Antenna, dielectric window, plasma processing apparatus and plasma processing method
    2.
    发明授权
    Antenna, dielectric window, plasma processing apparatus and plasma processing method 有权
    天线,电介质窗,等离子体处理装置和等离子体处理方法

    公开(公告)号:US09595425B2

    公开(公告)日:2017-03-14

    申请号:US13541940

    申请日:2012-07-05

    CPC分类号: H01J37/32238

    摘要: An antenna, a dielectric window, a plasma processing apparatus and a plasma processing method are capable of improving uniformity of a substrate surface processing amount in the surface of the substrate. The antenna includes the dielectric window 16; and a slot plate 20, provided on one side of the dielectric window 16, having a plurality of slots 133. The dielectric window 16 has a flat surface 146 surrounded by a ring-shaped first recess; and a plurality of second recesses 153 formed on the flat surface 146 so as to surround a center of the flat surface 146. Here, the flat surface 146 is formed on the other side of the dielectric window 16. When viewed from a thickness direction of the slot plate, a center of each second recess 153 is located within each slot 133 of the slot plate.

    摘要翻译: 天线,电介质窗,等离子体处理装置和等离子体处理方法能够提高基板表面的基板表面处理量的均匀性。 天线包括电介质窗16; 以及设置在电介质窗口16的一侧上的槽板20,具有多个狭槽133.介电窗口16具有由环形的第一凹部包围的平坦表面146; 以及形成在平坦表面146上以围绕平坦表面146的中心的多个第二凹部153.这里,平坦表面146形成在电介质窗口16的另一侧。当从厚度方向 槽板,每个第二凹槽153的中心位于槽板的每个槽133内。

    Dielectric window for plasma processing apparatus, plasma processing apparatus and method for mounting dielectric window for plasma processing apparatus
    3.
    发明授权
    Dielectric window for plasma processing apparatus, plasma processing apparatus and method for mounting dielectric window for plasma processing apparatus 有权
    用于等离子体处理装置的电介质窗,等离子体处理装置和用于等离子体处理装置的电介质窗安装方法

    公开(公告)号:US08988012B2

    公开(公告)日:2015-03-24

    申请号:US13638345

    申请日:2011-03-24

    摘要: In a dielectric window 41 for a plasma processing apparatus, a first dielectric window recess 47 is formed on an outer region of a surface of the dielectric window 41 in a diametrical direction of the dielectric window 41 at a side where plasma is generated, and the first dielectric window recess 47 is extended in a ring shape and has a tapered shape inwardly in a thickness direction of the dielectric window 41. A multiple number of second dielectric window recesses 53a to 53g are formed between the center of the dielectric window 41 and the first dielectric window recess 47, and each of the second dielectric window recesses 53a to 53g is recessed inwardly in the thickness direction of the dielectric window 41 from the surface of the dielectric window 41.

    摘要翻译: 在用于等离子体处理装置的电介质窗41中,在电介质窗41的表面的外部区域,在电介质窗口41的产生等离子体的一侧的直径方向形成有第一电介质窗凹部47, 第一电介质窗凹部47以环状延伸,并且在电介质窗口41的厚度方向上向内具有锥形。多个第二电介质窗凹部53a至53g形成在电介质窗41的中心和 第一电介质窗凹部47,并且第二电介质窗凹部53a至53g中的每一个从电介质窗41的表面沿介质窗41的厚度方向向内凹陷。

    SAMPLE TABLE AND MICROWAVE PLASMA PROCESSING APPARATUS
    4.
    发明申请
    SAMPLE TABLE AND MICROWAVE PLASMA PROCESSING APPARATUS 审中-公开
    样品台和微波等离子体处理装置

    公开(公告)号:US20120211165A1

    公开(公告)日:2012-08-23

    申请号:US13502829

    申请日:2010-09-29

    CPC分类号: H01L21/68735 H01L21/6875

    摘要: A sample table which stably holds a semiconductor wafer by maintaining smoothness of a contact surface via a lapping process and forming the contact surface to have an approximate recess shape, and a microwave plasma processing apparatus including the sample table. The sample table holds a semiconductor wafer on which a plasma process is to be performed, and includes: an adsorption plate that has a contact surface on which a lapping process has been performed and surface-contacting the semiconductor wafer, and that adsorbs the semiconductor wafer; and a supporting substrate which has a recess surface to which a noncontact surface of the adsorption plate is adhered, wherein a difference between a depth of an approximate center portion of the recess surface and a depth of a distant portion spaced apart from the approximate center portion is larger than a difference between a thickness of the adsorption plate at a portion contacting the approximate center portion and a thickness of the adsorption plate at a portion contacting the distant portion. Also, a microwave plasma processing apparatus includes the sample table.

