公开(公告)号：US07551678B2

公开(公告)日：2009-06-23

申请号：US11094783

申请日：2005-03-30

申请人： Hiroyuki Kiyanagii ,  Mitsuo Kobayashi ,  Shinya Ohkawa ,  Takanori Iwamatsu

发明人： Hiroyuki Kiyanagii ,  Mitsuo Kobayashi ,  Shinya Ohkawa ,  Takanori Iwamatsu

IPC分类号： H04K1/10

CPC分类号： H04L27/2626 ,  H04B7/10 ,  H04L27/2647 ,  H04L27/2657

摘要： In an OFDM transmitter apparatus for transmitting transmit signals, which are output from first and second OFDM transmit circuits, utilizing two mutually orthogonal polarized waves, a single carrier wave generator is provided in common for the OFDM transmit circuits, and a frequency converter in each OFDM transmit circuit multiplies a baseband signal by a common carrier wave, which is output from the carrier wave generator, to convert the baseband signal to a radio signal.

摘要翻译： 在用于发送从第一和第二OFDM发射电路输出的利用两个相互正交的极化波的发射信号的OFDM发射机装置中，共同地为OFDM发射电路提供单载波产生器，并且每个OFDM中的频率转换器 发送电路将基带信号乘以从载波发生器输出的公共载波，以将基带信号转换为无线电信号。

公开(公告)号：US20080135996A1

公开(公告)日：2008-06-12

申请号：US11859500

申请日：2007-09-21

申请人： SHINYA OHKAWA

发明人： SHINYA OHKAWA

IPC分类号： H01L23/495

CPC分类号： H01L23/49558 ,  H01L23/49503 ,  H01L23/49575 ,  H01L2224/32245 ,  H01L2224/83385

摘要： A connecting tape made of insulating material is adhered between a stage unit 21 and a stage unit 22. The stage units 21 and 22 form united stage units by that. Therefore, edge parts 211 and 221 of the stage units 21 and 22 are bound by the connecting tape 41 and of which movements are restricted. The united stage units 21 and 22 are securely supported by support units 31 and 32 and support units 33 and 34. As a result, number of the support units is reduced and inner lead 12 consumed.

摘要翻译： 由绝缘材料制成的连接带粘附在平台单元21和平台单元22之间。 阶段单元21和22由此形成统一的阶段单元。 因此，台架单元21和22的边缘部分211和221由连接带41束缚，并且其运动被限制。 联合平台单元21和22由支撑单元31,32和支撑单元33和34牢固地支撑。 结果，支撑单元的数量减少，内部引线12消耗。

公开(公告)号：US07777353B2

公开(公告)日：2010-08-17

申请号：US11838396

申请日：2007-08-14

申请人： Shinya Ohkawa

发明人： Shinya Ohkawa

IPC分类号： H01L23/48

CPC分类号： H01L24/85 ,  H01L21/4842 ,  H01L23/4952 ,  H01L23/49551 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48483 ,  H01L2224/4899 ,  H01L2224/49052 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： In a semiconductor device, first wires each having a relatively low loop height are formed between a first lead and a plurality of first electrode pads aligned in a first line, and then second wires each having a relatively high loop height are formed between a second lead and a plurality of second electrode pads aligned in a second line, wherein the second line is distanced from the first line in view of the first and second leads. Wire bonding is sequentially performed so as to increase the height difference between the first wire and the second wire, thus avoiding the occurrence of electric short-circuiting between adjacently arranged wires. In wire bonding, a bump forming process, a ball bonding process, and a wedge bonding process are sequentially performed. It is preferable that the second lead be vertically distanced from the first lead in the thickness direction.

