公开(公告)号：US20120080219A1

公开(公告)日：2012-04-05

申请号：US13208380

申请日：2011-08-12

申请人： Shuichi TAKEUCHI ,  Kenji KOBAE ,  Yoshiyuki SATOH ,  Naoki ISHIKAWA ,  Takeshi MIYAKOSHI ,  Tetsuya TAKAHASHI

发明人： Shuichi TAKEUCHI ,  Kenji KOBAE ,  Yoshiyuki SATOH ,  Naoki ISHIKAWA ,  Takeshi MIYAKOSHI ,  Tetsuya TAKAHASHI

IPC分类号： H05K1/02 ,  H05K3/30

CPC分类号： H01L23/49894 ,  H01L21/4846 ,  H01L21/563 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  Y10T29/4913 ,  H01L2924/00

摘要： A method of manufacturing an electronic device in which an electronic component is flip-chip mounted on a circuit board, the method includes supplying, on an electrode of the circuit board or a terminal of the electronic component, a first resin material of a thickness smaller than a gap between the circuit board and the electronic component, after supplying the first resin material, connecting the terminal to the electrode by melting a solder material disposed on the electrode or the terminal at a first temperature with keeping the terminal in contact with the electrode, after connecting the terminal to the electrode, filling the gap between the circuit board and the electronic component with a second resin material, and heating the second resin material at a second temperature lower than the first temperature.

摘要翻译： 一种电子设备的制造方法，其中电子部件被倒装安装在电路板上，该方法包括在电路板的电极或电子部件的端子上提供厚度较小的第一树脂材料 比电路板和电子部件之间的间隙大，在供给第一树脂材料之后，通过使端子与电极接触而在第一温度下熔化设置在电极或端子上的焊料材料而将端子连接到电极 在将端子连接到电极之后，用第二树脂材料填充电路板和电子部件之间的间隙，并在低于第一温度的第二温度下加热第二树脂材料。

公开(公告)号：US20120048607A1

公开(公告)日：2012-03-01

申请号：US13198749

申请日：2011-08-05

申请人： Tetsuya TAKAHASHI ,  Kenji KOBAE ,  Naoki ISHIKAWA ,  Takeshi MIYAKOSHI

发明人： Tetsuya TAKAHASHI ,  Kenji KOBAE ,  Naoki ISHIKAWA ,  Takeshi MIYAKOSHI

IPC分类号： H05K1/16

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An electronic device includes an electronic component having a mounting surface with a contour including a plurality of sides and a plurality of corners, a circuit board including a mounted surface that faces the mounting surface of the electronic component and having a recess formed at a position facing the corner of the electronic component, a connection portion provided between the electronic component and the circuit board and electrically connecting the circuit board to the electronic component, a first member embedded in the recess and having a rigidity lower than those of the electronic component and the circuit board, and a second member provided between the electronic component and the circuit board and having a rigidity lower than those of the electronic component and the circuit board.

摘要翻译： 一种电子设备，包括具有包括多个侧面和多个角部的轮廓的安装表面的电子部件，电路板，包括面向电子部件的安装表面的安装表面，并且具有形成在面向 电子部件的角部，设置在电子部件和电路板之间并将电路板电连接到电子部件的连接部，嵌入凹部中的刚性低于电子部件的刚性的第一部件， 以及设置在所述电子部件和所述电路基板之间并且刚性低于所述电子部件和所述电路基板的刚性的第二部件。

公开(公告)号：US20120230001A1

公开(公告)日：2012-09-13

申请号：US13348935

申请日：2012-01-12

申请人： Tetsuya TAKAHASHI ,  Kenji KOBAE ,  Shuichi TAKEUCHI ,  Yoshiyuki SATOH ,  Kimio NAKAMURA

发明人： Tetsuya TAKAHASHI ,  Kenji KOBAE ,  Shuichi TAKEUCHI ,  Yoshiyuki SATOH ,  Kimio NAKAMURA

IPC分类号： H05K7/10 ,  H05K3/30

CPC分类号： H01L23/3128 ,  H01L23/36 ,  H01L23/4334 ,  H01L25/03 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device includes an interposer, a first chip being mounted on a first surface of the interposer, the first chip having a first surface facing the first surface of the interposer and a second surface opposite to the first surface of the first chip, a second chip being mounted on a second surface of the interposer opposite to the first surface of the interposer, the second chip having a first surface facing the second surface of the interposer and a second surface opposite to the first surface of the second chip, a first metal plate being connected to the second surface of the first chip, a second metal surface being provided over the second surface of the second chip, and a via penetrating through the interposer and connected to the first metal plate and the second metal plate.