    摘要翻译: 一种样品台,其通过经由研磨工艺保持接触表面的平滑度并形成接触表面以使其具有大致的凹陷形状,并且包括样品台的微波等离子体处理装置,稳定地保持半导体晶片。 样品台保持要在其上进行等离子体处理的半导体晶片,并且包括:吸附板,其具有在其上进行研磨工艺并与半导体晶片表面接触的接触表面,并且吸附半导体晶片 ; 以及支撑基板,其具有粘附有吸附板的非接触面的凹部表面,其中,所述凹部表面的大致中心部分的深度与远离所述凹部表面的大致中心部分间隔开的远处的深度之间的差 大于接触大致中心部分的部分的吸附板的厚度与接触远端部分的部分的吸附板的厚度之间的差。 此外,微波等离子体处理装置包括样品台。

    Method to synchronize encoding and decoding frequencies
    6.
    发明授权
    Method to synchronize encoding and decoding frequencies 失效
    同步编码和解码频率的方法

    公开(公告)号:US5841481A

    公开(公告)日:1998-11-24

    申请号:US626684

    申请日:1996-04-01

    申请人: Wataru Yoshikawa

    发明人: Wataru Yoshikawa

    CPC分类号: H04N7/56

    摘要: An encoding and decoding frequency synchronizing method capable of synchronizing the frequency on the encoder side and that on the decoder side with a small scale configuration is to be provided. A write clock generator 4 generates a write clock synchronized with input video signals. An AD converter 3 converts the input video signals into digital video signals on the basis of the write clock. A frame synchronizer 5 writes the digital signals, and reads them on the basis of a processing clock from a clock generator 6, synchronized with the transmission clock. A high efficiency encoder 7 converts the digital video signals into encoded signals on the basis of the,processing clock. A modulator 9 modulates the encoded signals on the basis of the transmission clock. A clock generator 13 generates a demodulated processing clock on the basis of the transmission clock obtained by demodulation with a demodulator 11. A high efficiency decoder 14 decodes the demodulated encoded signals with the demodulated processing clock.

    摘要翻译: 提供能够使编码器侧的频率和解码器侧的频率与小规模配置同步的编码和解码频率同步方法。 写入时钟发生器4产生与输入视频信号同步的写入时钟。 AD转换器3基于写时钟将输入视频信号转换为数字视频信号。 帧同步器5写入数字信号,并根据来自时钟发生器6的处理时钟,与传输时钟同步地读取它们。 高效率编码器7基于处理时钟将数字视频信号转换为编码信号。 调制器9基于传输时钟调制编码信号。 时钟发生器13基于通过用解调器11的解调得到的传输时钟产生解调处理时钟。高效率解码器14用解调的处理时钟解码经解调的编码信号。

    Plasma processing apparatus
    7.
    发明授权
    Plasma processing apparatus 有权
    等离子体处理装置

    公开(公告)号:US09111726B2

    公开(公告)日:2015-08-18

    申请号:US13454513

    申请日:2012-04-24

    摘要: A plasma processing apparatus includes a processing chamber, a stage, a dielectric member, a microwave introduction device, an injector, and an electric field shield. The processing chamber has a processing space therein. The stage is provided within the processing chamber. The dielectric member has a through hole and is provided to face the stage. The microwave introduction device is configured to introduce microwave into the processing space via the dielectric member. The injector has at least one through hole and is made of a dielectric material, e.g., a bulk dielectric material. The injector is provided within the dielectric member. The injector and the through hole of the dielectric member form a path for supplying a processing gas into the processing space. The electric field shield encloses the injector.

