摘要:
A supporting device having improved assembly efficiency used to commonly support a washing machine and a drying machine with legs having different sizes, and a washing machine having the same. The supporting device includes a supporting device main body to support a washing machine main body, and supporters installed on the supporting device main body to receive and fix legs connected to the bottom of the washing machine main body, and each supporter includes a guide member to receive each leg, and at least one fixing member to fix each leg.
摘要:
The present invention relates to a vibration reduction device of a muffler tail-pipe for construction equipment, comprising: an engine hood provided to one side of an engine room for the protection of the peripheral parts including an engine and a muffler, and having a through hole at one side of the top surface thereof; the muffler provided to the lower portion of the engine hood in a state where the muffler is connected to one side of the engine; a tail-pipe of which one end is connected to the muffler and the other end is protruded to the outside by penetrating the through hole of the engine hood; and a plurality of elastic support parts for fixing the tail-pipe such that the tail-pipe is elastically supported by the engine hood. The present invention can maximally reduce the vibration transmitted to the tail-pipe by the elastic support means when the tail-pipe vibrates with the muffler due to the vibration of the muffler by the engine, as the tail-pipe connected to the muffler is elastically supported from the engine hood through the elastic support parts. Therefore, the present invention can solve the problem of the connection portion of the muffler and the tail-pipe being easily deformed or damaged by the concentration of the stress to the connection portion of the muffler and the tail-pipe as the tail-pipe vibrates with the muffler according to the vibration of the muffler.
摘要:
Disclosed is a catalyst which can convert ammonia contained in exhaust gas from an engine of a vehicle equipped with a Urea-SCR (Urea-Selective Catalytic Reduction) system, to nitrogen, and a method for preparating the same. The catalyst can convert ammonia which is failed to participate in a conversion reaction of NOx to N2 and slipped out of the SCR catalyst, to nitrogen via a SCO (Selective Catalytic Oxidation) reaction, before the ammonia is released to the air.
摘要:
Disclosed is a catalyst which can convert ammonia contained in exhaust gas from an engine of a vehicle equipped with a Urea-SCR (Urea-Selective Catalytic Reduction) system, to nitrogen, and a method for preparating the same. The catalyst can convert ammonia which is failed to participate in a conversion reaction of NOx to N2 and slipped out of the SCR catalyst, to nitrogen via a SCO (Selective Catalytic Oxidation) reaction, before the ammonia is released to the air.
摘要:
A flexible liquid crystal display device includes a first flexible substrate having a display region and a non-display region at a periphery of the display region; an organic electroluminescent diode including a first electrode on the first flexible substrate, an organic emitting layer on the first electrode and a second electrode on the organic emitting layer, wherein each of the first electrode, the organic emitting layer and the second electrode covering an entire surface of the display region; a buffer layer on the organic electroluminescent diode; a gate line on the buffer layer; a data line over the buffer layer and crossing the gate line to define a pixel region at the display region; a thin film transistor connected to the gate and data lines; a pixel electrode connected to the thin film transistor; a second flexible substrate facing the first flexible substrate; a common electrode on the second flexible substrate; and a liquid crystal layer between the pixel and common electrodes.
摘要:
Provided is a capacitor-less DRAM device including: an insulating layer formed on a semiconductor substrate; a silicon layer formed on the insulating layer, wherein a trench is formed inside the silicon layer; and an offset spacer formed on both sidewalls of the trench and protruded upward through the silicon layer. A gate insulating layer is formed on a bottom of the trench, and a gate electrode is formed to be buried in the gate insulating layer and in the trench and the offset spacer. A source region and a drain region are formed in the silicon layer on both sides of the offset spacer so as not to overlap with the gate electrode. A channel region is formed in the silicon layer below the gate insulating layer to be self-aligned with the gate electrode.
摘要:
Semiconductor devices include a semiconductor substrate with a stack structure protruding from the semiconductor substrate and surrounded by an isolation structure. The stack structure includes an active layer pattern and a gap-filling insulation layer between the semiconductor substrate and the active layer pattern. A gate electrode extends from the isolation structure around the stack structure. The gate electrode is configured to provide a support structure for the active layer pattern. The gate electrode may be a gate electrode of a silicon on insulator (SOI) device formed on the semiconductor wafer and the semiconductor device may further include a bulk silicon device formed on the semiconductor substrate in a region of the semiconductor substrate not including the gap-filing insulation layer.
摘要:
Exposed are a semiconductor device and method of fabricating the same. The device includes an insulation film that is disposed between an active pattern and a substrate, which provides various improvements. This structure enhances the efficiency of high integration and offers an advanced structure for semiconductor devices.
摘要:
In a method of manufacturing a semiconductor device including a planar type transistor and a fin type transistor, a substrate having a first region and a second region is partially to form an isolation trench defining an isolation region and an active region. An insulation layer liner is formed on sidewalls of the isolation trench in the first region and the second region. An isolation layer fills an inner portion of the isolation trench. The insulation layer liner is partially removed to expose an upper surface of the substrate in the gate region of the first region, and an upper surface and sidewalls of the substrate in the gate region of the second region. A gate oxide layer and a gate electrode are formed on the exposed substrate.