公开(公告)号：US20230219189A1

公开(公告)日：2023-07-13

申请号：US17571336

申请日：2022-01-07

Applicant: Applied Materials, Inc.

Inventor： Ashwin CHOCKALINGAM ,  Joshua CHEN ,  Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE ,  Daniel REDFIELD

IPC: B24B37/12 ,  B24B37/34

CPC classification number: B24B37/12 ,  B24B37/34

Abstract: Apparatus and methods for correcting asymmetry in a thickness profile by use of a Chemical Mechanical Planarization (CMP) process. In one embodiment, a CMP system includes a polishing pad, an adhesion layer, and a platen. The polishing pad includes has a polishing surface, a second surface that is positioned opposite to the polishing surface in a first direction, and a plurality of cavities formed in the second surface. The platen includes a body that comprises a pad supporting surface and one or more ports formed in the body, configured to receive a positive or negative pressure that is generated from a fluid control device. Each of the plurality of cavities is in fluid communication with at least one of the one or more ports and the adhesion layer is disposed between the pad supporting surface of the platen and a portion of the second surface of the polishing pad.

公开(公告)号：US20210107116A1

公开(公告)日：2021-04-15

申请号：US17114633

申请日：2020-12-08

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Daniel REDFIELD ,  Mahendra C. ORILALL ,  Boyi FU ,  Aniruddh Jagdish KHANNA ,  Jason G. FUNG ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Veera Raghava Reddy KAKIREDDY ,  Gregory E. MENK ,  Nag B. PATIBANDLA

IPC: B24D11/00 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/04 ,  B24D3/28

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US20200147750A1

公开(公告)日：2020-05-14

申请号：US16746065

申请日：2020-01-17

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Kasiraman KRISHNAN ,  Mahendra C. ORILALL ,  Daniel REDFIELD ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Gregory E. MENK ,  Jason G. FUNG ,  Russell Edward PERRY ,  Robert E. DAVENPORT

IPC: B24B37/26 ,  B24D18/00 ,  B24B37/22 ,  B24B37/20 ,  B33Y80/00 ,  B29C64/112 ,  B24B37/24

Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US20180084610A1

公开(公告)日：2018-03-22

申请号：US15824489

申请日：2017-11-28

Applicant: Applied Materials, Inc.

Inventor： Kin Pong LO ,  Paul BRILLHART ,  Ramachandran BALASUBRAMANIAN ,  Satheesh KUPPURAO ,  Daniel REDFIELD ,  Joseph M. RANISH ,  James Francis MACK ,  Kailash Kiran PATALAY ,  Michael OLSEN ,  Eddie FEIGEL ,  Richard HALPIN ,  Brett VETORINO

IPC: H05B3/00 ,  H01L21/67

CPC classification number: H05B3/0047 ,  H01L21/67115

Abstract: Embodiments of the disclosure generally relate to a reflector for use in a thermal processing chamber. In one embodiment, the thermal processing chamber generally includes an upper dome, a lower dome opposing the upper dome, the upper dome and the lower dome defining an internal volume of the processing chamber, a substrate support disposed within the internal volume, and a reflector positioned above and proximate to the upper dome, wherein the reflector has a heat absorptive coating layer deposited on a side of the reflector facing the substrate support.

公开(公告)号：US20180043613A1

公开(公告)日：2018-02-15

申请号：US15722810

申请日：2017-10-02

Applicant: Applied Materials, Inc.

Inventor： Kasiraman KRISHNAN ,  Daniel REDFIELD ,  Russell Edward PERRY ,  Gregory E. MENK ,  Rajeev BAJAJ ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Mahendra C. ORILALL ,  Jason G. FUNG

IPC: B24B37/26 ,  B24B37/22 ,  B29L31/00 ,  B29K105/16

Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

公开(公告)号：US20170203408A1

公开(公告)日：2017-07-20

申请号：US15287665

申请日：2016-10-06

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/24

CPC classification number: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20210347005A1

公开(公告)日：2021-11-11

申请号：US17382194

申请日：2021-07-21

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Sivapackia GANAPATHIAPPAN ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Ashwin CHOCKALINGAM ,  Dominic J. BENVEGNU ,  Mario Dagio CORNEJO ,  Mayu YAMAMURA ,  Nag B. PATIBANDLA ,  Ankit VORA

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material and methods of forming thereof. In one embodiment, a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition, and the dispensed window precursor composition disposed within the first layer.

公开(公告)号：US20200055161A1

公开(公告)日：2020-02-20

申请号：US16661400

申请日：2019-10-23

Applicant: Applied Materials, Inc.

Inventor： Ashwin CHOCKALINGHAM ,  Mahendra C. ORILALL ,  Mayu YAMAMURA ,  Boyi FU ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24 ,  H01L21/306

Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

公开(公告)号：US20190047112A1

公开(公告)日：2019-02-14

申请号：US16050442

申请日：2018-07-31

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Sivapackia GANAPATHIAPPAN ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Ashwin CHOCKALINGAM ,  Dominic J. BENVEGNU ,  Mario Dagio CORNEJO ,  Mayu YAMAMURA ,  Nag B. PATIBANDLA ,  Ankit VORA

IPC: B24B37/20

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.

公开(公告)号：US20170259499A1

公开(公告)日：2017-09-14

申请号：US15452053

申请日：2017-03-07

Applicant: Applied Materials, Inc.

Inventor： Hou T. NG ,  Nag B. PATIBANDLA ,  Rajeev BAJAJ ,  Daniel REDFIELD ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Mario CORNEJO

IPC: B29C67/00 ,  B24B37/22 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y30/00

CPC classification number: B33Y10/00 ,  B24B37/22 ,  B29K2105/0058 ,  B33Y30/00 ,  B33Y80/00 ,  G03F7/0035 ,  G03F7/2014

Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.