924/3512 , H05K3/341 , H05K3/3452 , H05K2201/1031 , Y02P70/611 , H01L2924/00012 , H01L2924/00014 , H01L2924/014
摘要： An interconnect joint comprises a substrate (110), a solder resist layer (120) over the substrate, a solder resist opening (130) (having a top surface (131)) in the solder resist layer, a solder material (140) in the solder resist opening, and an electrically conducting structure (150) having a portion that extends into the solder material below the top of the solder resist opening.
摘要翻译： 互连接头包括衬底（110），衬底上的阻焊层（120），阻焊层中的阻焊剂开口（130）（具有顶表面（131）），焊料材料（140） 阻焊剂开口，以及导电结构（150），其具有在阻焊剂开口的顶部下方延伸到焊料材料中的部分。
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