公开(公告)号：US20070070608A1

公开(公告)日：2007-03-29

申请号：US11242431

申请日：2005-09-29

申请人： Robert Warren ,  Steve Liang ,  Tony LoBianco ,  Gene Gan

发明人： Robert Warren ,  Steve Liang ,  Tony LoBianco ,  Gene Gan

IPC分类号： H05K7/00

CPC分类号： H01L25/0657 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/30107 ,  H05K1/144 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic module and a process for forming an electronic module are provided. Uniform and sealed air gaps are formed in a vertical direction between two or more electronic devices. The uniform and sealed air gaps are formed by arranging spacers between the electronic devices, where the height of the spacers is selected depending upon the operating characteristics of the particular type of electronic devices.

摘要翻译： 提供了电子模块和用于形成电子模块的工艺。 在两个或更多个电子设备之间沿垂直方向形成均匀和密封的气隙。 均匀和密封的气隙通过在电子设备之间布置间隔件而形成，其中间隔件的高度根据特定类型的电子设备的操作特性来选择。

公开(公告)号：US20080003761A1

公开(公告)日：2008-01-03

申请号：US11899926

申请日：2007-09-07

申请人： Qing Gan ,  Robert Warren ,  Anthony Lobianco ,  Steve Liang

发明人： Qing Gan ,  Robert Warren ,  Anthony Lobianco ,  Steve Liang

IPC分类号： H01L21/20

CPC分类号： H01L23/49822 ,  B81C1/00269 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16235 ,  H01L2224/2746 ,  H01L2224/29011 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32235 ,  H01L2224/73103 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.

摘要翻译： 根据示例性实施例，晶片级封装包括包括至少一个器件晶片接触焊盘和器件的器件晶片，并且其中所述至少一个器件晶片接触焊盘电连接到所述器件。 晶片级封装包括位于器件晶片上方的第一聚合物层。 晶片级封装包括位于第一聚合物层之上并具有第一端子和第二端子的至少一个无源部件。 所述至少一个无源部件的第一端子电连接到所述至少一个器件晶片接触焊盘。 晶片级封装包括位于至少一个无源部件上的第二聚合物层。 晶片级封装包括位于第二聚合物层之上并电连接至至少一个无源元件的第二端子的至少一个聚合物层接触焊盘。

公开(公告)号：US20060220173A1

公开(公告)日：2006-10-05

申请号：US11097646

申请日：2005-04-01

申请人： Qing Gan ,  Robert Warren ,  Anthony Lobianco ,  Steve Liang

发明人： Qing Gan ,  Robert Warren ,  Anthony Lobianco ,  Steve Liang

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L23/49822 ,  B81C1/00269 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16235 ,  H01L2224/2746 ,  H01L2224/29011 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32235 ,  H01L2224/73103 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： According to an exemplary embodiment, a wafer level package includes a device wafer including at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The wafer level package includes a first polymer layer situated over the device wafer. The wafer level package includes at least one passive component situated over the first polymer layer and having a first terminal and a second terminal. The first terminal of the at least one passive component is electrically connected to the at least one device wafer contact pad. The wafer level package includes a second polymer layer situated over the at least one passive component. The wafer level package includes at least one polymer layer contact pad situated over the second polymer layer and electrically connected to the second terminal of the at least one passive component.