摘要:
An operating method for a non-volatile memory device is applicable on a non-volatile memory device in which a substrate is disposed. The substrate includes a trench, a first conductive type first well region disposed in the substrate, and a second conductive type second well region disposed above the first conductive type first well region. The operating method includes applying a first voltage to a control gate, a second voltage to a drain region, and a third voltage to a source region. Besides, a channel F-N tunneling effect is employed to program a memory cell.
摘要:
A non-volatile memory is provided. A substrate having a number of trenches and a number of select gates is provided. The trenches are arranged in parallel and extend in a first direction. Each of the select gates is disposed on the substrate between two adjacent trenches respectively. A number of select gate dielectric layers are disposed between the select gates and the substrate. A number of composite layers are disposed over the surface of the trenches and each composite layer has a charge trapping layer. A number of word lines are arranged in parallel in a second direction, wherein each of the word lines fills the trenches between adjacent select gates and is disposed over the composite layers.
摘要:
A non-volatile memory including at least a substrate, a memory cell and source/drain regions is provided. The memory cell is disposed on the substrate and includes at least a first memory unit and a second memory unit. Wherein, the first memory unit, from the substrate up, includes a floating gate and a first control gate. The second memory unit is disposed on a sidewall of the first memory unit and includes a charge trapping layer and a second control gate. The two source/drain regions are disposed in the substrate at both sides of the memory cell.
摘要:
A non-volatile memory is provided. A substrate having a plurality of trenches and a plurality of select gates is provided. The trenches are arranged in parallel and extend in a first direction. Each of the select gates is disposed on the substrate between two adjacent trenches respectively. A plurality of select gate dielectric layers are disposed between the select gates and the substrate. A plurality of composite layers are disposed over the surface of the trenches and each composite layer has a charge trapping layer. A plurality of word lines are arranged in parallel in a second direction, wherein each of the word lines fills the trenches between adjacent select gates and is disposed over the composite layers.
摘要:
A non-volatile memory is provided. A substrate has at least two isolation structures therein to define an active area. A well is located in the substrate. A shallow doped region is located in the well. At least two stacked gate structures are located on the substrate. Pocket doped regions are located in the substrate at the peripheries of the stacked gate structures; each of the pocket doped regions extends under the stacked gate structure. Drain regions are located in the pocket doped regions at the peripheries of the stacked gate structures. An auxiliary gate layer is located on the substrate between the stacked gate structures. A gate dielectric layer is located between the auxiliary gate layer and the substrate and between the auxiliary gate layer and the stacked gate structure. Plugs are located on the substrate and extended to connect with the pocket doped region and the drain regions therein.
摘要:
A programmable and erasable digital switch device is provided. An N-type memory transistor and a P-type memory transistor are formed over a substrate. The N-type memory transistor includes a first N-type doped region, a second N-type doped region, a first charge storage layer and a first control gate. The P-type memory transistor includes a first P-type doped region, a second P-type doped region, a second charge storage layer and a second control gate. A common bit line doped region is formed between the N-type memory transistor and the P type memory transistor and electrically connects the first N-type region to the second P-type doped region. A word line electrically connects the first control gate to the second control gate.
摘要:
A non-volatile memory including a plurality of memory units is provided. Each of the memory units includes a first memory cell and a second memory cell. The first memory cell is disposed over the substrate. The second memory cell is disposed next to the sidewall of the first memory cell and over the substrate. The first memory cell includes a first gate disposed over the substrate, a first composite dielectric layer disposed between the first gate and the substrate. The second memory cell includes a second gate disposed over the substrate and a second composite dielectric layer disposed between the second gate and the substrate and between the second gate and the first memory cell. Each of the first and second composite dielectric layers includes a bottom dielectric layer, a charge-trapping layer and a top dielectric layer.
摘要:
A method of programming a flash memory through boosting a voltage level of a source line. The flash memory has n memory cell transistors cascaded in series, a local bit line positioned above the n memory cell transistors, a buried bit line positioned under the n memory cell transistors, and a source line positioned under the buried bit line. The method includes inputting a word line voltage to a control gate of a kth memory cell transistor, and after floating the local bit line, inputting a source line voltage to the source line for inducing an FN tunneling effect inside the kth memory cell transistor through capacitance coupling between the buried bit line and the source line.
摘要:
A non-volatile memory including at least a substrate, a memory cell and source/drain regions is provided. The memory cell is disposed on the substrate and includes at least a first memory unit and a second memory unit. Wherein, the first memory unit, from the substrate up, includes a floating gate and a first control gate. The second memory unit is disposed on a sidewall of the first memory unit and includes a charge trapping layer and a second control gate. The two source/drain regions are disposed in the substrate at both sides of the memory cell.
摘要:
A flash memory cell is provided. A deep well is disposed in a substrate and a well is disposed within the deep well. A stacked gate structure is disposed on the substrate. A source region and a drain region are disposed in the substrate on each side of the stacked gate structure. A select gate is disposed between the stacked gate structure and the source region. A first gate dielectric layer is disposed between the select gate and the stacked gate structure. A second gate dielectric layer is disposed between the select gate and the substrate. A shallow doped region is disposed in the substrate under the stacked gate structure and the select gate. A deep doped region is disposed in the substrate on one side of the stacked gate structure. The conductive plug on the substrate extends through the drain region and the deep doped region.