公开(公告)号：US08368099B2

公开(公告)日：2013-02-05

申请号：US12182218

申请日：2008-07-30

申请人： Chien-Chun Lu ,  Chia-Tai Kuo ,  Chen-Peng Hsu ,  Hung-Lieh Hu ,  Chien-Jen Sun

发明人： Chien-Chun Lu ,  Chia-Tai Kuo ,  Chen-Peng Hsu ,  Hung-Lieh Hu ,  Chien-Jen Sun

IPC分类号： H01L33/00

CPC分类号： H01L33/505 ,  H01L33/508 ,  H01L33/60 ,  H01L2924/0002 ,  H05B33/10 ,  H01L2924/00

摘要： A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.

摘要翻译： 描述了发光器件及其制造方法。 发光器件包括衬底，发光芯片，管状结构和荧光转换层。 管状结构形成在基板的表面上。 发光芯片设置在基板的表面上并被管状结构包围。 荧光转换层设置在管状结构中并覆盖发光芯片。 发光芯片上的荧光转换层的最大垂直厚度与最大水平厚度的比率为0.1至10.通过使用管状结构来控制光线穿过荧光转换层的距离，因此 为了解决现有技术的问题，荧光粉末涂布包装技术导致发出的光的不均匀的色温。

公开(公告)号：US20120139089A1

公开(公告)日：2012-06-07

申请号：US13005084

申请日：2011-01-12

申请人： CHUNG-ER HUANG ,  MING-TAI KUO

发明人： CHUNG-ER HUANG ,  MING-TAI KUO

IPC分类号： H01L23/552 ,  H01L21/50

CPC分类号： H01L21/561 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00

摘要： A module IC package structure includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one elastic conductive element disposed on the circuit substrate, and the elastic conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the elastic conductive element, and the elastic conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion.

摘要翻译： 模块IC封装结构包括基板单元，电子单元，导电单元，封装单元和屏蔽单元。 基板单元包括具有至少一个接地垫的电路基板。 电子单元包括电连接到电路基板的多个电子元件。 导电单元包括设置在电路基板上的至少一个弹性导电元件，弹性导电元件具有电连接到接地垫的第一端部。 封装单元包括设置在电路基板上以覆盖电子元件和弹性导电元件的一部分的封装树脂体，并且具有第二端部的弹性导电元件从封装树脂体露出。 屏蔽单元包括形成在封装树脂体的外表面上以电接触第二端部的金属屏蔽层。

公开(公告)号：US07965934B2

公开(公告)日：2011-06-21

申请号：US12433945

申请日：2009-05-01

申请人： Tai-Kuo Wang ,  Wen-Chi Wang ,  Julian Lin

发明人： Tai-Kuo Wang ,  Wen-Chi Wang ,  Julian Lin

IPC分类号： G03B17/00

CPC分类号： G03B17/00 ,  Y10T74/18688

摘要： A switching mechanism for a camera device includes a driving device, a first screw bar connecting to the driving device, a second screw bar connecting to the first screw bar, and a lead screw having an end coupled with the second screw bar. The first screw bar is driven by the driving device via a screw thread thereof, and the second screw bar is driven by the first screw bar via a screw thread thereof, thereby driving the lead screw for rotation. The screw nut is disposed on the lead screw and moved back and forth via the rotation of the lead screw. Two stop blocks disposed at two ends of the lead screw respectively are to limit two positions of the moved screw nut while the screw nut is moved beyond a threaded area of the lead screw, upon which time the screw nut is slightly engaged with the lead screw.

摘要翻译： 用于相机装置的切换机构包括驱动装置，连接到驱动装置的第一螺杆，连接到第一螺杆的第二螺杆和具有与第二螺杆连接的端部的导螺杆。 第一螺杆通过其螺纹由驱动装置驱动，第二螺杆由第一螺杆经由其螺纹驱动，从而驱动丝杠旋转。 丝杠螺母设置在导螺杆上，并通过导螺杆的旋转来回移动。 分别设置在导螺杆的两端的两个止动块分别限制了移动的螺母的两个位置，同时螺母被移动超过导螺杆的螺纹区域，此时螺母与导螺杆稍微接合 。

