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公开(公告)号：US08595926B2
公开(公告)日：2013-12-03
申请号：US13046076
申请日：2011-03-11
申请人： Tetsuro Yamada , Takahiro Ooi , Yoshihiro Morita , Akiko Matsui , Misuhiko Sugane , Takahide Mukoyama
发明人： Tetsuro Yamada , Takahiro Ooi , Yoshihiro Morita , Akiko Matsui , Misuhiko Sugane , Takahide Mukoyama
IPC分类号： H05K3/02
摘要： A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.
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公开(公告)号：US20110241233A1
公开(公告)日：2011-10-06
申请号：US13073489
申请日：2011-03-28
申请人： Yoshihiro MORITA , Takahiro OOI , Tetsuro YAMADA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOUYAMA
发明人： Yoshihiro MORITA , Takahiro OOI , Tetsuro YAMADA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOUYAMA
IPC分类号： G02B6/04
CPC分类号： G02B6/138 , B29D11/00663 , G02B6/43
摘要： A method for manufacturing an optical waveguide in which multiple cores are embedded in a parallel-arranged fashion within a single cladding, the cores having a refractive index of light different from that of the cladding, the method includes forming the multiple cores in a state where the adjacent cores are connected by a rib, forming the cladding around the rib and the multiple cores by curing a cladding material there around, and a cutting to the rib.
摘要翻译： 一种制造光波导的方法，其中多个芯以平行布置的方式嵌入在单个包层内，所述芯具有与包层的折射率不同的光的折射率，所述方法包括在以下状态下形成多个芯： 相邻的芯通过肋连接，通过在其周围固化包层材料并切割到肋来在肋和多个芯周围形成包层。
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公开(公告)号：US08958211B2
公开(公告)日：2015-02-17
申请号：US13300701
申请日：2011-11-21
申请人： Yoshiyuki Hiroshima , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama , Tetsuro Yamada , Takahiro Ooi
发明人： Yoshiyuki Hiroshima , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama , Tetsuro Yamada , Takahiro Ooi
CPC分类号： H05K1/181 , H05K1/18 , H05K2201/099
摘要： An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.
摘要翻译： 一种电子设备包括一个包括多个端子的电子部件和一个安装有电子部件的电路板。 电路板包括板体，布置在板体上的多个电极焊盘，每个电极焊盘通过焊料连接到每个端子;第一阻焊剂，形成在电路板主体上，并具有多个第一开口 每个所述第一开口容纳每个所述电极焊盘;以及第二阻焊剂，形成在所述第一阻焊层上，并且具有多个第二开口，每个所述第二开口大于每个所述第一开口， 第一个开口。
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公开(公告)号：US08631568B2
公开(公告)日：2014-01-21
申请号：US13046076
申请日：2011-03-11
申请人： Tetsuro Yamada , Takahiro Ooi , Yoshihiro Morita , Akiko Matsui , Misuhiko Sugane , Takahide Mukoyama
发明人： Tetsuro Yamada , Takahiro Ooi , Yoshihiro Morita , Akiko Matsui , Misuhiko Sugane , Takahide Mukoyama
IPC分类号： H05K3/02
CPC分类号： H05K1/0245 , H05K1/0248 , H05K1/0269 , H05K1/0366 , H05K3/4638 , H05K2201/029 , H05K2201/09236 , H05K2201/0969 , H05K2203/167
摘要： A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.
