公开(公告)号：US20150380355A1

公开(公告)日：2015-12-31

申请号：US14766333

申请日：2014-02-05

申请人： John A. ROGERS ,  Jonathan FAN ,  Woon-Hong YEO ,  Yewang SU ,  Yonggang HUANG ,  Yihui ZHANG ,  THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS ,  NORTHWESTERN UNIVERSITY

发明人： John A. ROGERS ,  Jonathan FAN ,  Woon-Hong YEO ,  Yewang SU ,  Yonggang HUANG ,  Yihui ZHANG

IPC分类号： H01L23/538 ,  H01L23/552 ,  H01L23/22 ,  H01L23/24 ,  H05K1/02 ,  H01L23/00

CPC分类号： H01L23/5387 ,  H01L23/538 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/564 ,  H01L24/97 ,  H01L29/78603 ,  H01L2224/16225 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K1/0283 ,  H01L2924/00

摘要： The present invention provides electronic circuits, devices and device components including one or more stretchable components, such as stretchable electrical interconnects, electrodes and/or semiconductor components. Stretchability of some of the present systems is achieved via a materials level integration of stretchable metallic or semiconducting structures with soft, elastomeric materials in a configuration allowing for elastic deformations to occur in a repeatable and well-defined way. The stretchable device geometries and hard-soft materials integration approaches of the invention provide a combination of advance electronic function and compliant mechanics supporting a broad range of device applications including sensing, actuation, power storage and communications.

摘要翻译： 本发明提供了包括一个或多个可伸缩部件的电子电路，器件和器件部件，例如可拉伸电互连，电极和/或半导体部件。 本发明的一些系统的拉伸性通过可拉伸的金属或半导体结构与柔性的弹性体材料的材料级整合来实现，该结构允许弹性变形以可重复和明确的方式进行。 本发明的可拉伸装置几何形状和硬 - 软材料集成方法提供了前进电子功能和顺应力学的组合，其支持广泛的装置应用，包括感测，致动，蓄电和通信。

公开(公告)号：US20150373831A1

公开(公告)日：2015-12-24

申请号：US14766301

申请日：2014-02-05

申请人： Lin JIA ,  Yonggang HUANG ,  John A. ROGERS ,  Sheng XU ,  Jonathan A Fan ,  Yihui Zhang ,  THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS ,  NORTHWESTERN UNIVERSITY

发明人： John A. ROGERS ,  Sheng XU ,  Jonathan A. FAN ,  Yonggang HUANG ,  Yihui ZHANG ,  Lin JIA

IPC分类号： H05K1/02 ,  H05K1/03 ,  H01G11/26 ,  H01M10/02 ,  H05K3/30 ,  H01M2/02 ,  H01M2/20 ,  H01M10/0525 ,  H05K1/18 ,  H01G11/58

CPC分类号： H01M10/02 ,  H01G11/26 ,  H01G11/78 ,  H01L21/54 ,  H01L23/18 ,  H01L23/22 ,  H01L2224/16225 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01M2/0202 ,  H01M2/0237 ,  H01M2/204 ,  H01M2/206 ,  H01M8/02 ,  H01M10/0525 ,  H05K1/0283 ,  H05K1/189 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2201/10037 ,  Y10T29/49126 ,  H01L2924/00

摘要： The present invention provides electronic systems, including device arrays, comprising functional device(s) and/or device component(s) at least partially enclosed via one or more containment chambers, such that the device(s) and/or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in containment chambers of electronic devices of the invention include lubricants, electrolytes and/or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and/or device components provided in free-standing and/or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component.

摘要翻译： 本发明提供电子系统，包括装置阵列，其包括通过一个或多个容纳室至少部分封闭的功能装置和/或装置部件，使得装置和/或装置部件 ）至少部分地，并且任选地完全浸没在容纳流体中。 用于本发明的电子装置的容纳室中的有用的容纳液包括润滑剂，电解质和/或电阻性流体。 在一些实施例中，例如，本发明的电子系统包括一个或多个电子设备和/或设备组件，这些电子设备和/或设备组件以独立和/或系留配置的形式提供，其将来自于自由空间的支撑衬底的变形，拉伸或压缩， 站立或系留设备或设备组件。