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    Circuit board and electronic device
    2.
    发明授权
    Circuit board and electronic device 有权
    电路板和电子设备

    公开(公告)号：US08958211B2

    公开(公告)日：2015-02-17

    申请号：US13300701

    申请日：2011-11-21

    申请人： Yoshiyuki Hiroshima ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukoyama ,  Tetsuro Yamada ,  Takahiro Ooi

    发明人： Yoshiyuki Hiroshima ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukoyama ,  Tetsuro Yamada ,  Takahiro Ooi

    IPC分类号： H05K7/10 ,  H05K1/18

    CPC分类号： H05K1/181 ,  H05K1/18 ,  H05K2201/099

    摘要： An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.

    摘要翻译： 一种电子设备包括一个包括多个端子的电子部件和一个安装有电子部件的电路板。 电路板包括板体，布置在板体上的多个电极焊盘，每个电极焊盘通过焊料连接到每个端子;第一阻焊剂，形成在电路板主体上，并具有多个第一开口 每个所述第一开口容纳每个所述电极焊盘;以及第二阻焊剂，形成在所述第一阻焊层上，并且具有多个第二开口，每个所述第二开口大于每个所述第一开口， 第一个开口。

    Wiring substrate
    4.
    发明授权
    Wiring substrate 有权
    接线基板

    公开(公告)号：US08648260B2

    公开(公告)日：2014-02-11

    申请号：US13075838

    申请日：2011-03-30

    申请人： Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Tetsuro Yamada ,  Mitsuhiko Sugane ,  Takahide Mukoyama

    发明人： Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Tetsuro Yamada ,  Mitsuhiko Sugane ,  Takahide Mukoyama

    IPC分类号： H05K1/09 ,  H05K7/00 ,  H05K1/03

    CPC分类号： H05K1/0248 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0269 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09272 ,  H05K2203/166 ,  H05K2203/167

    摘要： A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.

    摘要翻译： 布线基板包括差分布线; 与所述差分布线的一侧相邻的第一绝缘层，包括平行于所述差分布线的第一光纤束; 与所述差分布线的另一侧相邻的第二绝缘层，包括与所述差分布线平行并且以与所述第一纤维束相同的间距设置的第二纤维束; 在所述第一绝缘层上的与所述差分布线相反的一侧的第三绝缘层，包括与所述差分布线平行的第三纤维束; 以及在所述第二绝缘层上的与所述差分布线相反的一侧的第四绝缘层，包括与所述差分布线平行的第四纤维束。 第三和第四纤维束的间隔分别比第一和第二纤维束的间隔窄。 差分布线设置在相邻的第一纤维束之间以及相邻的第二纤维束之间。

    Printed board and method of manufacturing printed board
    5.
    发明授权
    Printed board and method of manufacturing printed board 有权
    印刷板和制造印刷电路板的方法

    公开(公告)号：US08513537B2

    公开(公告)日：2013-08-20

    申请号：US12859829

    申请日：2010-08-20

    申请人： Takahiro Ooi ,  Tetsuro Yamada ,  Yoshihiro Morita ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukouyama

    发明人： Takahiro Ooi ,  Tetsuro Yamada ,  Yoshihiro Morita ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukouyama

    IPC分类号： H05K1/11

    CPC分类号： H05K1/025 ,  H05K1/024 ,  H05K1/0248 ,  H05K1/0366 ,  H05K3/0052 ,  H05K2201/029

    摘要： A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.

    摘要翻译： 印刷电路板包括具有平坦表面的绝缘体，并且包括绝缘布，其包括第一纤维和第二纤维，所述第一纤维和第二纤维在平坦表面上与第一纤维成直角交叉;以及印刷布线，包括彼此平行延伸的多条信号线 并且布置在绝缘体的平坦表面上，使得信号线的方向以基于绝缘体的板切割效率确定的角度和预定的绝缘体的角度倾斜到第一或第二纤维的方向 信号线之间的延迟时间差。

    Printed wiring board manufacturing method
    6.
    发明授权
    Printed wiring board manufacturing method 有权
    印刷电路板制造方法

    公开(公告)号：US08631568B2

    公开(公告)日：2014-01-21

    申请号：US13046076

    申请日：2011-03-11

    申请人： Tetsuro Yamada ,  Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Misuhiko Sugane ,  Takahide Mukoyama

    发明人： Tetsuro Yamada ,  Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Misuhiko Sugane ,  Takahide Mukoyama

    IPC分类号： H05K3/02

    CPC分类号： H05K1/0245 ,  H05K1/0248 ,  H05K1/0269 ,  H05K1/0366 ,  H05K3/4638 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/0969 ,  H05K2203/167

    摘要： A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

    摘要翻译： 一种印刷线路板的制造方法，其特征在于，以经纱和纬纱编织玻璃纤维布，使经纱和纬纱在至少一个区域上视觉区分。 玻璃纤维布被树脂浸渍以制造基材。 在基板的至少一个表面上形成铜箔以制造芯基板。 在芯基板上的区域内去除铜箔以形成开口。 检测出在经纱之间或介于纬纱之间的间距。 基于经纱之间或纬纱之间的间距来确定要被图案化的一对差动布线之间的间距。 根据所述一对差动配线之间的所确定的间距，在所述芯基板上图案化所述一对差分布线。

    Printed wiring board manufacturing method
    7.
    发明授权
    Printed wiring board manufacturing method 有权

    公开(公告)号：US08595926B2

    公开(公告)日：2013-12-03

    申请号：US13046076

    申请日：2011-03-11

    申请人： Tetsuro Yamada ,  Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Misuhiko Sugane ,  Takahide Mukoyama

    发明人： Tetsuro Yamada ,  Takahiro Ooi ,  Yoshihiro Morita ,  Akiko Matsui ,  Misuhiko Sugane ,  Takahide Mukoyama

    IPC分类号： H05K3/02

    摘要： A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

    Printed circuit board unit
    8.
    发明申请
    Printed circuit board unit 审中-公开
    印刷电路板单元

    公开(公告)号：US20070272436A1

    公开(公告)日：2007-11-29

    申请号：US11528349

    申请日：2006-09-28

    申请人： Akiko Matsui

    发明人： Akiko Matsui

    IPC分类号： H05K1/16

    CPC分类号： H05K1/183 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10704 ,  H05K2203/0228

    摘要： A depression is formed in a first surface of a printed wiring board. A through hole penetrates through the printed wiring board from the bottom surface of the depression to a second surface of the printed wiring board. The second surface is the opposite surface of the first surface. A terminal of an electronic component is received in the through hole. The terminal has the tip end protruding from the second surface of the printed wiring board. Solder is filled in the through hole. The tip end of the terminal is allowed to protrude from the second surface of the printed wiring board even when the terminal is shorter than the original thickness of the printed wiring board. It is not necessary to change the length of the terminal.

    摘要翻译： 在印刷电路板的第一表面上形成凹陷。 通孔从印刷电路板的凹陷的底面穿过印刷线路板的第二表面。 第二表面是第一表面的相对表面。 电子部件的端子被容纳在通孔中。 端子具有从印刷线路板的第二表面突出的尖端。 焊料填充在通孔中。 即使端子短于印刷电路板的原始厚度，也允许端子的顶端从印刷电路板的第二表面突出。 不需要改变终端的长度。