公开(公告)号：US20230395398A1

公开(公告)日：2023-12-07

申请号：US18450543

申请日：2023-08-16

申请人： AGC Inc.

发明人： Seigo KOTERA ,  Satoshi TAKENAKA ,  Tetsuya HASEGAWA ,  Takatoshi YAOITA ,  Masayuki MORINO ,  Mio TOKUNAGA ,  Yuki HAYASAKA

IPC分类号： H01L21/56 ,  H01L21/306

CPC分类号： H01L21/566 ,  H01L21/306

摘要： The present invention relates to a film including at least a substrate and an antistatic layer, in which a ratio of a peeled area when a tape peeling test is performed under the following conditions after 300% uniaxial stretching at 25° C. is less than 5%, the tape peeling test is that: Cellotape® is pressure-bonded to a surface of the film on an antistatic layer side using a roller through 5 reciprocations with a load of 4 kg, and the Cellotape® is peeled off at a speed of 100 m/min in a direction of 180° with respect to the film within 5 minutes, thereby obtaining a ratio of a peeled area of the film to an area of an adhesive portion of the Cellotape®.

公开(公告)号：US20230154938A1

公开(公告)日：2023-05-18

申请号：US18066497

申请日：2022-12-15

申请人： AGC INC.

发明人： Kazutaka ONO ,  Takatoshi YAOITA ,  Reo USUI ,  Kenichi EBATA ,  Jun AKIYAMA

IPC分类号： H01L27/12 ,  B32B7/12 ,  B32B17/00 ,  B32B17/06 ,  B32B38/10 ,  B32B43/00 ,  C03C3/091 ,  C03C27/10 ,  H01L21/683 ,  H01L29/786 ,  B32B7/06

CPC分类号： H01L27/1266 ,  B32B7/12 ,  B32B17/00 ,  B32B17/06 ,  B32B38/10 ,  B32B43/006 ,  C03C3/091 ,  C03C27/10 ,  H01L21/6835 ,  H01L27/1222 ,  H01L29/78672 ,  B32B7/06 ,  H01L2221/68386 ,  B32B2307/30 ,  B32B2307/308 ,  B32B2307/546 ,  B32B2307/734 ,  B32B2315/08 ,  B32B2457/00 ,  G02F1/1341

摘要： A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

公开(公告)号：US20210023757A1

公开(公告)日：2021-01-28

申请号：US17070999

申请日：2020-10-15

申请人： AGC Inc.

发明人： Yoshiaki HIGUCHI ,  Shintaro FUKUNAGA ,  Takatoshi YAOITA

IPC分类号： B29C48/08 ,  B29C48/88 ,  B32B27/08 ,  B32B27/30

摘要： To provide a process for producing a film excellent in water vapor barrier property, tensile elongations and transparency.
A resin material containing polychlorotrifluoroethylene (PCTFE) is melted and extruded into a film from an extrusion die, the extruded product is brought into contact with a cooling roll having a surface temperature of at most 120° C. in a state such that the surface temperature of the extruded product is higher than the crystallization temperature of PCTFE to form a film web, and the film web is subjected to heat treatment at from 80 to 200° C. to obtain a film.

公开(公告)号：US20240199829A1

公开(公告)日：2024-06-20

申请号：US18588831

申请日：2024-02-27

申请人： AGC Inc.

发明人： Seigo KOTERA ,  Wataru KASAI ,  Junetsu NAKAMURA ,  Takatoshi YAOITA

IPC分类号： C08J5/18 ,  B29C71/02 ,  B29K27/18 ,  B29K105/00 ,  C08F214/26 ,  C08J5/12 ,  H05K1/05 ,  H05K3/02

CPC分类号： C08J5/18 ,  B29C71/02 ,  C08F214/265 ,  C08J5/121 ,  H05K1/056 ,  H05K3/022 ,  B29C2071/022 ,  B29K2027/18 ,  B29K2105/0085 ,  C08F2800/10 ,  C08J2327/18 ,  H05K2201/015

摘要： To provide a dielectric film which is excellent in dielectric properties and stability in the electric corrosion test and which is suitable for producing a high-precision printed board.
A roll film comprising a melt-processable fluororesin as the main component and having a thickness of from 1 to 100 μm, the dimensional change rate of which is less than 1.0%, in terms of an absolute value, in each of MD and TD, when heated at 150° C. for 30 minutes and then cooled to 25° C., based on the dimension at 25° C.

公开(公告)号：US20230118345A1

公开(公告)日：2023-04-20

申请号：US18066505

申请日：2022-12-15

申请人： AGC INC.

发明人： Kazutaka ONO ,  Takatoshi YAOITA ,  Reo USUI ,  Kenichi EBATA ,  Jun AKIYAMA

IPC分类号： H01L27/12 ,  B32B7/12 ,  B32B17/00 ,  B32B17/06 ,  B32B38/10 ,  B32B43/00 ,  C03C3/091 ,  C03C27/10 ,  H01L21/683 ,  H01L29/786 ,  B32B7/06

摘要： A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.