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公开(公告)号：US20060292719A1
公开(公告)日：2006-12-28
申请号：US11436198
申请日：2006-05-17
申请人： Anthony Lochtefeld , Matthew Currie , Zhiyuan Cheng , James Fiorenza , Glyn Braithwaite , Thomas Langdo
发明人： Anthony Lochtefeld , Matthew Currie , Zhiyuan Cheng , James Fiorenza , Glyn Braithwaite , Thomas Langdo
IPC分类号： H01L21/00
CPC分类号： H01L21/02647 , H01L21/02381 , H01L21/0245 , H01L21/0251 , H01L21/02521 , H01L21/02532 , H01L21/0254 , H01L21/02639 , H01L21/7624 , H01L21/8258 , H01L29/66795 , H01L29/785
摘要： Fabrication of monolithic lattice-mismatched semiconductor heterostructures with limited area regions having upper portions substantially exhausted of threading dislocations, as well as fabrication of semiconductor devices based on such lattice-mismatched heterostructures.
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2.发明申请Methods for forming strained-semiconductor-on-insulator device structures by use of cleave planes 有权通过使用分裂面形成绝缘体上半导体器件结构的方法公开(公告)号：US20050212061A1
公开(公告)日：2005-09-29
申请号：US11127508
申请日：2005-05-12
IPC分类号： H01L21/20 , H01L21/331 , H01L21/336 , H01L21/337 , H01L21/762 , H01L21/84 , H01L27/12 , H01L29/786 , H01L29/76
CPC分类号： H01L29/7847 , H01L21/28518 , H01L21/76254 , H01L21/76256 , H01L21/76259 , H01L21/76264 , H01L21/76275 , H01L21/84 , H01L27/1203 , H01L29/0649 , H01L29/1033 , H01L29/165 , H01L29/41783 , H01L29/66242 , H01L29/66628 , H01L29/66772 , H01L29/66787 , H01L29/66916 , H01L29/7842 , H01L29/7843 , H01L29/7849 , H01L29/785 , H01L29/78603 , H01L29/78684 , H01L29/78687
摘要： The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication.
摘要翻译： 应变半导体的优点与基板和器件制造上的绝缘体绝缘体方法相结合。
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3.发明申请Methods for forming double gate strained-semiconductor-on-insulator device structures 审中-公开用于形成双栅应变半导体绝缘体上器件结构的方法公开(公告)号：US20060197125A1
公开(公告)日：2006-09-07
申请号：US11415784
申请日：2006-05-02
申请人： Thomas Langdo , Matthew Currie , Glyn Braithwaite , Richard Hammond , Anthony Lochtefeld , Eugene Fitzgerald
发明人： Thomas Langdo , Matthew Currie , Glyn Braithwaite , Richard Hammond , Anthony Lochtefeld , Eugene Fitzgerald
IPC分类号： H01L21/8234 , H01L29/76 , H01L31/00
CPC分类号： H01L29/785 , H01L21/76254 , H01L21/76259 , H01L21/76264 , H01L21/76275 , H01L21/84 , H01L27/1203 , H01L29/66772 , H01L29/66795 , H01L29/66916 , H01L29/7842 , H01L29/78603 , H01L29/78684 , H01L29/78687
摘要： The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication.
摘要翻译： 应变半导体的优点与基板和器件制造上的绝缘体绝缘体方法相结合。
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公开(公告)号：US20050205934A1
公开(公告)日：2005-09-22
申请号：US11126550
申请日：2005-05-11
IPC分类号： H01L21/20 , H01L21/331 , H01L21/336 , H01L21/337 , H01L21/762 , H01L21/84 , H01L27/12 , H01L29/786 , H01L31/117
CPC分类号： H01L29/7847 , H01L21/28518 , H01L21/76254 , H01L21/76256 , H01L21/76259 , H01L21/76264 , H01L21/76275 , H01L21/84 , H01L27/1203 , H01L29/0649 , H01L29/1033 , H01L29/165 , H01L29/41783 , H01L29/66242 , H01L29/66628 , H01L29/66772 , H01L29/66787 , H01L29/66916 , H01L29/7842 , H01L29/7843 , H01L29/7849 , H01L29/785 , H01L29/78603 , H01L29/78684 , H01L29/78687
摘要： The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication.
摘要翻译： 应变半导体的优点与基板和器件制造上的绝缘体绝缘体方法相结合。
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公开(公告)号：US20200091538A1
公开(公告)日：2020-03-19
申请号：US16135243
申请日：2018-09-19
申请人： Keji PAN , Sean R. BISHOP , Thomas LANGDO , Bryan M. BLACKBURN
发明人： Keji PAN , Sean R. BISHOP , Thomas LANGDO , Bryan M. BLACKBURN
IPC分类号： H01M8/1286 , H01M8/1253 , H01M8/126 , H01M8/1226
摘要： In various embodiments, techniques for fabricating solid oxide fuel cells utilize setter plates composed of or having outer surfaces composed of materials unreactive with species found in the layers of the cell.
