摘要:
A microsystem for converting pressure difference in fluid into mechanical displacement includes input and output nozzles, two interleaved parts, one of which is mobile part, between which the fluid flows. During displacement, the parts define an expanding fluid pocket that moves from the input nozzle to the output nozzle. The micro-system also includes top and bottom planes between which the mobile part is mounted for displacement relative to each plane, an overhanging distal portion along which the fluid flows, and a proximal portion mechanically linked to a plane via a link allowing only longitudinal translation of the proximal portion, and a reinforcement including a first side fastened to one of the planes and, a second side that is either fastened to or in sliding contact with the overhanging distal portion of the mobile part to limit its deformation in a transverse direction perpendicular to the longitudinal direction.
摘要:
The invention pertains to a method for manufacturing a microelectronic device on a substrate comprising at least one first electrical component and one second electrical component distributed respectively in first and second levels stacked one on top of the other on the substrate, this method comprising: the manufacture of at least one first arm and one second arm of different lengths, each of these arms directly and mechanically linking an electrical pad to a fixed anchoring point on the substrate, and the electrical pad is made inside the first level and then shifted, prior to the electrical connection of the second component, to a position of connection wherein the upper face of the electrical pad is in contact with the interior of the second level parallel to the substrate.
摘要:
The invention relates to a microsystem for converting a difference in pressures in a fluid into mechanical movement, this microsystem comprising: —an inlet nozzle (6) for compressed fluid and an outlet nozzle (8) for expanded fluid, —at least two arms (12, 14), at least one of which is hinged and between which flows the fluid in order to pass from the inlet nozzle to the outlet nozzle by moving these arms with respect to one another, the arms (12, 14) being designed and hinged such that, while they move, they define at least one pocket of fluid which is moved away from the inlet nozzle in order then to return to the outlet nozzle while at the same time increasing in volume, each of the arms (12, 14) being mechanically connected to a single plane (20).
摘要:
Application of a modular coaxial package design, compatible with telecommunication passive component packaging, to microchip lasers, in particular to passively Q-switched microlasers, pumped with a fiber-coupled diode, is disclosed. The number of parts is thereby reduced while providing the adequate degrees of freedom for the active or passive alignment of the optical elements within the package.
摘要:
The invention concerns a device for encapsulating an element within a microcavity made on a support (10), this device comprising an encapsulating membrane (12) capable of forming at least one part of the microcavity,characterized in that the device comprises at least one arm which mechanically attaches the membrane to the support, this arm being capable of bending so as to shift the membrane between: an open position in which the membrane overhangs the element to be encapsulated and its periphery defines an aperture extending around the element to be encapsulated, and a shut position in which the periphery of the encapsulation membrane rests on the support to obstruct this aperture.
摘要:
A microcavity structure including: a first substrate, a cover attached to the first substrate such that a space formed between the cover and the first substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap of the hole placed inside the microcavity and including at least two portions of materials with different thermal expansion coefficients placed one against the other, at least one first end of the two portions being mechanically linked to the cover, at least a second end of the two portions being free, and at least a part of the closing flap being placed opposite the hole, the two portions being capable of closing or not the hole under the effect of a temperature variation.
摘要:
This wheel is equipped with a tyre and an electric device (100), which needs to be supplied with power in order to operate. The device comprises a system (200) for converting the difference in pressure between the pressurized gas inside the tyre and the free air outside the tyre into electric power used for supplying the electric device.
摘要:
Microcavity structure comprising: a substrate, a cover attached to the substrate such that a space formed between the cover and the substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap for the hole placed inside the microcavity and comprising at least two portions of materials with different thermal expansion coefficients placed one against the other, one first end of said two portions being mechanically linked to the cover, a second end of said two portions being free, and at least a part of the closing flap being placed opposite the hole, said two portions being suitable for closing or not the hole under the effect of a variation of temperature.
摘要:
A microsystem for converting pressure difference in fluid into mechanical displacement includes input and output nozzles, two interleaved parts, one of which is mobile part, between which the fluid flows. During displacement, the parts define an expanding fluid pocket that moves from the input nozzle to the output nozzle. The microsystem also includes top and bottom planes between which the mobile part is mounted for displacement relative to each plane, an overhanging distal portion along which the fluid flows, and a proximal portion mechanically linked to a plane via a link allowing only longitudinal translation of the proximal portion, and a reinforcement including a first side fastened to one of the planes and, a second side that is either fastened to or in sliding contact with the overhanging distal portion of the mobile part to limit its deformation in a transverse direction perpendicular to the longitudinal direction.
摘要:
The invention pertains to a method for manufacturing a microelectronic device on a substrate comprising at least one first electrical component and one second electrical component distributed respectively in first and second levels stacked one on top of the other on the substrate, this method comprising: the manufacture of at least one first arm and one second arm of different lengths, each of these arms directly and mechanically linking an electrical pad to a fixed anchoring point on the substrate, and the electrical pad is made inside the first level and then shifted, prior to the electrical connection of the second component, to a position of connection wherein the upper face of the electrical pad is in contact with the interior of the second level parallel to the substrate.