摘要翻译： 在半导体器件中，在第一引线和与第一线对准的多个第一电极焊盘之间形成各自具有较低环路高度的第一布线，然后在第二引线 以及在第二线中排列的多个第二电极焊盘，其中从第一和第二引线的角度来看，第二线与第一线分开。 依次进行引线接合，以增加第一线和第二线之间的高度差，从而避免相邻布置的线之间发生电短路。 在引线接合中，依次进行凸块形成工艺，球接合工艺和楔形粘结工艺。 优选地，第二引线在厚度方向上与第一引线垂直地间隔开。

公开(公告)号：US20050190848A1

公开(公告)日：2005-09-01

申请号：US11094783

申请日：2005-03-30

申请人： Hiroyuki Kiyanagii ,  Mitsuo Kobayashi ,  Shinya Ohkawa ,  Takanori Iwamatsu

发明人： Hiroyuki Kiyanagii ,  Mitsuo Kobayashi ,  Shinya Ohkawa ,  Takanori Iwamatsu

IPC分类号： H04B7/10 ,  H04K1/10 ,  H04L27/26

CPC分类号： H04L27/2626 ,  H04B7/10 ,  H04L27/2647 ,  H04L27/2657

摘要： In an OFDM transmitter apparatus for transmitting transmit signals, which are output from first and second OFDM transmit circuits, utilizing two mutually orthogonal polarized waves, a single carrier wave generator is provided in common for the OFDM transmit circuits, and a frequency converter in each OFDM transmit circuit multiplies a baseband signal by a common carrier wave, which is output from the carrier wave generator, to convert the baseband signal to a radio signal.

摘要翻译： 在用于发送从第一和第二OFDM发射电路输出的利用两个相互正交的极化波的发射信号的OFDM发射机装置中，共同地为OFDM发射电路提供单载波产生器，并且每个OFDM中的频率转换器 发送电路将基带信号乘以从载波发生器输出的公共载波，以将基带信号转换为无线电信号。

公开(公告)号：US07701043B2

公开(公告)日：2010-04-20

申请号：US11859500

申请日：2007-09-21

申请人： Shinya Ohkawa

发明人： Shinya Ohkawa

IPC分类号： H01L23/495

CPC分类号： H01L23/49558 ,  H01L23/49503 ,  H01L23/49575 ,  H01L2224/32245 ,  H01L2224/83385

摘要： A connecting tape made of insulating material is adhered between a stage unit 21 and a stage unit 22. The stage units 21 and 22 form united stage units by that. Therefore, edge parts 211 and 221 of the stage units 21 and 22 are bound by the connecting tape 41 and of which movements are restricted. The united stage units 21 and 22 are securely supported by support units 31 and 32 and support units 33 and 34. As a result, number of the support units is reduced and inner lead 12 consumed.

摘要翻译： 由绝缘材料制成的连接带粘接在平台单元21和平台单元22之间。平台单元21和22通过它们形成统一的平台单元。 因此，台架单元21和22的边缘部分211和221由连接带41束缚，并且其运动被限制。 联合平台单元21和22由支撑单元31,32和支撑单元33和34牢固地支撑。结果，支撑单元的数量减少，内部引线12消耗。

公开(公告)号：US20080088012A1

公开(公告)日：2008-04-17

申请号：US11838396

申请日：2007-08-14

申请人： SHINYA OHKAWA

发明人： SHINYA OHKAWA

IPC分类号： H01L21/60 ,  H01L23/49

CPC分类号： H01L24/85 ,  H01L21/4842 ,  H01L23/4952 ,  H01L23/49551 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48483 ,  H01L2224/4899 ,  H01L2224/49052 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： In a semiconductor device, first wires each having a relatively low loop height are formed between a first lead and a plurality of first electrode pads aligned in a first line, and then second wires each having a relatively high loop height are formed between a second lead and a plurality of second electrode pads aligned in a second line, wherein the second line is distanced from the first line in view of the first and second leads. Wire bonding is sequentially performed so as to increase the height difference between the first wire and the second wire, thus avoiding the occurrence of electric short-circuiting between adjacently arranged wires. In wire bonding, a bump forming process, a ball bonding process, and a wedge bonding process are sequentially performed. It is preferable that the second lead be vertically distanced from the first lead in the thickness direction.

摘要翻译： 在半导体器件中，在第一引线和与第一线对准的多个第一电极焊盘之间形成各自具有较低环路高度的第一布线，然后在第二引线 以及在第二线中排列的多个第二电极焊盘，其中从第一和第二引线的角度来看，第二线与第一线分开。 依次进行引线接合，以增加第一线和第二线之间的高度差，从而避免相邻布置的线之间发生电短路。 在引线接合中，依次进行凸块形成工艺，球接合工艺和楔形粘结工艺。 优选地，第二引线在厚度方向上与第一引线垂直地间隔开。