公开(公告)号：US20110007206A1

公开(公告)日：2011-01-13

申请号：US12499268

申请日：2009-07-08

申请人： Tai-Kuo Wang ,  Wen-Chi Wang ,  Julian Lin

发明人： Tai-Kuo Wang ,  Wen-Chi Wang ,  Julian Lin

IPC分类号： H04N5/225

CPC分类号： H04N5/2254 ,  G02B26/007

摘要： A switching mechanism for a video camera includes: a control unit; a driving device connected with and controlled by the control unit; a first belt pulley connected with the driving device; a second belt pulley smaller than the first belt pulley in diameter; a belt looped around the first and second belt pulleys for power transmission, and including a first protuberance; a translation member provided with a second protuberance so that through a loose fitting connection between the two protuberances, the translation member is driven to move; and a positioning element having a positioning plane, at least two inclines, and at least two top surfaces, wherein the positioning plane and the at least two inclines are designed to contact the second protuberance of the translation member alternately so as to restrict and reposition the translation member.

摘要翻译： 一种用于摄像机的切换机构包括：控制单元; 与控制单元连接并由控制单元控制的驱动装置; 与驱动装置连接的第一皮带轮; 直径小于第一皮带轮的第二皮带轮; 环绕所述第一和第二带轮的动力传递的带，并且包括第一突起; 翻译构件，其设置有第二突起，使得通过两个突起之间的松配合连接，平移构件被驱动移动; 以及具有定位平面，至少两个倾斜和至少两个顶表面的定位元件，其中所述定位平面和所述至少两个倾斜被设计成交替地接触所述平移构件的所述第二突起，以限制和重新定位 翻译会员

公开(公告)号：US07833028B1

公开(公告)日：2010-11-16

申请号：US12711372

申请日：2010-02-24

申请人： Chung-er Huang ,  Ming-Tai Kuo

发明人： Chung-er Huang ,  Ming-Tai Kuo

IPC分类号： H01R13/44

CPC分类号： H04B1/3816 ,  H01R2201/06 ,  H05K5/023 ,  H05K5/0278

摘要： A wireless receiving and transmitting device includes a casing unit, an antenna unit, a substrate unit, a projection unit and an electrical connector unit. The casing unit has a casing. The antenna unit has an antenna module fixed in the casing. The substrate unit has a circuit substrate movably disposed in the casing and electrically connected to the antenna module. The projection unit has a projection element positioned on one end of the circuit substrate. The projection element has a bottom portion selectively exposed outside the casing or hidden in the casing according to the move of the circuit substrate, and the projection element has a top portion always exposed outside the casing. The electrical connector unit has an electrical connector position on another end of the circuit substrate, and the electrical connector is selectively exposed outside the casing or hidden in the casing.

摘要翻译： 无线接收和发送装置包括壳体单元，天线单元，基板单元，投影单元和电连接器单元。 壳体单元具有壳体。 天线单元具有固定在壳体中的天线模块。 基板单元具有可移动地设置在壳体中并电连接到天线模块的电路基板。 投影单元具有位于电路基板一端的投影元件。 突起元件具有根据电路基板的移动而选择性地暴露在壳体外部或隐藏在壳体中的底部，并且突起元件具有总是暴露在壳体外部的顶部。 电连接器单元在电路基板的另一端具有电连接器位置，并且电连接器选择性地暴露在壳体外部或隐藏在壳体中。

公开(公告)号：US07829390B2

公开(公告)日：2010-11-09

申请号：US12292497

申请日：2008-11-20

申请人： Chung-Er Huang ,  Ming-Tai Kuo

发明人： Chung-Er Huang ,  Ming-Tai Kuo

IPC分类号： H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

摘要翻译： SIP（包装系统）的包装结构的制造方法包括以下步骤。 第一步是提供其上具有电子器件的衬底。 第二步是通过模塑料和导电聚合物前体的混合物覆盖电子器件，以形成模制结构，其中基片，电子器件和模制结构形成集体电子模块。 第三步是将集体电子模块分成多个单独的电子模块。 第四步是通过使用用于将混合物中的导电聚合物前体转化成模制结构表面附近的导电层的掺杂元件进行掺杂步骤。 因此，为了形成SIP模块的屏蔽结构，优化制造方法。

