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    Microcavity structure and encapsulation structure for a microelectronic device
    1.
    发明授权
    Microcavity structure and encapsulation structure for a microelectronic device 有权
    微电子器件的微腔结构和封装结构

    公开(公告)号：US08367929B2

    公开(公告)日：2013-02-05

    申请号：US12848386

    申请日：2010-08-02

    申请人： Xavier Baillin ,  Stéphane Caplet ,  Thierry Hilt

    发明人： Xavier Baillin ,  Stéphane Caplet ,  Thierry Hilt

    IPC分类号： H05K5/00

    CPC分类号： B81C1/00293 ,  B81C2203/0145 ,  Y10T156/1057

    摘要： A microcavity structure including: a first substrate, a cover attached to the first substrate such that a space formed between the cover and the first substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap of the hole placed inside the microcavity and including at least two portions of materials with different thermal expansion coefficients placed one against the other, at least one first end of the two portions being mechanically linked to the cover, at least a second end of the two portions being free, and at least a part of the closing flap being placed opposite the hole, the two portions being capable of closing or not the hole under the effect of a temperature variation.

    摘要翻译： 一种微腔结构，包括：第一基板，附接到第一基板的盖，使得形成在盖和第一基板之间的空间形成微腔，穿过盖的至少一个孔和孔的至少一个封闭盖 放置在所述微腔内部并且包括具有不同热膨胀系数的材料的至少两部分彼此相对放置，所述两个部分的至少一个第一端机械地连接到所述盖，所述两个部分的至少第二端是自由的 并且所述封闭翼片的至少一部分与所述孔相对放置，所述两个部分能够在温度变化的作用下闭合所述孔。

    MICROCAVITY STRUCTURE AND ENCAPSULATION STRUCTURE FOR A MICROELECTRONIC DEVICE
    2.
    发明申请
    MICROCAVITY STRUCTURE AND ENCAPSULATION STRUCTURE FOR A MICROELECTRONIC DEVICE 有权
    微电子器件的微结构和封装结构

    公开(公告)号：US20110030989A1

    公开(公告)日：2011-02-10

    申请号：US12848386

    申请日：2010-08-02

    申请人： Xavier BAILLIN ,  Stéphane Caplet ,  Thierry Hilt

    发明人： Xavier BAILLIN ,  Stéphane Caplet ,  Thierry Hilt

    IPC分类号： H05K5/00 ,  B32B38/04 ,  B32B37/24

    CPC分类号： B81C1/00293 ,  B81C2203/0145 ,  Y10T156/1057

    摘要： Microcavity structure comprising: a substrate, a cover attached to the substrate such that a space formed between the cover and the substrate forms the microcavity, at least one hole passing through the cover, and at least one closing flap for the hole placed inside the microcavity and comprising at least two portions of materials with different thermal expansion coefficients placed one against the other, one first end of said two portions being mechanically linked to the cover, a second end of said two portions being free, and at least a part of the closing flap being placed opposite the hole, said two portions being suitable for closing or not the hole under the effect of a variation of temperature.

    摘要翻译： 微腔结构包括：衬底，附接到衬底的盖，使得形成在盖和衬底之间的空间形成微腔，穿过盖的至少一个孔和放置在微腔内的孔的至少一个闭合瓣 并且包括具有不同热膨胀系数的材料的至少两部分彼此相对放置，所述两个部分的一个第一端机械连接到所述盖，所述两个部分的第二端是自由的，并且所述两个部分的至少一部分 所述两个部分适于在温度变化的作用下关闭或不关闭所述孔。

    STRUCTURE MADE OF GETTER MATERIAL HERMETICALLY PROTECTED DURING MANUFACTURING
    3.
    发明申请
    STRUCTURE MADE OF GETTER MATERIAL HERMETICALLY PROTECTED DURING MANUFACTURING 审中-公开
    在制造过程中保护材料的结构

    公开(公告)号：US20120328779A1

    公开(公告)日：2012-12-27

    申请号：US13530513

    申请日：2012-06-22

    申请人： Stéphane Caplet ,  Xavier Baillin

    发明人： Stéphane Caplet ,  Xavier Baillin

    IPC分类号： B05D5/00

    CPC分类号： B81B7/0038

    摘要： Process for making a device comprising at least the following steps: produce a getter structure comprising at least one portion of getter material permeable to gas covered by at least one protective layer hermetic to gas; hermetic encapsulation of the getter structure in a cavity; production of at least one local opening passing through the protective layer and forming an access to the portion of getter material permeable to gas.

