公开(公告)号：US20050250254A1

公开(公告)日：2005-11-10

申请号：US11178423

申请日：2005-07-12

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

公开(公告)号：US06946306B2

公开(公告)日：2005-09-20

申请号：US10983689

申请日：2004-11-09

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

摘要翻译： 公开了一种制造半导体器件的方法，该半导体器件能够减少制造步骤的数量并实现制造线的合理化。 半导体器件是通过在检查后将芯片部件（22）和半导体芯片（21）安装到形成在矩阵基板（27）上的每个布线基板（2）上而组装的高频模块。 作为在矩阵基板（27）的检查中被判断为有缺陷的块，在布线基板（2）上附着缺陷标记（2e），然后在一系列后续的组装步骤中识别缺陷标记（e） 并且省略其上具有缺陷标记（2e）的布线基板（2）的组装工作以实现生产线的合理化。

公开(公告)号：US06852553B2

公开(公告)日：2005-02-08

申请号：US10129305

申请日：2001-02-15

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16 ,  H01L21/00 ,  H01L21/44

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

摘要翻译： 公开了一种制造半导体器件的方法，该半导体器件能够减少制造步骤的数量并实现制造线的合理化。 半导体器件是通过在检查后将芯片部件（22）和半导体芯片（21）安装到形成在矩阵基板（27）上的每个布线基板（2）上而组装的高频模块。 作为在矩阵基板（27）的检查中被判定为有缺陷的块，在布线基板（2）上附着有缺陷标记（2e），然后在一系列后续的组装步骤中识别缺陷标记（e） 省略了具有缺陷标记（2e）的布线基板（2）的组装工作，以实现生产线的合理化。

公开(公告)号：US20050064612A1

公开(公告)日：2005-03-24

申请号：US10983689

申请日：2004-11-09

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

摘要翻译： 公开了一种制造半导体器件的方法，该半导体器件能够减少制造步骤的数量并实现制造线的合理化。 半导体器件是通过在检查后将芯片部件（22）和半导体芯片（21）安装到形成在矩阵基板（27）上的每个布线基板（2）上而组装的高频模块。 作为在矩阵基板（27）的检查中被判定为有缺陷的块，在布线基板（2）上附着有缺陷标记（2e），然后在一系列后续的组装步骤中识别缺陷标记（e） 省略了具有缺陷标记（2e）的布线基板（2）的组装工作，以实现生产线的合理化。

公开(公告)号：US09306137B2

公开(公告)日：2016-04-05

申请号：US14395151

申请日：2012-08-09

申请人： Susumu Takada ,  Emi Kuraseko ,  Motoyuki Suzuki

发明人： Susumu Takada ,  Emi Kuraseko ,  Motoyuki Suzuki

IPC分类号： H01L33/58 ,  H01L33/22 ,  C30B33/08 ,  B32B37/00 ,  B32B38/10 ,  H01L33/00

CPC分类号： H01L33/58 ,  B32B37/025 ,  B32B38/10 ,  B32B2310/0831 ,  B32B2323/00 ,  B32B2333/00 ,  B32B2361/00 ,  B32B2379/08 ,  B32B2457/20 ,  C30B33/08 ,  H01L33/005 ,  H01L33/22 ,  H01L2933/0058

摘要： A method of producing the crystalline substrate having a concave-convex structure includes: (A) forming a transfer film by forming a concave-convex film on a support film on the surface having a concave-convex pattern thereon so that thickness of the residual film of the concave-convex film is 0.01 to 1 μm, the concave-convex pattern of the support film having concave parts with a width of 0.05 to 100 μm, a depth of 0.05 to 10 μm, and a ratio of the depth of the concave part to the width of the concave part of up to 1.5, (B) disposing the transfer film on the crystalline substrate, and transferring the concave-convex film onto the crystalline substrate to produce a crystalline substrate having the concave-convex film thereon, (C) etching the crystalline substrate having the concave-convex film thereon to form a concave-convex structure on the surface of a crystalline substrate.

摘要翻译： 制造具有凹凸结构的结晶性基板的方法包括：（A）通过在其上具有凹凸图案的表面上的支撑膜上形成凹凸膜形成转印膜，使得残留膜的厚度 所述凹凸膜的凹凸图案为0.01〜1μm，所述支撑膜的凹凸图案的凹部的宽度为0.05〜100μm，深度为0.05〜10μm，所述凹部的深度 （B）将转印膜设置在结晶基板上，将凹凸膜转印到结晶基板上，制作具有凹凸膜的结晶性基板，（ C）蚀刻其上具有凹凸膜的晶体衬底，以在晶体衬底的表面上形成凹凸结构。