公开(公告)号：US20100123238A1

公开(公告)日：2010-05-20

申请号：US12292497

申请日：2008-11-20

申请人： Chung-Er Huang ,  Ming-Tai Kuo

发明人： Chung-Er Huang ,  Ming-Tai Kuo

IPC分类号： H01L21/50 ,  H01L23/28

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/552 ,  H01L23/66 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

摘要翻译： SIP（包装系统）的包装结构的制造方法包括以下步骤。 第一步是提供其上具有电子器件的衬底。 第二步是通过模塑料和导电聚合物前体的混合物覆盖电子器件，以形成模制结构，其中基片，电子器件和模制结构形成集体电子模块。 第三步是将集体电子模块分成多个单独的电子模块。 第四步是通过使用用于将混合物中的导电聚合物前体转化成模制结构表面附近的导电层的掺杂元件进行掺杂步骤。 因此，为了形成SIP模块的屏蔽结构，优化制造方法。

公开(公告)号：US20100055840A1

公开(公告)日：2010-03-04

申请号：US12230531

申请日：2008-08-29

申请人： Chung-Er Huang ,  Ming-Tai Kuo

发明人： Chung-Er Huang ,  Ming-Tai Kuo

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： H05K1/144 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/187 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/403 ,  H05K2203/1316 ,  H01L2924/00

摘要： A packaging structure includes a main substrate having a plurality of circuit lines thereon, and an electronic module having at least one conductive pad at the bottom thereof and having a plurality of conductive lines on the sides thereof. The pad and the conductive circuits are connected electrically to the circuits on the main substrate when the electronic module is disposed on the main substrate. As above-mentioned, one electronic module can be stacked on top of another so that the integrity of the packaging structure is improved.

公开(公告)号：US20080218093A1

公开(公告)日：2008-09-11

申请号：US12149852

申请日：2008-05-09

申请人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

发明人： Ming-Te Lin ,  Fei-Chang Hwang ,  Chia-Tai Kuo

IPC分类号： H05B37/02 ,  H05B41/24

CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

摘要翻译： 具有设置在芯片上的至少一个AC LED微管芯单元形成的具有AC环路（AC LED管芯的结构）的发光二极管（LED）裸片的结构。 交流LED微型模具的单元包括两个彼此相反取向并且彼此并联连接的LED微型模具，可以施加交流电源，使得LED单元响应于正向连续地发光 - 交流电源中的一次波电压和一个负半波电压。 由于每个AC LED微型裸片都是正向运行的，所以AC LED芯片的结构也提供了防止静电荷（ESD）的保护，并且可以在高电压下工作。

公开(公告)号：US5760484A

公开(公告)日：1998-06-02

申请号：US798560

申请日：1997-02-11

申请人： Chang-Hsun Lee ,  Fu-Cheng Lin ,  Chen-Tai Kuo

发明人： Chang-Hsun Lee ,  Fu-Cheng Lin ,  Chen-Tai Kuo

IPC分类号： G03F9/00 ,  H01L23/544

CPC分类号： G03F9/70 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2924/0002

摘要： An alignment mark for increasing the accuracy of an alignment includes a cross pattern, two horizontal line patterns having serrated shape. The cross pattern is typically formed over a scribe line for alignment in semiconductor process. The cross pattern includes a vertical line and a horizontal line. The vertical line is vertical to the scribe line while the horizontal line is parallel to the scribe line. The horizontal patterns which are parallel to the scribe line are respectively connected to one end of the vertical line. The horizontal patterns have serrated patterns which are used to change the shape of a noise signal. The high of the serrated shape pattern is about 3 micro meters while the width of the serrated shape pattern is about 3 micro meters.

摘要翻译： 用于提高对准精度的对准标记包括交叉图案，具有锯齿形状的两个水平线图案。 交叉图案通常形成在划线上以用于半导体工艺中的对准。 交叉图案包括垂直线和水平线。 垂直线垂直于划线，而水平线平行于划线。 平行于划线的水平图案分别连接到垂直线的一端。 水平图案具有用于改变噪声信号形状的锯齿图案。 锯齿状形状图案的高度为约3微米，而锯齿形状图案的宽度为约3微米。