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公开(公告)号：US20120319109A1
公开(公告)日：2012-12-20
申请号：US13594949
申请日：2012-08-27
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
IPC分类号： H01L23/544
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译： 电子设备及其制造。 一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片以及在第二表面上的第二负载电极。 第一引线电耦合到控制电极。 第二引线电耦合到第一负载电极。 第三引线电耦合到第一负载电极，第三引线与第二引线分离。 第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。
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公开(公告)号：US20090212284A1
公开(公告)日：2009-08-27
申请号：US12035598
申请日：2008-02-22
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译： 电子设备及其制造。 一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片以及在第二表面上的第二负载电极。 第一引线电耦合到控制电极。 第二引线电耦合到第一负载电极。 第三引线电耦合到第一负载电极，第三引线与第二引线分离。 第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。
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公开(公告)号：US08618644B2
公开(公告)日：2013-12-31
申请号：US13594949
申请日：2012-08-27
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Veldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Veldvoss
IPC分类号： H01L23/02
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译： 电子设备及其制造。 一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片，在第二表面上提供第二负载电极。 第一引线电耦合到控制电极。 第二引线电耦合到第一负载电极。 第三引线电耦合到第一负载电极，第三引线与第二引线分离。 第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。
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4.发明授权Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof 有权该装置包括耦合到半导体芯片的半导体芯片和引线及其制造公开(公告)号：US08253225B2
公开(公告)日：2012-08-28
申请号：US12035598
申请日：2008-02-22
申请人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
发明人： Ralf Otremba , Marco Seibt , Uwe Kirchner , Wolfgang Peinhopf , Michael Treu , Andreas Schloegl , Mario Feldvoss
IPC分类号： H01L23/02
CPC分类号： H01L23/4952 , H01L23/49562 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4917 , H01L2224/49175 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
摘要： An electronic device and manufacturing thereof. One embodiment provides a semiconductor chip having a control electrode and a first load electrode on a first surface and a second load electrode on a second surface. A first lead is electrically coupled to the control electrode. A second lead is electrically coupled to the first load electrode. A third lead is electrically coupled to the first load electrode, the third lead being separate from the second lead. A fourth lead is electrically coupled to the second load electrode, the second and third leads being arranged between the first and fourth leads.
摘要翻译： 电子设备及其制造。 一个实施例提供了在第一表面上具有控制电极和第一负载电极的半导体芯片以及在第二表面上的第二负载电极。 第一引线电耦合到控制电极。 第二引线电耦合到第一负载电极。 第三引线电耦合到第一负载电极，第三引线与第二引线分离。 第四引线电耦合到第二负载电极，第二和第三引线布置在第一和第四引线之间。
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