公开(公告)号：US20120080219A1

公开(公告)日：2012-04-05

申请号：US13208380

申请日：2011-08-12

申请人： Shuichi TAKEUCHI ,  Kenji KOBAE ,  Yoshiyuki SATOH ,  Naoki ISHIKAWA ,  Takeshi MIYAKOSHI ,  Tetsuya TAKAHASHI

发明人： Shuichi TAKEUCHI ,  Kenji KOBAE ,  Yoshiyuki SATOH ,  Naoki ISHIKAWA ,  Takeshi MIYAKOSHI ,  Tetsuya TAKAHASHI

IPC分类号： H05K1/02 ,  H05K3/30

CPC分类号： H01L23/49894 ,  H01L21/4846 ,  H01L21/563 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  Y10T29/4913 ,  H01L2924/00

摘要： A method of manufacturing an electronic device in which an electronic component is flip-chip mounted on a circuit board, the method includes supplying, on an electrode of the circuit board or a terminal of the electronic component, a first resin material of a thickness smaller than a gap between the circuit board and the electronic component, after supplying the first resin material, connecting the terminal to the electrode by melting a solder material disposed on the electrode or the terminal at a first temperature with keeping the terminal in contact with the electrode, after connecting the terminal to the electrode, filling the gap between the circuit board and the electronic component with a second resin material, and heating the second resin material at a second temperature lower than the first temperature.

摘要翻译： 一种电子设备的制造方法，其中电子部件被倒装安装在电路板上，该方法包括在电路板的电极或电子部件的端子上提供厚度较小的第一树脂材料 比电路板和电子部件之间的间隙大，在供给第一树脂材料之后，通过使端子与电极接触而在第一温度下熔化设置在电极或端子上的焊料材料而将端子连接到电极 在将端子连接到电极之后，用第二树脂材料填充电路板和电子部件之间的间隙，并在低于第一温度的第二温度下加热第二树脂材料。

公开(公告)号：US20120048607A1

公开(公告)日：2012-03-01

申请号：US13198749

申请日：2011-08-05

申请人： Tetsuya TAKAHASHI ,  Kenji KOBAE ,  Naoki ISHIKAWA ,  Takeshi MIYAKOSHI

发明人： Tetsuya TAKAHASHI ,  Kenji KOBAE ,  Naoki ISHIKAWA ,  Takeshi MIYAKOSHI

IPC分类号： H05K1/16

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An electronic device includes an electronic component having a mounting surface with a contour including a plurality of sides and a plurality of corners, a circuit board including a mounted surface that faces the mounting surface of the electronic component and having a recess formed at a position facing the corner of the electronic component, a connection portion provided between the electronic component and the circuit board and electrically connecting the circuit board to the electronic component, a first member embedded in the recess and having a rigidity lower than those of the electronic component and the circuit board, and a second member provided between the electronic component and the circuit board and having a rigidity lower than those of the electronic component and the circuit board.

摘要翻译： 一种电子设备，包括具有包括多个侧面和多个角部的轮廓的安装表面的电子部件，电路板，包括面向电子部件的安装表面的安装表面，并且具有形成在面向 电子部件的角部，设置在电子部件和电路板之间并将电路板电连接到电子部件的连接部，嵌入凹部中的刚性低于电子部件的刚性的第一部件， 以及设置在所述电子部件和所述电路基板之间并且刚性低于所述电子部件和所述电路基板的刚性的第二部件。

公开(公告)号：US20100126763A1

公开(公告)日：2010-05-27

申请号：US12575141

申请日：2009-10-07

申请人： Takayoshi Matsumura ,  Takeshi Miyakoshi

发明人： Takayoshi Matsumura ,  Takeshi Miyakoshi

IPC分类号： H05K1/11 ,  H01R43/02

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K20/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/4807 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48482 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/75355 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01202 ,  H01L2924/01204 ,  H01L2924/10162 ,  H01L2924/14 ,  Y10T29/49213 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2224/4554

摘要： A wire bonding method which includes forming a bump on a first electrode provided in a first electronic part and bonding the bump and a second electrode provided in a second electronic part by using a wire, wherein the bump and the wire are formed using materials containing Au, and an Au purity of the material forming the bump is lower than an Au purity of the material forming the wire.

摘要翻译： 一种引线接合方法，其包括在设置在第一电子部件中的第一电极上形成凸块，并且通过使用导线将所述凸块接合并设置在第二电子部件中的第二电极，其中所述凸块和所述导线使用包含Au的材料 ，并且形成凸块的材料的Au纯度低于形成导线的材料的Au纯度。