公开(公告)号：US20090243006A1

公开(公告)日：2009-10-01

申请号：US12402881

申请日：2009-03-12

申请人： Tetsuya TAKAHASHI ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

发明人： Tetsuya TAKAHASHI ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC分类号： H01L29/84 ,  H01L23/12 ,  H01L21/50

CPC分类号： B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

摘要翻译： 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US08169075B2

公开(公告)日：2012-05-01

申请号：US12402881

申请日：2009-03-12

申请人： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

发明人： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC分类号： H01L29/40

CPC分类号： B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

摘要翻译： 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US20090146653A1

公开(公告)日：2009-06-11

申请号：US12292651

申请日：2008-11-24

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

公开(公告)号：US20090146652A1

公开(公告)日：2009-06-11

申请号：US12292650

申请日：2008-11-24

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。

公开(公告)号：US20060030076A1

公开(公告)日：2006-02-09

申请号：US11246267

申请日：2005-10-11

申请人： Hiroshi Kobayashi ,  Naoki Ishikawa ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Shuichi Takeuchi ,  Takayoshi Matsumura

发明人： Hiroshi Kobayashi ,  Naoki Ishikawa ,  Kenji Kobae ,  Hidehiko Kira ,  Norio Kainuma ,  Shuichi Takeuchi ,  Takayoshi Matsumura

IPC分类号： H01L21/48 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： The semiconductor device of the present invention is capable of restricting alloying metals and improving electrical connection between a semiconductor chip and a mount board. The semiconductor device comprises: the semiconductor chip having terminal sections; and bumps for electrical connection, the bumps being formed at the terminal sections. Each of the bumps is made of a two-layer wire, which includes a core member and a jacket member, and formed by a stud bump bonding process.

摘要翻译： 本发明的半导体器件能够限制合金化金属和改善半导体芯片和安装基板之间的电连接。 半导体器件包括：具有端子部分的半导体芯片; 以及用于电连接的凸块，在端子部分处形成凸点。 每个凸块由包括芯构件和护套构件的双层线制成，并且通过柱凸块接合工艺形成。

公开(公告)号：US07471081B2

公开(公告)日：2008-12-30

申请号：US11326598

申请日：2006-01-06

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。

公开(公告)号：US20060172575A1

公开(公告)日：2006-08-03

申请号：US11326598

申请日：2006-01-06

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： H01R13/15

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

公开(公告)号：US20050001014A1

公开(公告)日：2005-01-06

申请号：US10816915

申请日：2004-04-05

申请人： Shuichi Takeuchi ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Hiroshi Kobayashi ,  Takayoshi Matsumura ,  Shigeo Matsunuma ,  Tomohisa Yagi

发明人： Shuichi Takeuchi ,  Hidehiko Kira ,  Kenji Kobae ,  Norio Kainuma ,  Hiroshi Kobayashi ,  Takayoshi Matsumura ,  Shigeo Matsunuma ,  Tomohisa Yagi

IPC分类号： B23K1/00 ,  B23K1/06 ,  B23K1/20 ,  B23K3/06 ,  H01L21/56 ,  H01L21/60 ,  H01L21/607 ,  H05K3/32 ,  H05K3/34 ,  B23K20/10 ,  B23K31/02

CPC分类号： H01L21/563 ,  B23K1/0016 ,  B23K1/06 ,  B23K1/203 ,  B23K3/0607 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/328 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0285 ,  H01L2224/05599

摘要： The method of mounting an electronic part is capable of securely mounting the electronic part having fine solder bumps without excessively heating the part. The method of comprises the steps of: applying flux-fill, which acts as flux and under-filling resin, on a surface of a mount board, in which electrodes are formed; respectively connecting solder bums of the electronic part with the electrodes; and simultaneously filling a gap between the electronic part and the mount board with the flux-fill, wherein the solder bumps are made contact with the electrodes, and ultrasonic vibration energy is applied to contact portions of the solder bumps and the electrodes in the connecting step.

摘要翻译： 安装电子部件的方法能够牢固地安装具有细焊锡凸块的电子部件，而不会过度加热该部件。 所述方法包括以下步骤：在其中形成电极的安装板的表面上施加用作助熔剂和未充填树脂的焊剂填充物; 分别将电子部件的焊料焊接与电极连接; 并且同时用助焊剂填充电子部件和安装板之间的间隙，其中焊料凸块与电极接触，并且在连接步骤中将超声波振动能量施加到焊料凸块和电极的接触部分 。

公开(公告)号：US08308071B2

公开(公告)日：2012-11-13

申请号：US12756487

申请日：2010-04-08

申请人： Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

发明人： Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/07724 ,  G06K19/07728 ,  Y10T156/10

摘要： An RFID tag includes an inlet on which an antenna pattern serving as an antenna for communication and an IC chip electrically connected to the antenna pattern are mounted. The RFID tag also includes an exterior body that encloses the inlet from outside and a hollow space that is formed by the inlet and the exterior body and that is filled with gas or a gel material.

摘要翻译： RFID标签包括其上安装用作通信用天线的天线图案和与天线图案电连接的IC芯片的入口。 RFID标签还包括从外部包围入口的外部主体和由入口和外部主体形成并且填充有气体或凝胶材料的中空空间。

公开(公告)号：US08395904B2

公开(公告)日：2013-03-12

申请号：US12821938

申请日：2010-06-23

申请人： Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

发明人： Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

IPC分类号： H05K7/00

CPC分类号： H01L24/11 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate.

摘要翻译： 多芯片模块包括封装基板，第一半导体器件，第二半导体器件和导电凸块。 第一半导体器件被倒装芯片结合到封装衬底。 第一半导体器件包括在其表面上的第一芯片焊盘。 第二半导体器件安装在第一半导体器件上。 第二半导体器件包括面向第一芯片焊盘的第二芯片焊盘。 导电凸块将第一芯片焊盘连接到第二芯片焊盘。 导电凸块包括具有第一扩散速率的第一金属体和具有低于第一扩散速率的第二扩散速率的第二金属体。