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    Enclosed cavity structures
    1.
    发明授权
    Enclosed cavity structures 有权

    公开(公告)号：US12162747B2

    公开(公告)日：2024-12-10

    申请号：US17027671

    申请日：2020-09-21

    Applicant: X-Celeprint Limited

    Inventor： Ronald S. Cok ,  Raja Fazan Gul ,  António José Marques Trindade

    IPC: B81B7/00 ,  B81C1/00 ,  H10N30/02 ,  H10N30/88

    Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

    Micro-device structures with etch holes
    2.
    发明授权
    Micro-device structures with etch holes 有权

    公开(公告)号：US12006205B2

    公开(公告)日：2024-06-11

    申请号：US17475046

    申请日：2021-09-14

    Applicant: X-Celeprint Limited

    Inventor： António José Marques Trindade ,  Pierluigi Rubino

    IPC: B81B1/00 ,  H10N30/30

    CPC classification number: B81B1/004 ,  H10N30/306 ,  B81B2201/058 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/0353

    Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

    TRANSFER-PRINTED MICRO-OPTICAL COMPONENTS
    4.
    发明公开
    TRANSFER-PRINTED MICRO-OPTICAL COMPONENTS 审中-公开

    公开(公告)号：US20240118489A1

    公开(公告)日：2024-04-11

    申请号：US18062844

    申请日：2022-12-07

    Applicant: X-Celeprint Limited ,  SUSS MicroOptics SA

    Inventor： Ronald S. Cok ,  Wilfried Noell ,  David Gomez ,  Ruggero Loi

    IPC: G02B6/12 ,  G02B6/138

    CPC classification number: G02B6/12004 ,  G02B6/138 ,  G02B2006/12085 ,  G02B2006/12173 ,  G02B2006/12176

    Abstract: An exemplary micro-optical component includes a micro-substrate and a micro-optical element disposed on the micro-substrate. The micro-optical element is structured to modify or process light. At least a portion of a component tether is physically attached to the micro-substrate or physically attached to the micro-optical element. The micro-optical component has a thickness less than 250 μm. Light can be processed by reflection, refraction, diffraction, frequency changes, polarization changes, color-temperature or frequency distribution changes, or phase changes. The micro-optical component can be disposed on a system substrate to form a micro-optical system. The system substrate can include a cavity and the micro-optical element can be disposed at least partially in the cavity. Micro-optical components can be passive optical micro-devices. A light-active element can be disposed on the micro-substrate to receive light from or emit light to the micro-optical element.

    Micro-device structures with etch holes
    5.
    发明授权
    Micro-device structures with etch holes 有权

    公开(公告)号：US11952266B2

    公开(公告)日：2024-04-09

    申请号：US17066448

    申请日：2020-10-08

    Applicant: X-Celeprint Limited

    Inventor： Pierluigi Rubino

    IPC: B81C1/00

    CPC classification number: B81C1/00039 ,  B81C1/00523 ,  B81C1/00555 ,  B81C2201/0105 ,  B81C2201/013

    Abstract: A micro-device structure comprises a source substrate having a sacrificial layer comprising a sacrificial portion adjacent to an anchor portion, a micro-device disposed completely over the sacrificial portion, the micro-device having a top side opposite the sacrificial portion and a bottom side adjacent to the sacrificial portion and comprising an etch hole that extends through the micro-device from the top side to the bottom side, and a tether that physically connects the micro-device to the anchor portion. A micro-device structure comprises a micro-device disposed on a target substrate. Micro-devices can be any one or more of an antenna, a micro-heater, a power device, a MEMs device, and a micro-fluidic reservoir.

    STAMPS WITH STRUCTURED MICROPOSTS
    9.
    发明公开
    STAMPS WITH STRUCTURED MICROPOSTS 审中-公开

    公开(公告)号：US20230197479A1

    公开(公告)日：2023-06-22

    申请号：US17554310

    申请日：2021-12-17

    Applicant: X-Celeprint Limited

    Inventor： Kyle Bryant Benkendorfer ,  Ronald S. Cok

    IPC: H01L21/67

    CPC classification number: H01L21/67144

    Abstract: A stamp includes a rigid support and an array of posts disposed in combination with the rigid support. Each of the posts in the array of posts extends in a direction away from the rigid support. The distal end of each of the posts in the array of posts has a structured three-dimensional surface including a first micro-post that extends a first distance away from the rigid support and a second micro-post that extends a second distance away from the rigid support. The second distance is less than the first distance.

    PRINTABLE COMPONENT MODULES WITH FLEXIBLE, POLYMER, OR ORGANIC MODULE SUBSTRATES
    10.
    发明申请
    PRINTABLE COMPONENT MODULES WITH FLEXIBLE, POLYMER, OR ORGANIC MODULE SUBSTRATES 有权

    公开(公告)号：US20220285291A1

    公开(公告)日：2022-09-08

    申请号：US17588888

    申请日：2022-01-31

    Applicant: X-Celeprint Limited

    Inventor： António José Marques Trindade ,  Ronald S. Cok ,  Pierluigi Rubino

    IPC: H01L23/00 ,  H01L21/683 ,  H01L21/56 ,  H01L25/10 ,  H01L25/16 ,  H01L25/13 ,  H01L25/18 ,  H01L25/075 ,  H01L25/00

    Abstract: A micro-component module comprises a module substrate, a component disposed on the module substrate, and at least a portion of a module tether in contact with the module substrate. The module substrate can be flexible or can comprise an organic material, or both. The module tether can be more brittle and less flexible than the module substrate. The component can be less flexible than the module substrate and can comprise at least a portion of a component tether. An encapsulation layer can be disposed over the component and module substrate. The component can be disposed in a mechanically neutral stress plane of the micro-component module. A micro-component module system can comprise a micro-component module disposed on a flexible system substrate, for example by micro-transfer printing. A micro-component module can comprise an internal module cavity in the module substrate with internal module tethers physically connecting the module substrate to internal anchors.

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