Abstract:
A non-volatile semiconductor memory device, including a memory array having a plurality of first bit line groups and a plurality of second bit line groups that are alternately arranged to be adjacent each other, a plurality of data lines, a plurality of first page buffers, a plurality of second page buffers, and a plurality of switches. Each of the first page buffers is electrically connected to a corresponding one of the first bit line groups and arranged on a first side of the memory array. The first page buffers transmit data to the data lines. Each of the second page buffers is electrically connected to a corresponding one of the second bit line groups and arranged on a second side of the memory array. Each of the switches enables data transmission between a corresponding one of the first page buffers and a corresponding one of the second page buffers.
Abstract:
Provided are a flash memory device and method of controlling certain program operation voltages. The flash memory device includes a high voltage generation circuit providing a high voltage to a block selection circuit and a program voltage to a row decoder. The high voltage generation circuit includes a charge pump, a high voltage control circuit controlling the charge pump to provide the high voltage, and a program voltage control circuit providing the program voltage in relation to the high voltage, wherein the high voltage control circuit and the program voltage control circuit operate in response to the same control code.
Abstract:
Provided are a flash memory device and method of controlling certain program operation voltages. The flash memory device includes a high voltage generation circuit providing a high voltage to a block selection circuit and a program voltage to a row decoder. The high voltage generation circuit includes a charge pump, a high voltage control circuit controlling the charge pump to provide the high voltage, and a program voltage control circuit providing the program voltage in relation to the high voltage, wherein the high voltage control circuit and the program voltage control circuit operate in response to the same control code.
Abstract:
A semiconductor device includes a plurality of fuses, and a plurality of latch circuits respectively electrically connected to the plurality of fuses. The plurality of latch circuits are configured to store respective fuse-cut information from the plurality of fuses, and to then sequentially transmit the fuse-cut information through the latch circuits to output sequential data indicative of a fuse-cut state of the plurality of fuses.
Abstract:
A redundancy selector circuit for use in a non-volatile memory device include a ROM cell array, in which defective addresses are stored, including a plurality of ROM cells arranged in a matrix of rows and columns; a ROM controller for sequentially selecting rows of the ROM cell array at power-up; a sense amplifier block for sensing and amplifying data bits from ROM cells of the respective rows selected sequentially according to the control of the ROM controller; a latch block for receiving data bits sensed by the sense amplifier block through a switch circuit and latching the input data bits as a defective address; and a comparator block for detecting whether an address input in a normal operation matches one of the defective addresses stored in the latch block. As the rows are sequentially selected, the defective addresses of the ROM cell array are transferred to the latch block through the sense amplifier block by means of serial transfer.
Abstract:
A reference voltage generating circuit provides a stabilized reference voltage and includes; a clock generator providing a clock signal, a high voltage generator providing a pumping voltage in response to the clock signal, a ripple eradicator providing a static voltage by removing voltage ripple from the pumping voltage, and a reference voltage generator providing the reference voltage.
Abstract:
A redundancy selector circuit for use in a non-volatile memory device include a ROM cell array, in which defective addresses are stored, including a plurality of ROM cells arranged in a matrix of rows and columns; a ROM controller for sequentially selecting rows of the ROM cell array at power-up; a sense amplifier block for sensing and amplifying data bits from ROM cells of the respective rows selected sequentially according to the control of the ROM controller; a latch block for receiving data bits sensed by the sense amplifier block through a switch circuit and latching the input data bits as a defective address; and a comparator block for detecting whether an address input in a normal operation matches one of the defective addresses stored in the latch block. As the rows are sequentially selected, the defective addresses of the ROM cell array are transferred to the latch block through the sense amplifier block by means of serial transfer.
Abstract:
A semiconductor device includes a plurality of fuses, and a plurality of latch circuits respectively electrically connected to the plurality of fuses. The plurality of latch circuits are configured to store respective fuse-cut information from the plurality of fuses, and to then sequentially transmit the fuse-cut information through the latch circuits to output sequential data indicative of a fuse-cut state of the plurality of fuses.
Abstract:
A reference voltage generating circuit provides a stabilized reference voltage and includes; a clock generator providing a clock signal, a high voltage generator providing a pumping voltage in response to the clock signal, a ripple eradicator providing a static voltage by removing voltage ripple from the pumping voltage, and a reference voltage generator providing the reference voltage.
Abstract:
A flash memory device includes a flash memory cell array, and an interface circuit, which receives a command and addresses sequentially in synchronization to an external system clock after a predetermined first latency is elapsed from when a chip enable signal is activated, in a read operation, in a program operation, and in an erase operation. The interface circuit receives the command in response to activation of an invoke signal. Therefore, since the flash memory device does not require CLE (Command Latch Enable) signals, ALE (Address Latch Enable) signals, RE (Read Enable) signals and WE (Write Enable) signals, internal circuits of the flash memory device can be simply controlled, thereby reducing a probability of skew generation in chips, improving performance, and decreasing the number of required pins.