    摘要翻译： 制造装置的方法至少包括以下步骤：产生吸气剂结构，该吸气剂结构包括至少一部分吸气剂材料，所述吸气剂材料可透气至少一层气体保护层所覆盖的气体; 吸气剂结构在空腔中的气密封装; 产生通过保护层的至少一个局部开口，并形成通向气体的吸气剂材料部分的通路。

    Method for making micron or submicron cavities
    5.
    发明授权
    Method for making micron or submicron cavities 有权
    制造微米或亚微米孔的方法

    公开(公告)号：US09063410B2

    公开(公告)日：2015-06-23

    申请号：US13108663

    申请日：2011-05-16

    申请人： Stéphane Caplet ,  Claude Venin

    发明人： Stéphane Caplet ,  Claude Venin

    IPC分类号： G03F7/20 ,  G03F7/00 ,  G03F1/00 ,  G02F1/1333

    CPC分类号： G03F7/0007 ,  G02F1/133377 ,  G03F1/14 ,  G03F7/0005 ,  G03F7/2014

    摘要： A method for forming a micro-optical or sub-micro-optical device is provided, including: forming a photolithographic mask on a transparent support, depositing a layer of a photosensitive material of negative polarity on the face, a so called front face, of the support which supports the mask, wherein the mask is disposed under the areas where the photosensitive material should be removed, insolating the layer of the photosensitive material through the rear face of the support, developing the photosensitive material in order to obtain walls of micron or submicron cavities, removing the mask areas located at the bottom of the cavities in order to obtain cavities without any mask material between the walls, introducing a fluid into the cavities of the device, and forming a closure layer on the walls in photosensitive material.

    摘要翻译： 提供了一种用于形成微光学或亚微光学器件的方法，包括：在透明支撑体上形成光刻掩模，在所述表面上沉积具有负极性的感光材料层，即所谓的正面 支撑掩模的支撑件，其中掩模设置在感光材料应被去除的区域之下，通过支撑体的背面使感光材料的层剥离，使感光材料显影，以获得微米或 亚微米腔，去除位于空腔底部的掩模区域，以获得在壁之间没有任何掩模材料的空腔，将流体引入装置的空腔中，以及在感光材料的壁上形成封闭层。

    Method for producing a micromechanical and/or nanomechanical device with anti-bonding stops
    6.
    发明授权
    Method for producing a micromechanical and/or nanomechanical device with anti-bonding stops 有权
    用于制造具有防结块止动件的微机械和/或纳米机械装置的方法

    公开(公告)号：US08557698B2

    公开(公告)日：2013-10-15

    申请号：US12336317

    申请日：2008-12-16

    申请人： Stéphane Caplet

    发明人： Stéphane Caplet

    IPC分类号： H01L21/477

    CPC分类号： B81B3/001

    摘要： A method for producing a micromechanical and/or nanomechanical device includes partial etching of at least one sacrificial layer arranged between a first layer and a substrate, forming at least one cavity in which is arranged at least one portion of the sacrificial layer in contact with the first layer and/or the substrate. The method also includes chemical transformation of at least one wall of the first layer and/or the substrate in the cavity, delimiting at least one stop in the first layer and/or the substrate at the level of the portion of the sacrificial layer. The portion of the sacrificial layer and the chemically transformed wall of the first layer and/or the substrate is also eliminated.

    摘要翻译： 一种用于制造微机械和/或纳米机械装置的方法包括对布置在第一层和衬底之间的至少一个牺牲层进行部分蚀刻，形成至少一个空腔，其中将牺牲层的至少一部分与 第一层和/或衬底。 该方法还包括在空腔中的第一层和/或基底的至少一个壁的化学转化，在牺牲层的该部分的水平面限定第一层和/或基底中的至少一个止挡部。 也消除了第一层和/或衬底的牺牲层和化学转化壁的部分。

    Method of reinforcing a mechanical microstructure
    7.
    发明授权
    Method of reinforcing a mechanical microstructure 有权
    增强机械微结构的方法

