摘要:
An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 μm on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.
摘要:
An image pickup apparatus includes a plurality of micro pins provided to project from a back surface in an image pickup device, a plurality of electric boards capable of mounting electric components and having board surfaces provided with through-holes or through-grooves formed to enable the plurality of micro pins to pass through respectively, and solder portions that fix the plurality of micro pins and the plurality of electric boards by soldering in land portions adjacent to the through-holes or the through grooves in a state in which the plurality of electric boards with the plurality of micro pins respectively passed through the through-holes or the through-grooves of the plurality of electric boards are stacked on the back surface of the image pickup device.
摘要:
An electronic endoscope apparatus includes: an image pickup apparatus mounted at a distal end portion of an insertion portion; an operation portion provided consecutively at the insertion portion, with a frame member incorporated therein; and an electrical cable extended from the operation portion for connection with an external device. In the electronic endoscope apparatus, the frame member has a circuit board portion which establishes electrical connection between shields of the insertion portion and the electrical cable, and on which various electronic parts for exchanging signals with the image pickup apparatus are mounted. In spite of the arrangement of the image pickup apparatus that can acquire high-quality images at a distal end portion of the insertion portion, a size of the apparatus, in particular, a diameter of the insertion portion, can be prevented from being increased.
摘要:
An outer sheath of a metal film is provided on an outer peripheral surface of a tube base layer of a channel tube which is provided within an insertion section and has flexibility. A grounding circuit provided in an operation section and the metal film are connected, and electromagnetic shield means is provided for reducing noise which is produced from a radio-frequency therapeutic device inserted in a therapeutic device insertion channel and is mixed in an electric signal output from an imaging section.
摘要:
An endoscope is connected optically removably to a TV camera through an adapter. A plurality of fixing pins is arranged on both sides of an insertion axis of an insertion part of the endoscope. A fixing unit to fix the endoscope removably is provided at the front end of an arm unit of an endoscope holder which supports the endoscope movably. The fixing unit has a claw and a movable claw, and grips the fixing pins of the endoscope releasably between the claw and the movable claw.
摘要:
A medical device supporting apparatus for supporting a medical device in a three-dimensional space, in which a holding device for holding the medical device is supported by a supporting mechanism three-dimensionally, and the state of the supporting unit is switched between the movable state and the locked state by operating a plurality of final control elements. Operation is stabilized by differentiating the amount of operating force of the plurality of final control elements.
摘要:
An electronic endoscope apparatus includes: an image pickup apparatus mounted at a distal end portion of an insertion portion; an operation portion provided consecutively at the insertion portion, with a frame member incorporated therein; and an electrical cable extended from the operation portion for connection with an external device. In the electronic endoscope apparatus, the frame member has a circuit board portion which establishes electrical connection between shields of the insertion portion and the electrical cable, and on which various electronic parts for exchanging signals with the image pickup apparatus are mounted. In spite of the arrangement of the image pickup apparatus that can acquire high-quality images at a distal end portion of the insertion portion, a size of the apparatus, in particular, a diameter of the insertion portion, can be prevented from being increased.
摘要:
A semiconductor device includes at least two or more groups of external connection terminals to which a substrate that drives a bare chip by inputting a signal from an external apparatus to the bare chip is electrically connected, the at least two or more groups of external connection terminals being formed outside an image area of the bare chip, wherein at least one group of terminals constitutes a first group of terminals, another group of terminals constitutes a second group of terminals, the first group of terminals doubles as the second group of terminals, and a substrate for inspection doubling as a substrate for mounting is electrically connected to the first group of terminals.
摘要:
An image pickup apparatus of the present invention varies optical properties by moving a part of lenses of an objective lens, and includes a solid-state image pickup device unit that is disposed at a rear-end section and that subjects a subject image to photoelectric conversion, a fixed lens frame that retains the objective lens that is disposed in front of the solid-state image pickup device unit, a movable lens frame that retains the part of lenses that moves along a photographing optical axis O inside the lens frame, and an actuator having one end connected to the movable lens frame and that moves the movable lens frame forward and backward. The actuator includes a rigid member provided so as to extend to the vicinity of the rear end at which the solid-state image pickup device unit is disposed and a shape memory alloy that is coupled to the rigid member.
摘要:
A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 μm on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.