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公开(公告)号:US20190028034A1
公开(公告)日:2019-01-24
申请号:US15657786
申请日:2017-07-24
申请人: ABB Schweiz AG
发明人: Arturo Silva , Loc Ngo , Richard Yeager , Jouni Uusitalo
CPC分类号: H02M3/33569 , H02M3/285 , H02M3/3353 , H02M3/33592 , H05K1/0263 , H05K1/181 , H05K1/182 , H05K2201/09 , H05K2201/10303
摘要: A power converter is provided. The power converter includes an input side having a first input winding and a second input winding coupled in electrical series to the first input winding. The power converter also includes an output side having a first output winding and a second output winding coupled in electrical parallel to the first output winding.
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公开(公告)号:US20170330010A1
公开(公告)日:2017-11-16
申请号:US15152504
申请日:2016-05-11
申请人: WAQAS KHALID
发明人: WAQAS KHALID
CPC分类号: G06K9/0002 , G01R27/2605 , G06K9/0008 , H05K1/185 , H05K2201/09 , H05K2201/10015 , H05K2201/10151
摘要: An arrangement of individually addressable nanostructures (200) in an array format on a substrate (100) (non-conducting, flexible or rigid) with electrical portions (conducing) in the substrate where the electrical portions form electrical contacts with the nanostructures is utilized to form individually addressable nanostructures. The said nanostructures can be 1-1 000 000 nm in base size and range from 1-1000 000 nm in height. The distance between the said nanostructures in the array can also range from 10-1 000 000 nm. The said nanostructures are covered in a dielectric material (300) (air, polymer, ceramic) that is at least 5-5 00 000 nm thicker than the height of the said nanostructures. The dielectric properties of the dielectric material are an important component in determining the capacitance/supercapacitance properties of the fingerprint device. A top electrode (400) is placed on the face of dielectric film opposite to the face in contact with the substrate where nanostructures are arranged. A top layer (500) (glass or Other robust material) is placed on top of the top metal electrode. A voltage V (900) is applied between the nanostructures (200) and the top electrodes (400), an intense electric field (600) is generated between the nanostructures (200) and the top electrode (400). The direction of the said electrical field is dependent on the polarity of the voltage applied. The electric capacitance (700) between the nanostructures and the top electrode as formed. When a finger (1000) is placed on the device, the ridges (1001) of the fingerprints make contact with the top layer (500) of the device causing a signal, (a change in the capacitance of the device) that can be detected using external circuits. The valleys (1002) of the finger do not make contact with the top layer (500) device and hence do not produce a signal. If a pressure is applied on the top layer (500), the distance between the top electrode (400) and the nanostructures (200) is reduced, causing a change in the capacitance, allowing measurement of pressure. Since the nanostructures (200) are distributed on a surface (2000) in sections (2010) we can obtain special resolution of pressure on a surface or gather fingerprints using a cost effective, low power, robust and stand-alone portable, miniature system.
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公开(公告)号:US20180263143A1
公开(公告)日:2018-09-13
申请号:US15706535
申请日:2017-09-15
申请人: Wistron NeWeb Corp.
发明人: Jen-Yung Chang , Tiao-Ming Hsu
CPC分类号: H05K9/0032 , H05K1/0216 , H05K3/0052 , H05K3/3405 , H05K7/20445 , H05K9/0003 , H05K9/0073 , H05K2201/09 , H05K2201/10371
摘要: A shield is provided, including a frame and a cover. The frame includes a plurality of frame side walls and a frame top structure. Each frame side wall includes at least one frame side wall wedge. The frame side walls are connected to the frame top structure, and the frame top structure includes at least one cantilever beam. The cover includes a plurality of cover side walls and a cover top structure. Each cover side wall includes at least one cover side wall opening. The frame side wall wedge is adapted to be wedged into the cover side wall opening to restrict the movement of the cover in a first direction. The cover side walls are connected to the cover top structure. The cover top structure includes at least one cover top opening. The cantilever beam is wedged into and abuts the cover top opening.
