公开(公告)号：US06946306B2

公开(公告)日：2005-09-20

申请号：US10983689

申请日：2004-11-09

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

摘要翻译： 公开了一种制造半导体器件的方法，该半导体器件能够减少制造步骤的数量并实现制造线的合理化。 半导体器件是通过在检查后将芯片部件（22）和半导体芯片（21）安装到形成在矩阵基板（27）上的每个布线基板（2）上而组装的高频模块。 作为在矩阵基板（27）的检查中被判断为有缺陷的块，在布线基板（2）上附着缺陷标记（2e），然后在一系列后续的组装步骤中识别缺陷标记（e） 并且省略其上具有缺陷标记（2e）的布线基板（2）的组装工作以实现生产线的合理化。

公开(公告)号：US06852553B2

公开(公告)日：2005-02-08

申请号：US10129305

申请日：2001-02-15

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16 ,  H01L21/00 ,  H01L21/44

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

摘要翻译： 公开了一种制造半导体器件的方法，该半导体器件能够减少制造步骤的数量并实现制造线的合理化。 半导体器件是通过在检查后将芯片部件（22）和半导体芯片（21）安装到形成在矩阵基板（27）上的每个布线基板（2）上而组装的高频模块。 作为在矩阵基板（27）的检查中被判定为有缺陷的块，在布线基板（2）上附着有缺陷标记（2e），然后在一系列后续的组装步骤中识别缺陷标记（e） 省略了具有缺陷标记（2e）的布线基板（2）的组装工作，以实现生产线的合理化。

公开(公告)号：US20050250254A1

公开(公告)日：2005-11-10

申请号：US11178423

申请日：2005-07-12

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

公开(公告)号：US20050064612A1

公开(公告)日：2005-03-24

申请号：US10983689

申请日：2004-11-09

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

摘要翻译： 公开了一种制造半导体器件的方法，该半导体器件能够减少制造步骤的数量并实现制造线的合理化。 半导体器件是通过在检查后将芯片部件（22）和半导体芯片（21）安装到形成在矩阵基板（27）上的每个布线基板（2）上而组装的高频模块。 作为在矩阵基板（27）的检查中被判定为有缺陷的块，在布线基板（2）上附着有缺陷标记（2e），然后在一系列后续的组装步骤中识别缺陷标记（e） 省略了具有缺陷标记（2e）的布线基板（2）的组装工作，以实现生产线的合理化。