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6.发明申请Methods for integrating lattice-mismatched semiconductor structure on insulators 审中-公开在绝缘体上整合晶格失配的半导体结构的方法公开(公告)号：US20070054467A1
公开(公告)日：2007-03-08
申请号：US11221064
申请日：2005-09-07
IPC分类号： H01L21/30
CPC分类号： H01L21/76254 , H01L21/823807 , H01L21/823878 , H01L21/84 , H01L27/1203 , H01L29/7842 , H01L29/78687
摘要： Monolithic lattice-mismatched semiconductor heterostructures are fabricated by bonding patterned substrates with alternative active-area materials formed thereon to a rigid dielectric platform and then removing the highly-defective interface areas along with the underlying substrates to produce alternative active-area regions disposed over the insulator and substantially exhausted of misfit and threading dislocations.
摘要翻译： 通过将形成在其上的替代活性区域材料的图案化衬底接合到刚性电介质平台上，然后与下面的衬底一起去除高缺陷界面区域以产生置于绝缘体上的替代有源区域区域来制造单片晶格失配的半导体异质结构 并且基本上耗尽了错配和穿线位错。
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7.发明申请Methods for forming structures including strained-semiconductor-on-insulator devices 审中-公开用于形成包括应变绝缘体上半导体器件的结构的方法公开(公告)号：US20060197126A1
公开(公告)日：2006-09-07
申请号：US11416423
申请日：2006-05-02
申请人： Anthony Lochtefeld , Thomas Langdo , Richard Hammond , Matthew Currie , Glyn Braithwaite , Eugene Fitzgerald
发明人： Anthony Lochtefeld , Thomas Langdo , Richard Hammond , Matthew Currie , Glyn Braithwaite , Eugene Fitzgerald
IPC分类号： H01L21/8234 , H01L29/76 , H01L31/00
CPC分类号： H01L29/785 , H01L21/76254 , H01L21/76259 , H01L21/76264 , H01L21/76275 , H01L21/84 , H01L27/1203 , H01L29/66772 , H01L29/66795 , H01L29/66916 , H01L29/7842 , H01L29/78603 , H01L29/78684 , H01L29/78687
摘要： The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication.
摘要翻译： 应变半导体的优点与基板和器件制造上的绝缘体绝缘体方法相结合。
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8.发明申请Strained-semiconductor-on-insulator device structures with elevated source/drain regions 有权具有升高的源极/漏极区域的应变半导体绝缘体上器件结构公开(公告)号：US20050218453A1
公开(公告)日：2005-10-06
申请号：US11125507
申请日：2005-05-10
IPC分类号： H01L21/20 , H01L21/331 , H01L21/336 , H01L21/337 , H01L21/762 , H01L21/84 , H01L27/12 , H01L29/786 , H01L27/01
CPC分类号： H01L29/7847 , H01L21/28518 , H01L21/76254 , H01L21/76256 , H01L21/76259 , H01L21/76264 , H01L21/76275 , H01L21/84 , H01L27/1203 , H01L29/0649 , H01L29/1033 , H01L29/165 , H01L29/41783 , H01L29/66242 , H01L29/66628 , H01L29/66772 , H01L29/66787 , H01L29/66916 , H01L29/7842 , H01L29/7843 , H01L29/7849 , H01L29/785 , H01L29/78603 , H01L29/78684 , H01L29/78687
摘要： The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication.
摘要翻译： 应变半导体的优点与基板和器件制造上的绝缘体绝缘体方法相结合。
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公开(公告)号：US20050189563A1
公开(公告)日：2005-09-01
申请号：US11120675
申请日：2005-05-03
IPC分类号： H01L21/20 , H01L21/331 , H01L21/336 , H01L21/337 , H01L21/762 , H01L21/84 , H01L27/12 , H01L29/786 , H01L31/072
CPC分类号： H01L29/7847 , H01L21/28518 , H01L21/76254 , H01L21/76256 , H01L21/76259 , H01L21/76264 , H01L21/76275 , H01L21/84 , H01L27/1203 , H01L29/0649 , H01L29/1033 , H01L29/165 , H01L29/41783 , H01L29/66242 , H01L29/66628 , H01L29/66772 , H01L29/66787 , H01L29/66916 , H01L29/7842 , H01L29/7843 , H01L29/7849 , H01L29/785 , H01L29/78603 , H01L29/78684 , H01L29/78687
摘要： The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication.
摘要翻译： 应变半导体的优点与基板和器件制造上的绝缘体绝缘体方法相结合。
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10.发明申请公开(公告)号：US20050156246A1
公开(公告)日：2005-07-21
申请号：US11073780
申请日：2005-03-07
IPC分类号： H01L21/20 , H01L21/336 , H01L21/337 , H01L21/762 , H01L21/84 , H01L27/12 , H01L29/786 , H01L31/0392
CPC分类号： H01L21/76254 , H01L21/02381 , H01L21/0245 , H01L21/02502 , H01L21/02505 , H01L21/0251 , H01L21/02521 , H01L21/02532 , H01L21/76259 , H01L21/76264 , H01L21/76275 , H01L21/84 , H01L27/1203 , H01L29/66772 , H01L29/66916 , H01L29/7842 , H01L29/78603 , H01L29/78684 , H01L29/78687
摘要： The benefits of strained semiconductors are combined with silicon-on-insulator approaches to substrate and device fabrication.
摘要翻译： 应变半导体的优点与基板和器件制造上的绝缘体绝缘体方法相结合。
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