公开(公告)号：US20150097204A1

公开(公告)日：2015-04-09

申请号：US14395151

申请日：2012-08-09

申请人： Susumu Takada ,  Emi Kuraseko ,  Motoyuki Suzuki

发明人： Susumu Takada ,  Emi Kuraseko ,  Motoyuki Suzuki

IPC分类号： H01L33/58 ,  B32B38/10 ,  B32B37/00

CPC分类号： H01L33/58 ,  B32B37/025 ,  B32B38/10 ,  B32B2310/0831 ,  B32B2323/00 ,  B32B2333/00 ,  B32B2361/00 ,  B32B2379/08 ,  B32B2457/20 ,  C30B33/08 ,  H01L33/005 ,  H01L33/22 ,  H01L2933/0058

摘要： A method of producing the crystalline substrate having a concave-convex structure includes: (A) forming a transfer film by forming a concave-convex film on a support film on the surface having a concave-convex pattern thereon so that thickness of the residual film of the concave-convex film is 0.01 to 1 μm, the concave-convex pattern of the support film having concave parts with a width of 0.05 to 100 μm, a depth of 0.05 to 10 μm, and a ratio of the depth of the concave part to the width of the concave part of up to 1.5, (B) disposing the transfer film on the crystalline substrate, and transferring the concave-convex film onto the crystalline substrate to produce a crystalline substrate having the concave-convex film thereon, (C) etching the crystalline substrate having the concave-convex film thereon to form a concave-convex structure on the surface of a crystalline substrate.

摘要翻译： 制造具有凹凸结构的结晶性基板的方法包括：（A）通过在其上具有凹凸图案的表面上的支撑膜上形成凹凸膜形成转印膜，使得残留膜的厚度 所述凹凸膜的凹凸图案为0.01〜1μm，所述支撑膜的凹凸图案的凹部的宽度为0.05〜100μm，深度为0.05〜10μm，所述凹部的深度 （B）将转印膜设置在结晶基板上，将凹凸膜转印到结晶基板上，制作具有凹凸膜的结晶性基板，（ C）蚀刻其上具有凹凸膜的晶体衬底，以在晶体衬底的表面上形成凹凸结构。

公开(公告)号：US06938494B2

公开(公告)日：2005-09-06

申请号：US10750779

申请日：2004-01-02

申请人： Susumu Takada ,  Keiichi Furuya

发明人： Susumu Takada ,  Keiichi Furuya

IPC分类号： G01N3/02 ,  G01N3/00 ,  G01N3/32 ,  G01N3/34 ,  G01B5/30 ,  G01B7/16 ,  G01L1/00

CPC分类号： G01N3/32 ,  G01N2203/0005 ,  G01N2203/0048 ,  G01N2203/0073

摘要： A load test machine includes a base block, at least a pair of posts rising from the base block, a cross head spanning between the pair of posts, and an actuator mounted on the base block or the cross head. The actuator is able to apply a load on a test piece positioned between the cross head and the base block. The cross head is secured to each of the posts via an elastic member, and the elastic member is constructed to be changeable in its jointing position with the cross head or with each of the posts to change a resonance frequency of the test machine.

摘要翻译： 负载测试机包括基座，至少一对从基座上升的柱，横跨在该对柱之间的十字头，以及安装在基座或十字头上的致动器。 执行器能够将负载施加在位于十字头和基座之间的测试件上。 十字头通过弹性构件固定到每个柱上，并且弹性构件被构造成可以与十字头或每个柱的接合位置改变以改变试验机的共振频率。

公开(公告)号：US06890664B2

公开(公告)日：2005-05-10

申请号：US10380322

申请日：2001-09-10

申请人： Shingo Kaburagi ,  Yoshikazu Uda ,  Susumu Takada ,  Hideo Kawai

发明人： Shingo Kaburagi ,  Yoshikazu Uda ,  Susumu Takada ,  Hideo Kawai

IPC分类号： B23B49/00 ,  B23B35/00 ,  B23B41/00 ,  C10M105/14 ,  C10M107/26 ,  C10M107/34 ,  C10M107/38 ,  C10N20/04 ,  C10N40/22 ,  H05K3/00 ,  B32B15/08

CPC分类号： H05K3/0047 ,  B23B35/005 ,  B23B2250/12 ,  H05K2203/0152 ,  H05K2203/0214 ,  H05K2203/0786 ,  H05K2203/127 ,  Y10T408/03 ,  Y10T428/12292 ,  Y10T428/12736 ,  Y10T428/26 ,  Y10T428/31681 ,  Y10T428/31692

摘要： An entry board for use in drilling small holes in boards: the entry board comprises a lubricant layer of a mixture of a polyethylene glycol having an average molecular weight of at least 3000 to less than 10000, a polyethylene glycol having an average molecular weight of at least 10000 and trimethylolpropane formed over at least one surface of an aluminum base board with an undercoat layer of a partially saponified product of polyvinyl acetate provided between the lubricant layer and the base board. The partially saponified polyvinyl acetate has a degree of saponified 15 to 70 mole % and has an average molecular weight of 9000 to 50000. The adhesion of the lubricant layer to the base board is excellent, and the lubricant layer prevents cracking.