    公开(公告)号：US06878566B2

    公开(公告)日：2005-04-12

    申请号：US10330644

    申请日：2002-12-27

    申请人： Stéphane Caplet

    发明人： Stéphane Caplet

    IPC分类号： G01P15/125 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  G01P15/08 ,  H01L29/84 ,  H01L21/00

    CPC分类号： B81C1/00896 ,  B81B7/0012 ,  G01P2015/0814

    摘要： A mechanical microstructure including a deformable first layer overhanging a second layer and defining a cavity set back from an external face of the deformable first layer and having an abutment stud projecting into the cavity, in which a wire is connected to a portion of an internal face of the deformable first layer. The portion of the first layer is opposite a bottom area of the cavity into which the abutment stud projects, but the abutment stud remains at a distance from the deformable first layer. A method of producing the mechanical microstructure is also disclosed.

    摘要翻译： 一种机械显微组织，包括可变形的第一层，所述可变形的第一层突出第二层并且限定从所述可变形的第一层的外表面设置的空腔，并且具有突出到所述空腔中的抵接突起，其中，线连接到内表面的一部分 的可变形的第一层。 第一层的部分与空腔的底部区域相对，邻接突起突出到底部区域中，但是邻接螺柱保持与可变形的第一层一定距离。 还公开了一种生产机械微结构的方法。

    Getter structure including a gas-permeable material description
    8.
    发明授权
    Getter structure including a gas-permeable material description 有权
    吸气体结构包括透气材料的描述

    公开(公告)号：US09005353B2

    公开(公告)日：2015-04-14

    申请号：US13530596

    申请日：2012-06-22

    申请人： Stéphane Caplet

    发明人： Stéphane Caplet

    IPC分类号： B01D53/02 ,  B81B7/00

    CPC分类号： B81B7/0038

    摘要： A getter structure including at least one portion of getter material at least one face of which is positioned against at least one portion of gas-permeable material such that said portion of getter material is able to achieve a gaseous absorption and/or adsorption at least by said face through at least said portion of gas-permeable material, and in which the portion of gas-permeable material includes one or more channels made at the level of a face of said portion of gas-permeable material which is in contact with the portion of getter material, where the portion of getter material is able to achieve a gaseous absorption, or a gaseous adsorption, or both a gaseous absorption and a gaseous adsorption, via the channel or channels.

    摘要翻译： 吸气剂结构，其包括吸气剂材料的至少一部分，其至少一个表面抵靠气体可渗透材料的至少一部分定位，使得吸气剂材料的所述部分能够至少通过以下方式实现气体吸收和/或吸附： 所述表面通过所述透气材料的至少所述部分，并且其中所述透气材料部分包括在透气材料的所述部分的表面的水平处形成的一个或多个通道，该通道与所述部分 的吸气剂材料，其中吸气材料的一部分能够通过通道或通道实现气体吸收，或气体吸附，或气态吸收和气体吸附。

    Pre-released structure device
    9.
    发明授权
    Pre-released structure device 有权
    预发布结构设备

    公开(公告)号：US08138556B2

    公开(公告)日：2012-03-20

    申请号：US12338174

    申请日：2008-12-18

    申请人： Stéphane Caplet

    发明人： Stéphane Caplet

    IPC分类号： H01L29/72

    CPC分类号： B81C1/00944 ,  B81C2201/019

    摘要： A pre-released structure device comprising: at least one first stacking, comprising at least one first layer based on at least one first material, arranged against a second stacking comprising at least one second layer based on at least one second material, at least one closed cavity, formed in the first and/or the second stacking, and arranged between a portion of the first stacking forming the pre-released structure and the second stacking, at least one spacer arranged in the cavity and linking the portion of the first stacking to the second stacking.

    摘要翻译： 一种预释放的结构装置，包括：至少一个第一堆叠，包括至少一个基于至少一个第一材料的第一层，该第一层被布置成抵抗第二堆叠，所述第二堆叠包括至少一个基于至少一个第二材料的第二层， 闭合腔，形成在第一和/或第二堆叠中，并且布置在形成预释放结构的第一堆叠的一部分和第二堆叠之间，布置在空腔中的至少一个间隔件，并且将第一堆叠部分 到第二堆叠。