摘要翻译： 一种印刷线路板的制造方法，其特征在于，以经纱和纬纱编织玻璃纤维布，使经纱和纬纱在至少一个区域上视觉区分。 玻璃纤维布被树脂浸渍以制造基材。 在基板的至少一个表面上形成铜箔以制造芯基板。 在芯基板上的区域内去除铜箔以形成开口。 检测出在经纱之间或介于纬纱之间的间距。 基于经纱之间或纬纱之间的间距来确定要被图案化的一对差动布线之间的间距。 根据所述一对差动配线之间的所确定的间距，在所述芯基板上图案化所述一对差分布线。
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5.发明申请PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD UNIT, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 审中-公开印刷线路板，印刷电路板单元，制造印刷电路板的电子设备及方法公开(公告)号：US20120234587A1
公开(公告)日：2012-09-20
申请号：US13414906
申请日：2012-03-08
申请人： Naoki NAKAMURA , Mitsuhiko SUGANE , Akiko MATSUI , Tetsuro YAMADA , Takahide MUKOYAMA , Yoshiyuki HIROSHIMA , Takahiro OOI
发明人： Naoki NAKAMURA , Mitsuhiko SUGANE , Akiko MATSUI , Tetsuro YAMADA , Takahide MUKOYAMA , Yoshiyuki HIROSHIMA , Takahiro OOI
CPC分类号： H05K3/429 , H05K1/115 , H05K3/0047 , H05K2201/09581 , H05K2201/09845 , H05K2201/09854 , H05K2203/1572 , Y10T29/49126
摘要： A printed wiring board is disclosed that includes insulating layers, conductive layers stacked with the insulating layers alternately, a through hole penetrating the insulating layers and the conductive layers, a first plate resist part formed on a first portion of an inner wall of the through hole, the first portion being located from one end of the through hole to one of the conductive layers stacked between one pair of the insulating layers, and a plated part formed on a second portion of the inner wall of the through hole other than the first portion.
摘要翻译： 公开了一种印刷电路板，其包括绝缘层，交替地层叠有绝缘层的导电层，贯穿绝缘层和导电层的通孔，形成在通孔内壁的第一部分上的第一平板抗蚀部 所述第一部分从所述通孔的一端位于层叠在一对所述绝缘层之间的导电层之一之间，并且形成在除所述第一部分之外的所述通孔的内壁的第二部分上的电镀部 。
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公开(公告)号：US20120106105A1
公开(公告)日：2012-05-03
申请号：US13271171
申请日：2011-10-11
申请人： Mitsuhiko SUGANE , Takahide Mukoyama , Tetsuro Yamada , Yoshiyuki Hiroshima , Takahiro Ooi , Midori Kobayashi , Akiko Matsui
发明人： Mitsuhiko SUGANE , Takahide Mukoyama , Tetsuro Yamada , Yoshiyuki Hiroshima , Takahiro Ooi , Midori Kobayashi , Akiko Matsui
CPC分类号： H05K3/306 , H05K3/0047 , H05K3/421 , H05K2201/10303 , H05K2201/10424 , H05K2201/1059 , H05K2203/0207 , Y10T29/49139
摘要： A wiring board unit includes a connector having a plurality of terminals; and a wiring board on which the connector is mounted. The wiring board includes a first wiring pattern provided on a first wiring layer, a second wiring pattern provided on a second wiring layer at a position shallower than the first wiring layer, a first via formed in a first recess having a first depth, the first via being in contact with the first wiring pattern, and a second via formed in a second recess having a second depth that is smaller than the first depth, the second via being in contact with the second wiring pattern.
摘要翻译： 线路板单元包括具有多个端子的连接器; 以及其上安装有连接器的布线板。 布线基板包括设置在第一布线层上的第一布线图形，设置在比第一布线层浅的位置的第二布线层上的第二布线图案，形成在具有第一深度的第一凹部中的第一通孔， 通过与第一布线图形相接触，以及形成在第二凹部中的第二通孔，第二凹槽的第二深度小于第一深度，第二通孔与第二布线图案接触。
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公开(公告)号：US20110308842A1
公开(公告)日：2011-12-22
申请号：US13075865
申请日：2011-03-30
申请人： Yoshihiro MORITA , Takahiro OOI , Tetsuro YAMADA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOYAMA
发明人： Yoshihiro MORITA , Takahiro OOI , Tetsuro YAMADA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOYAMA
CPC分类号： H05K1/0366 , D03D1/0088 , D03D15/0011 , D03D15/0088 , D10B2401/18 , D10B2505/02 , H05K1/024 , H05K1/0245 , H05K1/0248 , H05K2201/029 , H05K2201/091 , H05K2203/0195 , Y10T29/49124
摘要： A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.