摘要翻译： 一种用于在板上钻小孔的入口板：入口板包括平均分子量为至少3000至小于10000的聚乙二醇的混合物的润滑剂层，平均分子量为 在铝基板的至少一个表面上形成至少10000个和三羟甲基丙烷，其具有设置在润滑剂层和基板之间的聚乙酸乙烯酯的部分皂化产物的底涂层。 部分皂化的聚乙酸乙烯酯的皂化度为15〜70摩尔％，平均分子量为9000〜50000。润滑剂层与基板的粘合性优异，润滑层防止开裂。

公开(公告)号：US5677305A

公开(公告)日：1997-10-14

申请号：US418196

申请日：1995-04-07

申请人： Susumu Takada ,  Nobuo Chomei ,  Makoto Adachi ,  Masami Eigyo ,  Kazuo Kawasaki

发明人： Susumu Takada ,  Nobuo Chomei ,  Makoto Adachi ,  Masami Eigyo ,  Kazuo Kawasaki

IPC分类号： C07D401/04 ,  C07D241/36 ,  A01N43/60 ,  C07D241/38

CPC分类号： C07D401/04

摘要： An oxopyridinylquinoxaline derivative represented by the following Formula I or pharmaceutically acceptable salts thereof: ##STR1## wherein R.sup.1 is hydrogen, halogen, nitro, or trihalomethyl; R.sup.2 is hydrogen, halogen, nitro, cyano, trihalomethyl, carbamoyl, carbamoyl substituted with lower alkyl, sulfamoyl, or sulfamoyl substituted with lower alkyl; R.sup.3 is hydrogen, nitro, or halogen; R.sup.4 is hydrogen, lower alkyl, substituted lower alkyl, lower cycloalkyl, or substituted lower cycloalkyl; R.sup.5 's are substituents independently selected from the group consisting of halogen, nitro, cyano, lower alkyl, carbamoyl, and carbamoyl substituted with lower alkyl; and n is an integer of 0 to 4. The derivative works as an antagonistic agent against both the NMDA receptors and the AMPA receptors, so that it is effective as a therapeutic agent for neurological disorders caused by excitatory amino acids binding to the receptors.

摘要翻译： 由下式I表示的氧代吡啶基喹喔啉衍生物或其药学上可接受的盐：其中R 1是氢，卤素，硝基或三卤代甲基; R2是氢，卤素，硝基，氰基，三卤甲基，氨基甲酰基，被低级烷基取代的氨基甲酰基，氨磺酰基或被低级烷基取代的氨磺酰基; R3是氢，硝基或卤素; R4是氢，低级烷基，取代的低级烷基，低级环烷基或取代的低级环烷基; R 5是独立地选自卤素，硝基，氰基，低级烷基，氨基甲酰基和被低级烷基取代的氨基甲酰基的取代基。 并且n为0至4的整数。该衍生物作为对NMDA受体和AMPA受体的拮抗剂起作用，因此其作为由与受体结合的兴奋性氨基酸引起的神经障碍的治疗剂是有效的。

公开(公告)号：US4801106A

公开(公告)日：1989-01-31

申请号：US74030

申请日：1987-07-16

申请人： Heijiro Kawakami ,  Yasunobu Kawaguchi ,  Kozo Katsube ,  Mamoru Murahashi ,  Susumu Takada

发明人： Heijiro Kawakami ,  Yasunobu Kawaguchi ,  Kozo Katsube ,  Mamoru Murahashi ,  Susumu Takada

IPC分类号： B21F35/00 ,  B21C47/10 ,  B21F3/00 ,  B21F3/02 ,  B21F23/00 ,  B65H55/00 ,  F16F1/04

CPC分类号： B21F3/02 ,  B21F3/00 ,  F16F1/043

摘要： A coil of tapered wire for forming coil springs, formed by winding substantially in concentric loops a quench-hardened and tempered tapered wire having a successive arrangement of tapered wire segments each consisting of a thick section, two thin sections and two tapered sections connecting the thin sections to the opposite ends of the thick section, respectively. The tapered wire is subjected to a preforming action immediately before being wound in loops on a winding drum, to form plastic bends in the thick sections and plastic bends of a radius of curvature greater than that of the plastic bends in the thick sections so that the tapered wire is wound in substantially uniform, concentric circular loops on a winding drum. When the tapered wire is unwound from the coil and is subjected to a straightening process of a fixed straightening arrangement of a series of straightener rollers before being coiled in tapered wire coil springs on a coil spring forming mill, the thick sections undergo a straightening action greater than that acts on the thin sections, so that which the tapered wire unwound from the coil of tapered wire is straightened in a substantially straight tapered wire and thereby the tapered wire is coiled in tapered wire coil springs having a correct size and a uniform shape.