公开(公告)号：US09533878B2

公开(公告)日：2017-01-03

申请号：US14567801

申请日：2014-12-11

Applicant: ANALOG DEVICES, INC.

Inventor： Thomas M. Goida ,  Kathleen O'Donnell ,  Michael Delaus

IPC: H01L23/495 ,  B81B7/00 ,  B81C1/00 ,  H01L25/18 ,  H01L23/498 ,  H01L23/13 ,  H01L23/34 ,  H01L23/00

CPC classification number: B81B7/0074 ,  B81B7/0054 ,  B81C1/00238 ,  B81C1/00301 ,  H01L23/13 ,  H01L23/34 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/83851 ,  H01L2225/06513 ,  H01L2225/06537 ,  H01L2225/06572 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Various low stress compact device packages are disclosed herein. An integrated device package can include a first integrated device die and a second integrated device die. An interposer can be disposed between the first integrated device die and the second integrated device die such that the first integrated device die is mounted to and electrically coupled to a first side of the interposer and the second integrated device die is mounted to and electrically coupled to a second side of the interposer. The first side can be opposite the second side. The interposer can comprise a hole through at least the second side of the interposer. A portion of the second integrated device die can extend into the hole.

Abstract translation: 本文公开了各种低应力小型器件封装。 集成器件封装可以包括第一集成器件管芯和第二集成器件管芯。 插入器可以设置在第一集成器件管芯和第二集成器件管芯之间，使得第一集成器件裸片安装到电连接到插入器的第一侧并且电连接到插入器的第一侧，并且第二集成器件管芯安装到电耦合到 插入器的第二面。 第一面可以与第二面相对。 插入器可以包括穿过插入件的至少第二侧的孔。 第二集成器件芯片的一部分可以延伸到孔中。

公开(公告)号：US20160167951A1

公开(公告)日：2016-06-16

申请号：US14567801

申请日：2014-12-11

Applicant: ANALOG DEVICES, INC.

Inventor： Thomas M. Goida ,  Kathleen O'Donnell ,  Michael Delaus

IPC: B81B7/00 ,  H01L25/18 ,  H01L23/498 ,  B81C1/00

CPC classification number: B81B7/0074 ,  B81B7/0054 ,  B81C1/00238 ,  B81C1/00301 ,  H01L23/13 ,  H01L23/34 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/83851 ,  H01L2225/06513 ,  H01L2225/06537 ,  H01L2225/06572 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Various low stress compact device packages are disclosed herein. An integrated device package can include a first integrated device die and a second integrated device die. An interposer can be disposed between the first integrated device die and the second integrated device die such that the first integrated device die is mounted to and electrically coupled to a first side of the interposer and the second integrated device die is mounted to and electrically coupled to a second side of the interposer. The first side can be opposite the second side. The interposer can comprise a hole through at least the second side of the interposer. A portion of the second integrated device die can extend into the hole.

Abstract translation: 本文公开了各种低应力小型器件封装。 集成器件封装可以包括第一集成器件管芯和第二集成器件管芯。 插入器可以设置在第一集成器件管芯和第二集成器件管芯之间，使得第一集成器件裸片安装到电连接到插入器的第一侧并且电连接到插入器的第一侧，并且第二集成器件管芯安装到电耦合到 插入器的第二面。 第一面可以与第二面相对。 插入器可以包括穿过插入件的至少第二侧的孔。 第二集成器件芯片的一部分可以延伸到孔中。