摘要翻译： 布线基板包括：绝缘层，包括热固性树脂和具有多个第一纤维束的加强件和编织在一起的多个第二纤维束，第二纤维束与第一纤维束相交，以及一对彼此并排设置的差动布线 在绝缘层上。 第一纤维束和第二纤维束在布置有一对差动布线的区域中相对于绝缘层的平面方向具有弯曲部分。
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公开(公告)号：US20110308840A1
公开(公告)日：2011-12-22
申请号：US13075838
申请日：2011-03-30
申请人： Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Tetsuro YAMADA , Mitsuhiko SUGANE , Takahide MUKOYAMA
发明人： Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Tetsuro YAMADA , Mitsuhiko SUGANE , Takahide MUKOYAMA
CPC分类号： H05K1/0248 , H05K1/024 , H05K1/0245 , H05K1/0269 , H05K1/0366 , H05K2201/029 , H05K2201/09272 , H05K2203/166 , H05K2203/167
摘要： A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.
摘要翻译： 布线基板包括差分布线; 与所述差分布线的一侧相邻的第一绝缘层，包括平行于所述差分布线的第一光纤束; 与所述差分布线的另一侧相邻的第二绝缘层，包括与所述差分布线平行并且以与所述第一纤维束相同的间距设置的第二纤维束; 在所述第一绝缘层上的与所述差分布线相反的一侧的第三绝缘层，包括与所述差分布线平行的第三纤维束; 以及在所述第二绝缘层上的与所述差分布线相反的一侧的第四绝缘层，包括与所述差分布线平行的第四纤维束。 第三和第四纤维束的间隔分别比第一和第二纤维束的间隔窄。 差分布线设置在相邻的第一纤维束之间以及相邻的第二纤维束之间。
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公开(公告)号：US20110232949A1
公开(公告)日：2011-09-29
申请号：US13046076
申请日：2011-03-11
申请人： Tetsuro YAMADA , Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Misuhiko SUGANE , Takahide MUKOYAMA
发明人： Tetsuro YAMADA , Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Misuhiko SUGANE , Takahide MUKOYAMA
CPC分类号： H05K1/0245 , H05K1/0248 , H05K1/0269 , H05K1/0366 , H05K3/4638 , H05K2201/029 , H05K2201/09236 , H05K2201/0969 , H05K2203/167
摘要： A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.
摘要翻译： 一种印刷线路板的制造方法，其特征在于，以经纱和纬纱编织玻璃纤维布，使经纱和纬纱在至少一个区域上视觉区分。 玻璃纤维布被树脂浸渍以制造基材。 在基板的至少一个表面上形成铜箔以制造芯基板。 在芯基板上的区域内去除铜箔以形成开口。 检测出在经纱之间或介于纬纱之间的间距。 基于经纱之间或纬纱之间的间距来确定要被图案化的一对差动布线之间的间距。 根据所述一对差动配线之间的所确定的间距，在所述芯基板上图案化所述一对差分布线。
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公开(公告)号：US09049794B2
公开(公告)日：2015-06-02
申请号：US13075865
申请日：2011-03-30
申请人： Yoshihiro Morita , Takahiro Ooi , Tetsuro Yamada , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama
发明人： Yoshihiro Morita , Takahiro Ooi , Tetsuro Yamada , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama
CPC分类号： H05K1/0366 , D03D1/0088 , D03D15/0011 , D03D15/0088 , D10B2401/18 , D10B2505/02 , H05K1/024 , H05K1/0245 , H05K1/0248 , H05K2201/029 , H05K2201/091 , H05K2203/0195 , Y10T29/49124
摘要： A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.
摘要翻译： 布线基板包括：绝缘层，包括热固性树脂和具有多个第一纤维束的加强件和编织在一起的多个第二纤维束，第二纤维束与第一纤维束相交，以及一对彼此并排设置的差动布线 在绝缘层上。 第一纤维束和第二纤维束在布置有一对差动布线的区域中相对于绝缘层的平面方向具有弯曲部分。
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