摘要:
A semiconductor device comprises a gate electrode provided on a gate insulating film, a side wall insulating film provided on a side wall of the gate electrode through a protection insulating film, a barrier SiN film provided to cover the gate electrode and the side wall insulating film, an inter-level insulating film provided to cover the barrier SiN film, and an SOG-series high-stress material being used as part of the inter-level insulating film.
摘要:
A semiconductor device includes a semiconductor substrate having an element region, and an element isolation region formed around the element region, the element isolation region being formed of an insulation material having a higher thermal expansion coefficient than the element region.
摘要:
Since at least a portion of a trench capacitor electrode is formed by a metal, the electrical sheet resistance of the electrode can be lowered, and the signal propagation time prolonged by CR delay can be shortened. This can reduce the read/write time. The formation of a buried gate electrode can realize a reduction of the cell area, which is required in a DRAM- and a DRAM/logic-embedded device. This can increase the gate length and reduce the short channel effect. Since an insulating protective film is deposited on the gate electrode, a bit line contact can be formed in self-alignment.
摘要:
Since at least a portion of a trench capacitor electrode is formed by a metal, the electrical sheet resistance of the electrode can be lowered, and the signal propagation time prolonged by CR delay can be shortened. This can reduce the read/write time. The formation of a buried gate electrode can realize a reduction of the cell area, which is required in a DRAM- and a DRAM/logic-embedded device. This can increase the gate length and reduce the short channel effect. Since an insulating protective film is deposited on the gate electrode, a bit line contact can be formed in self-alignment.
摘要:
According to embodiments, there is provided a semiconductor device, including: a first area including plural transistors formed therein; and a second area including plural dummy transistors formed therein, the second area surrounding the first area, wherein a pitch of the dummy transistors is equal to or less than a central wavelength of a light used to form the transistors.
摘要:
A semiconductor device includes a substrate having a first area and a second area adjacent to the first area, a first silicon layer provided on the substrate in the first area, a relaxed layer which is provided on the substrate in the second area and which has a lattice constant greater than a lattice constant of the first silicon layer, and a strained-Si layer which is provided on the relaxed layer and which has a lattice constant substantially equivalent to the lattice constant of the relaxed layer.
摘要:
Element isolation regions are formed in a semiconductor substrate of a first conductivity type. A gate insulator is formed on the semiconductor substrate between the element isolation regions. A gate electrode is formed on the gate insulator. Sidewall insulating films are formed on side surfaces of the gate electrode. Trenches are formed on the semiconductor substrate between the element isolation regions and the gate electrode. A first epitaxial semiconductor layer of a second conductivity type is formed by the epitaxial growth method in each of the trenches. The first epitaxial semiconductor layer has a facet. A silicide film is formed on the first epitaxial semiconductor layer. A semiconductor region of the second conductivity type is formed in the semiconductor substrate under the first epitaxial semiconductor layer.
摘要:
A semiconductor device comprises a semiconductor substrate, a plurality of transistors provided in the semiconductor substrate, and an isolation region for isolating the plurality of transistors to one another, the isolation region being comprised of an isolating insulation film, wherein a crystal structure of at least a part of the isolating insulation film is broken.
摘要:
A semiconductor device includes a substrate having a first area and a second area adjacent to the first area, a first silicon layer provided on the substrate in the first area, a relaxed layer which is provided on the substrate in the second area and which has a lattice constant greater than a lattice constant of the first silicon layer, and a strained-Si layer which is provided on the relaxed layer and which has a lattice constant substantially equivalent to the lattice constant of the relaxed layer.
摘要:
A semiconductor device comprises a semiconductor substrate, a plurality of transistors provided in the semiconductor substrate, and an isolation region for isolating the plurality of transistors to one another, the isolation region being comprised of an isolating insulation film, wherein a crystal structure of at least a part of the isolating insulation film is broken.