    摘要翻译: 等离子体处理装置包括处理室,载物台,电介质构件,微波引入装置,注射器和电场屏蔽。 处理室在其中具有处理空间。 工作台设置在处理室内。 电介质构件具有通孔并且设置成面向台。 微波引入装置经由电介质构件将微波引入处理空间。 喷射器具有至少一个通孔,并且由介电材料制成,例如大体电介质材料。 喷射器设置在电介质构件内。 介电构件的注射器和通孔形成用于将处理气体供应到处理空间的路径。 电场屏蔽封闭注射器。

    ANTENNA, DIELECTRIC WINDOW, PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
    8.
    发明申请
    ANTENNA, DIELECTRIC WINDOW, PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD 有权
    天线,电介质窗,等离子体加工设备和等离子体处理方法

    公开(公告)号:US20130008607A1

    公开(公告)日:2013-01-10

    申请号:US13541940

    申请日:2012-07-05

    IPC分类号: H01Q13/10 B05C11/00

    CPC分类号: H01J37/32238

    摘要: An antenna, a dielectric window, a plasma processing apparatus and a plasma processing method are capable of improving uniformity of a substrate surface processing amount in the surface of the substrate. The antenna includes the dielectric window 16; and a slot plate 20, provided on one side of the dielectric window 16, having a plurality of slots 133. The dielectric window 16 has a flat surface 146 surrounded by a ring-shaped first recess; and a plurality of second recesses 153 formed on the flat surface 146 so as to surround a center of the flat surface 146. Here, the flat surface 146 is formed on the other side of the dielectric window 16. When viewed from a thickness direction of the slot plate, a center of each second recess 153 is located within each slot 133 of the slot plate.

    摘要翻译: 天线,电介质窗,等离子体处理装置和等离子体处理方法能够提高基板表面的基板表面处理量的均匀性。 天线包括电介质窗16; 以及设置在电介质窗口16的一侧上的槽板20,具有多个狭槽133.介电窗口16具有由环形的第一凹部包围的平坦表面146; 以及形成在平坦表面146上以围绕平坦表面146的中心的多个第二凹部153.这里,平坦表面146形成在电介质窗口16的另一侧。当从厚度方向 槽板,每个第二凹槽153的中心位于槽板的每个槽133内。

    DIELECTRIC WINDOW FOR PLASMA PROCESSING APPARATUS, PLASMA PROCESSING APPARATUS AND METHOD FOR MOUNTING DIELECTRIC WINDOW FOR PLASMA PROCESSING APPARATUS
    10.
    发明申请
    DIELECTRIC WINDOW FOR PLASMA PROCESSING APPARATUS, PLASMA PROCESSING APPARATUS AND METHOD FOR MOUNTING DIELECTRIC WINDOW FOR PLASMA PROCESSING APPARATUS 有权
    用于等离子体处理装置的电介质窗口,等离子体处理装置和用于等离子体处理装置的电介质窗口安装方法

    公开(公告)号:US20130093321A1

    公开(公告)日:2013-04-18

    申请号:US13638345

    申请日:2011-03-24

    IPC分类号: H01J23/36 H01J9/44

    摘要: In a dielectric window 41 for a plasma processing apparatus, a first dielectric window recess 47 is formed on an outer region of a surface of the dielectric window 41 in a diametrical direction of the dielectric window 41 at a side where plasma is generated, and the first dielectric window recess 47 is extended in a ring shape and has a tapered shape inwardly in a thickness direction of the dielectric window 41. A multiple number of second dielectric window recesses 53a to 53g are formed between the center of the dielectric window 41 and the first dielectric window recess 47, and each of the second dielectric window recesses 53a to 53g is recessed inwardly in the thickness direction of the dielectric window 41 from the surface of the dielectric window 41.

    摘要翻译: 在用于等离子体处理装置的电介质窗41中,在电介质窗41的表面的外部区域,在电介质窗口41的产生等离子体的一侧的直径方向形成有第一电介质窗凹部47, 第一电介质窗凹部47以环状延伸,并且在电介质窗口41的厚度方向上向内具有锥形。多个第二电介质窗凹部53a至53g形成在电介质窗41的中心和 第一电介质窗凹部47,并且第二电介质窗凹部53a至53g中的每一个从电介质窗口41的表面沿电介质窗41的厚度方向向内凹陷。