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    Method and device for vacuum-coating a substrate
    1.
    发明授权
    Method and device for vacuum-coating a substrate 有权
    用于真空涂覆基材的方法和装置

    公开(公告)号：US06372303B1

    公开(公告)日：2002-04-16

    申请号：US09446054

    申请日：2000-04-05

    申请人： Kurt Burger ,  Thomas Weber ,  Johannes Voigt ,  Susanne Lucas

    发明人： Kurt Burger ,  Thomas Weber ,  Johannes Voigt ,  Susanne Lucas

    IPC分类号： C23C1626

    CPC分类号： C23C28/044 ,  C23C8/36 ,  C23C14/06 ,  C23C14/22 ,  C23C16/30 ,  C23C16/50 ,  C23C28/42 ,  Y10T428/24975 ,  Y10T428/265 ,  Y10T428/30

    摘要： A method is proposed for vacuum-coating a substrate using a plasma-CVD method. In order to control ion bombardment during the vacuum coating, a substrate voltage produced independently from a coating plasma is applied to the substrate. The substrate voltage is modified during the coating. The substrate voltage is a direct voltage that is pulsed in bipolar fashion with a frequency of 0.1 kHz to 10 MHz. A wear-resistant and friction-reducing multilayer structure of alternating hard material individual layers and carbon or silicon individual layers is proposed.

    摘要翻译： 提出了使用等离子体CVD法对基板进行真空镀膜的方法。 为了控制真空镀膜中的离子轰击，将独立于涂覆等离子体产生的基板电压施加到基板上。 衬底电压在涂层期间被修改。 衬底电压是以0.1kHz至10MHz的频率以双极方式脉冲的直流电压。 提出了一种耐磨和减摩的多层结构，交替硬质材料单层和碳或硅单层。

    Method and device for vacuum-coating a substrate
    2.
    发明授权
    Method and device for vacuum-coating a substrate 有权
    用于真空涂覆基材的方法和装置

    公开(公告)号：US07942111B2

    公开(公告)日：2011-05-17

    申请号：US11008413

    申请日：2004-12-09

    申请人： Kurt Burger ,  Thomas Weber ,  Johannes Voigt ,  Susanne Lucas

    发明人： Kurt Burger ,  Thomas Weber ,  Johannes Voigt ,  Susanne Lucas

    IPC分类号： C23C14/00 ,  C23C16/00

    CPC分类号： C23C28/044 ,  C23C8/36 ,  C23C14/06 ,  C23C14/22 ,  C23C16/30 ,  C23C16/50 ,  C23C28/42 ,  Y10T428/24975 ,  Y10T428/265 ,  Y10T428/30

    摘要： A method is proposed for vacuum-coating a substrate using a plasma-CVD method. In order to control ion bombardment during the vacuum coating, a substrate voltage, produced independently from a coating plasma, is applied to the substrate. The substrate voltage is modified during the coating. The substrate voltage is a direct voltage that is pulsed in bipolar fashion with a frequency of 0.1 kHz to 10 MHz. A wear-resistant and friction-reducing multilayer structure of alternating hard material individual layers and carbon or silicon individual layers is proposed.

    摘要翻译： 提出了使用等离子体CVD法对基板进行真空镀膜的方法。 为了控制真空镀膜中的离子轰击，将独立于涂布等离子体生产的基板电压施加到基板上。 衬底电压在涂层期间被修改。 衬底电压是以0.1kHz至10MHz的频率以双极方式脉冲的直流电压。 提出了一种耐磨和减摩的多层结构，交替硬质材料单层和碳或硅单层。

    Method for coating surfaces using a facility having sputter electrodes
    5.
    发明授权
    Method for coating surfaces using a facility having sputter electrodes 失效
    使用具有溅射电极的设备涂覆表面的方法

    公开(公告)号：US06171454B2

    公开(公告)日：2001-01-09

    申请号：US09308476

    申请日：1999-09-16

    申请人： Thomas Weber ,  Johannes Voigt ,  Susanne Lucas

    发明人： Thomas Weber ,  Johannes Voigt ,  Susanne Lucas

    IPC分类号： C23C1434

    CPC分类号： C23C16/517 ,  C23C14/0036 ,  C23C14/0057

    摘要： Described is a method for coating surfaces using a facility having sputtering electrodes, which has at least two electrodes that are spaced apart from one another and arranged inside a process chamber, and an inlet for a process gas. The two sputtering electrodes are acted upon by a bipolarly pulsed voltage in such a way that they are alternately operated as cathodes and as anodes. In addition, the frequency of the voltage is set between 1 kHz and 1 MHz. Furthermore, and that the operating parameters are selected in such a way that in operation, the electrodes are at least partially covered by a coating material.

    摘要翻译： 描述了使用具有溅射电极的设备来涂覆表面的方法，该溅射电极具有彼此间隔开并且布置在处理室内的至少两个电极和处理气体的入口。 两个溅射电极通过双极脉冲电压作用，使得它们交替地作为阴极和阳极操作。 此外，电压的频率设定在1kHz和1MHz之间。 此外，并且以这样的方式选择操作参数，使得在操作中电极至少部分地被涂层材料覆盖。