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公开(公告)号:US20170336019A1
公开(公告)日:2017-11-23
申请号:US15281899
申请日:2016-09-30
发明人: Gengpeng LIU , Hongtao SUN
IPC分类号: F16M11/18 , F16M11/12 , F16M13/02 , H05K3/36 , H05K1/02 , H02K16/00 , B65H75/44 , H02K7/00 , H02K3/50 , G03B17/56
CPC分类号: F16M11/18 , B65H75/4486 , B65H2701/34 , F16M11/12 , F16M11/123 , F16M13/022 , G03B17/561 , H02K3/50 , H02K7/003 , H02K16/00 , H05K1/028 , H05K1/0281 , H05K1/147 , H05K1/189 , H05K3/36 , H05K2201/051 , H05K2201/052 , H05K2201/056 , H05K2201/09 , H05K2201/1009
摘要: A gimbal and a method for winding a flexible cable on a gimbal are provided. The gimbal includes a first motor and a second motor connected with each other. The flexible cable includes a connection unit and a connection end connected with each other, and the connection end is extended from the connection unit. The gimbal winding method includes winding the connection unit on the first motor while allowing the connection end to be electrically connected with the second motor.
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公开(公告)号:US20170013740A1
公开(公告)日:2017-01-12
申请号:US15203895
申请日:2016-07-07
CPC分类号: H02K7/145 , H01L23/34 , H02K9/22 , H02K11/33 , H05K1/0203 , H05K1/0271 , H05K1/181 , H05K2201/09 , H05K2201/10166 , H05K2201/2036
摘要: A power tool and a printed circuit board assembly (“PCBA”) for the power tool. The PCBA includes, for example, a printed circuit board (“PCB”), a heat sink, a spacer between the PCB and the heat sink, and a gap pad. The PCB and the heat sink are fastened to one another via fasteners so the spacer absorbs excess forces torsional forces from torques applied to the fasteners. The gap pad is placed within an opening or recess of the spacer to contact one or more FETs on the PCB. In some embodiments, the PCBA includes a second heat sink or rigid member on the opposite side of the PCB than the spacer to further distribute excess torsional forces from torques applied to the fasteners.
摘要翻译: 用于电动工具的电动工具和印刷电路板组件(“PCBA”)。 PCBA包括例如印刷电路板(“PCB”),散热器,PCB和散热器之间的间隔物,以及间隙垫。 PCB和散热器通过紧固件彼此紧固,因此间隔件吸收过多的扭矩,从扭矩施加到紧固件上。 间隙垫放置在间隔件的开口或凹槽内以接触PCB上的一个或多个FET。 在一些实施例中,PCBA在PCB的相对侧上包括第二散热器或刚性构件,而不是间隔件,以进一步将过量的扭转力分配给施加到紧固件上的扭矩。
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公开(公告)号:US09430072B2
公开(公告)日:2016-08-30
申请号:US14473939
申请日:2014-08-29
申请人: Wintek Corporation
发明人: Yi-Chun Lin , Ming-Kung Wu , Hsiao-Ping Li , Ping-Wen Huang , Cheng-Yi Chou , Yu-Hua Wu , Xuan-Chang Shiu , Chih-Yuan Wang , Ching-Fu Hsu , Hsiao-Hui Liao , Ting-Yu Chang , Fa-Cheng Wu , Wen-Chun Wang
CPC分类号: G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0306 , H05K1/0393 , H05K2201/017 , H05K2201/09 , H05K2201/10106 , H05K2201/10128
摘要: A touch panel includes a cover glass, a flexible substrate, and a touch-sensing electrode structure. The flexible substrate is connected to the cover glass via a bonding layer, and the touch-sensing electrode structure is formed on the flexible substrate. The cover glass, the bonding layer, the flexible substrate and the touch-sensing electrode structure are arranged in order, with the flexible substrate being located between the touch-sensing electrode structure and the bonding layer.