摘要翻译： 电子设备包括插入器，第一芯片安装在插入件的第一表面上，第一芯片具有面向插入件的第一表面的第一表面和与第一芯片的第一表面相对的第二表面，第二芯片的第二表面 芯片安装在与插入件的第一表面相对的插入件的第二表面上，第二芯片具有面向插入件的第二表面的第一表面和与第二芯片的第一表面相对的第二表面，第一金属 板连接到第一芯片的第二表面，第二金属表面设置在第二芯片的第二表面上，以及穿过插入件并连接到第一金属板和第二金属板的通孔。

公开(公告)号：US20090243006A1

公开(公告)日：2009-10-01

申请号：US12402881

申请日：2009-03-12

申请人： Tetsuya TAKAHASHI ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

发明人： Tetsuya TAKAHASHI ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC分类号： H01L29/84 ,  H01L23/12 ,  H01L21/50

CPC分类号： B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

摘要翻译： 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US20100243743A1

公开(公告)日：2010-09-30

申请号：US12723174

申请日：2010-03-12

申请人： Shuichi TAKEUCHI ,  Kenji KOBAE ,  Takayoshi MATSUMURA ,  Tetsuya TAKAHASHI

发明人： Shuichi TAKEUCHI ,  Kenji KOBAE ,  Takayoshi MATSUMURA ,  Tetsuya TAKAHASHI

IPC分类号： G06K19/077 ,  G06K19/02 ,  B29C65/02 ,  B29C65/48

CPC分类号： G06K19/07749 ,  G06K19/07728

摘要： A radio frequency identification tag is provided. The radio frequency identification tag includes a base, an antenna formed on the base, an integrated circuit chip electrically connected to the antenna, and a bonding layer bonding the integrated circuit chip to the base. The bonding layer includes a conductive filler. The base is configured to bend away from a surface on which the integrated circuit chip is bonded.

摘要翻译： 提供射频识别标签。 射频识别标签包括基座，形成在基座上的天线，与天线电连接的集成电路芯片，以及将集成电路芯片接合到基座的接合层。 接合层包括导电填料。 该基座被构造为远离集成电路芯片所接合的表面弯曲。

公开(公告)号：US20220142278A1

公开(公告)日：2022-05-12

申请号：US17520970

申请日：2021-11-08

申请人： Tetsuya TAKAHASHI ,  Atsumi Tsuzuki ,  Tsutomu Numazawa ,  Takanori Hayashi

发明人： Tetsuya TAKAHASHI ,  Atsumi Tsuzuki ,  Tsutomu Numazawa ,  Takanori Hayashi

IPC分类号： A41D27/28 ,  A41D1/00

摘要： An air-conditioning garment includes a garment main part that is worn on the upper body of a wearer, and two fans that are attached to a lower part of a back part of a garment main part, and configured to feed outside air into the inside of the garment main part. Each of the two fans includes a fan main body and a case that houses the fan main body and includes two air outlets. The two air outlets are formed so that their blowing directions are restricted to being upward or obliquely upward. The two air outlets are formed in such a manner that their blowing directions have an upwardly-opened V-shape.

公开(公告)号：US20120193262A1

公开(公告)日：2012-08-02

申请号：US13272572

申请日：2011-10-13

申请人： Tetsuya TAKAHASHI

发明人： Tetsuya TAKAHASHI

IPC分类号： B65D81/00

CPC分类号： B65D81/07

摘要： A packaging box is provided with an exterior unit, and a packaging component set in the exterior unit. The packaging component includes an article mounting plane unit on which to mount an article, a pair of suspending units that are made by bending upward the article mounting plane unit at right and left ends of the article mounting plane unit so as to suspend the article mounting plane unit, and a pair of side plane units that are made by bending downward the pair of suspending units at upper ends of the pair of the suspending units, in which the pair of side plane units are kept in surface contact with two opposing walls of the exterior unit.

摘要翻译： 一个包装盒设有一个外部单元和一个装在外部单元中的包装部件。 包装部件包括：物品安装平面单元，用于安装物品;一对悬挂单元，其通过在物品安装平面单元的左右端向上弯曲物品安装平面单元而制成，以便悬挂物品安装 以及一对侧面单元，其通过在一对悬挂单元的上端部向下弯曲一对悬挂单元而形成，所述一对侧面单元保持与两个相对的壁的表面接触 外部单元。