摘要翻译: 触摸面板包括盖玻璃,柔性基板和触摸感应电极结构。 柔性基板通过接合层与盖玻璃连接,并且在柔性基板上形成触摸感应电极结构。 盖板玻璃,接合层,柔性基板和触摸感应电极结构依次布置,柔性基板位于触摸感应电极结构和接合层之间。
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公开(公告)号:US09953202B2
公开(公告)日:2018-04-24
申请号:US15152504
申请日:2016-05-11
申请人: Waqas Khalid
发明人: Waqas Khalid
CPC分类号: G06K9/0002 , G01R27/2605 , G06K9/0008 , H05K1/185 , H05K2201/09 , H05K2201/10015 , H05K2201/10151
摘要: An arrangement of individually addressable nanostructures (200) in an array format on a substrate (100) (non-conducting, flexible or rigid) with electrical portions (conducing) in the substrate where the electrical portions form electrical contacts with the nanostructures is utilized to form individually addressable nanostructures. The said nanostructures can be 1-1,000,000 nm in base size and range from 1-1,000,000 nm in height. The distance between the said nanostructures in the array can also range from 10-1,000,000 nm. The said nanostructures are covered in a dielectric material (300) (air, polymer, ceramic) that is at least 5-500,000 nm thicker than the height of the said nanostructures. The dielectric properties of the dielectric material are an important component in determining the capacitance/supercapacitance properties of the fingerprint device. A top electrode (400) is placed on the face of dielectric film opposite to the face in contact with the substrate where nanostructures are arranged. A top layer (500) (glass or Other robust material) is placed on top of the top metal electrode. A voltage V (900) is applied between the nanostructures (200) and the top electrodes (400), an intense electric field (600) is generated between the nanostructures (200) and the top electrode (400). The direction of the said electrical field is dependent on the polarity of the voltage applied. The electric capacitance (700) between the nanostructures and the top electrode as formed. When a finger (1000) is placed on the device, the ridges (1001) of the fingerprints make contact with the top layer (500) of the device causing a signal, (a change in the capacitance of the device) that can be detected using external circuits. The valleys (1002) of the finger do not make contact with the top layer (500) device and hence do not produce a signal. If a pressure is applied on the top layer (500), the distance between the top electrode (400) and the nanostructures (200) is reduced, causing a change in the capacitance, allowing measurement of pressure. Since the nanostructures (200) are distributed on a surface (2000) in sections (2010) we can obtain special resolution of pressure on a surface or gather fingerprints using a cost effective, low power, robust and stand-alone portable, miniature system.
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公开(公告)号:US20140368761A1
公开(公告)日:2014-12-18
申请号:US14473939
申请日:2014-08-29
申请人: Wintek Corporation
发明人: Yi-Chun LIN , Ming-Kung WU , Hsiao-Ping LI , Ping-Wen HUANG , Cheng-Yi CHOU , Yu-Hua WU , Xuan-Chang SHIU , Chih-Yuan WANG , Ching-Fu HSU , Hsiao-Hui LIAO , Ting-Yu CHANG , Fa-Cheng WU , Wen-Chun WANG
CPC分类号: G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0306 , H05K1/0393 , H05K2201/017 , H05K2201/09 , H05K2201/10106 , H05K2201/10128
摘要: A touch panel includes a cover glass, a flexible substrate, and a touch-sensing electrode structure. The flexible substrate is connected to the cover glass via a bonding layer, and the touch-sensing electrode structure is formed on the flexible substrate. The cover glass, the bonding layer, the flexible substrate and the touch-sensing electrode structure are arranged in order, with the flexible substrate being located between the touch-sensing electrode structure and the bonding layer.
摘要翻译: 触摸面板包括盖玻璃,柔性基板和触摸感应电极结构。 柔性基板通过接合层与盖玻璃连接,并且在柔性基板上形成触摸感应电极结构。 盖板玻璃,接合层,柔性基板和触摸感应电极结构依次布置,柔性基板位于触摸感应电极结构和接合层之间。
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公开(公告)号:US08854326B2
公开(公告)日:2014-10-07
申请号:US13493524
申请日:2012-06-11
申请人: Yi-Chun Lin , Ming-Kung Wu , Hsiao-Ping Li , Ping-Wen Huang , Cheng-Yi Chou , Yu-Hua Wu , Xuan-Chang Shiu , Chih-Yuan Wang , Ching-Fu Hsu , Shiao-Hui Liao , Ting-Yu Chang , Fa-Chen Wu , Wen-Chun Wang
发明人: Yi-Chun Lin , Ming-Kung Wu , Hsiao-Ping Li , Ping-Wen Huang , Cheng-Yi Chou , Yu-Hua Wu , Xuan-Chang Shiu , Chih-Yuan Wang , Ching-Fu Hsu , Shiao-Hui Liao , Ting-Yu Chang , Fa-Chen Wu , Wen-Chun Wang
IPC分类号: G06F3/041
CPC分类号: G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0306 , H05K1/0393 , H05K2201/017 , H05K2201/09 , H05K2201/10106 , H05K2201/10128
摘要: A touch panel structure and the manufacturing method thereof are disclosed, in which the manufacturing method includes the steps of: providing a bonding layer; and forming a conductive pattern layer on the bonding layer; wherein the conductive pattern layer is composed of at least one first and at least one second major conductors with an insulation layer interposed between the first and the second major conductors. Comparing with the prior art for manufacturing touch panels, the disclosure is advantageous in material cost, production cost, and production yield; moreover, the panel lamination process can be simplified and the touch panel structure can be joined to a planar or curvy panel and facilitate the design of a thinner product.
摘要翻译: 公开了触摸屏结构及其制造方法,其中制造方法包括以下步骤:提供接合层; 以及在所述接合层上形成导电图案层; 其中所述导电图案层由至少一个第一和至少一个第二主导体构成,绝缘层插入在所述第一和第二主导体之间。 与用于制造触摸板的现有技术相比,本发明在材料成本,生产成本和生产成本方面是有利的; 此外,可以简化面板层压工艺,并且可以将触摸面板结构连接到平面或弯曲的面板,并且便于设计更薄的产品。
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公开(公告)号:US20120249465A1
公开(公告)日:2012-10-04
申请号:US13493524
申请日:2012-06-11
申请人: Yi-Chun Lin , Ming-Kung Wu , Hsiao-Ping Li , Ping-Wen Huang , Cheng-Yi Chou , Yu-Hua Wu , Xuan-Chang Shiu , Chih-Yuan Wang , Ching-Fu Hsu , Shiao-Hui Liao , Ting-Yu Chang , Fa-Chen Wu , Wen-Chun Wang
发明人: Yi-Chun Lin , Ming-Kung Wu , Hsiao-Ping Li , Ping-Wen Huang , Cheng-Yi Chou , Yu-Hua Wu , Xuan-Chang Shiu , Chih-Yuan Wang , Ching-Fu Hsu , Shiao-Hui Liao , Ting-Yu Chang , Fa-Chen Wu , Wen-Chun Wang
IPC分类号: G06F3/041
CPC分类号: G06F3/041 , G06F2203/04103 , H05K1/0296 , H05K1/0306 , H05K1/0393 , H05K2201/017 , H05K2201/09 , H05K2201/10106 , H05K2201/10128
摘要: A touch panel structure and the manufacturing method thereof are disclosed, in which the manufacturing method includes the steps of: providing a bonding layer; and forming a conductive pattern layer on the bonding layer; wherein the conductive pattern layer is composed of at least one first and at least one second major conductors with an insulation layer interposed between the first and the second major conductors. Comparing with the prior art for manufacturing touch panels, the disclosure is advantageous in material cost, production cost, and production yield; moreover, the panel lamination process can be simplified and the touch panel structure can be joined to a planar or curvy panel and facilitate the design of a thinner product.
摘要翻译: 公开了触摸屏结构及其制造方法,其中制造方法包括以下步骤:提供接合层; 以及在所述接合层上形成导电图案层; 其中所述导电图案层由至少一个第一和至少一个第二主导体构成,绝缘层插入在所述第一和第二主导体之间。 与用于制造触摸板的现有技术相比,本发明在材料成本,生产成本和生产成本方面是有利的; 此外,可以简化面板层压工艺,并且可以将触摸面板结构连接到平面或弯曲的面板,并且便于设计更薄的产品。
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