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    LOCALLY HEATED MULTI-ZONE SUBSTRATE SUPPORT
    2.
    发明申请
    LOCALLY HEATED MULTI-ZONE SUBSTRATE SUPPORT 有权
    本地加热多区域基板支持

    公开(公告)号：US20170032995A1

    公开(公告)日：2017-02-02

    申请号：US15295375

    申请日：2016-10-17

    Applicant: Applied Materials, Inc.

    Inventor： Michael S. COX

    IPC: H01L21/683 ,  H01L21/67

    CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  Y10T29/49083

    Abstract: Embodiments of the present disclosure provide an electrostatic chuck (ESC) having azimuthal temperature control. In one embodiment, the electrostatic chuck includes an insulating base, a dielectric layer disposed on the insulating base, the dielectric layer having a substrate supporting surface, a plurality of heating elements coupled to the insulating base, and a first set of electrodes and a second set of electrodes, wherein the plurality of heating elements are surrounded by the first set of electrodes and the second set of electrodes.

    Abstract translation: 本公开的实施例提供了具有方位角温度控制的静电卡盘（ESC）。 在一个实施例中，静电卡盘包括绝缘基座，设置在绝缘基底上的电介质层，电介质层具有衬底支撑表面，耦合到绝缘基底的多个加热元件以及第一组电极和第二组 一组电极，其中多个加热元件被第一组电极和第二组电极包围。

    TRANSPARENT ELECTROSTATIC CARRIER
    3.
    发明申请
    TRANSPARENT ELECTROSTATIC CARRIER 审中-公开
    透明静电载体

    公开(公告)号：US20160358803A1

    公开(公告)日：2016-12-08

    申请号：US15152489

    申请日：2016-05-11

    Applicant: Applied Materials, Inc.

    Inventor： Leung Kway LEE ,  Michael S. COX ,  Pallavi ZHANG

    IPC: H01L21/683 ,  H01L21/677

    CPC classification number: H01L21/6833 ,  H01L21/67336

    Abstract: Embodiments described herein provide an electrostatic carrier for transferring a substrate. The electrostatic carrier may have a transparent body. The transparent body may have a first surface sized to transport the substrate into and out of a processing chamber. The electrostatic carrier may also have one or more electrostatic chucking electrodes coupled to the transparent body. The one or more electrostatic chucking electrodes may include a transparent conductive oxide material. In certain embodiments the transparent conductive oxide material is an indium-tin oxide material.

    Abstract translation: 本文所述的实施例提供了用于转移衬底的静电载体。 静电载体可以具有透明体。 透明体可以具有尺寸适于将衬底输送进出处理室的第一表面。 静电载体也可以具有一个或多个耦合到透明体的静电吸附电极。 一个或多个静电吸附电极可以包括透明导电氧化物材料。 在某些实施方案中，透明导电氧化物材料是氧化铟锡材料。

    IN-SITU REMOVABLE ELECTROSTATIC CHUCK
    4.
    发明申请
    IN-SITU REMOVABLE ELECTROSTATIC CHUCK 有权
    现场可拆卸静电卡盘

    公开(公告)号：US20150036259A1

    公开(公告)日：2015-02-05

    申请号：US14451139

    申请日：2014-08-04

    Applicant: Applied Materials, Inc.

    Inventor： Michael S. COX ,  Lara HAWRYLCHAK ,  Steven V. SANSONI

    IPC: H01L21/683

    CPC classification number: H01L21/6833 ,  Y10T29/49815

    Abstract: Embodiments described herein generally relate to an electrostatic chuck (ESC). The ESC may contain a first plurality of electrodes adapted to electrostatically couple a substrate to the ESC and a second plurality of electrodes adapted to electrostatically couple the ESC to a substrate support. Instead of being integrally disposed within the substrate support, the ESC may be easily removed from the substrate support and removed from a chamber for maintenance or replacement purposes.

    Abstract translation: 本文描述的实施例一般涉及静电卡盘（ESC）。 ESC可以包含适于将基板静电耦合到ESC的第一多个电极和适于使ESC与基板支撑件静电耦合的第二多个电极。 代替整体地设置在基板支撑件内，ESC可以容易地从基板支撑件移除并从腔室移除以进行维护或替换。

    SPUTTERING TARGET WITH BACKSIDE COOLING GROOVES
    5.
    发明申请
    SPUTTERING TARGET WITH BACKSIDE COOLING GROOVES 审中-公开

    公开(公告)号：US20200294778A1

    公开(公告)日：2020-09-17

    申请号：US16890573

    申请日：2020-06-02

    Applicant: Applied Materials, Inc.

    Inventor： Brian T. WEST ,  Michael S. COX ,  Jeonghoon OH

    IPC: H01J37/34 ,  C23C14/34 ,  C23C14/35

    Abstract: Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.

    SPUTTERING TARGET WITH BACKSIDE COOLING GROOVES
    6.
    发明申请
    SPUTTERING TARGET WITH BACKSIDE COOLING GROOVES 审中-公开

    公开(公告)号：US20180342378A1

    公开(公告)日：2018-11-29

    申请号：US16048919

    申请日：2018-07-30

    Applicant: Applied Materials, Inc.

    Inventor： Brian T. WEST ,  Michael S. COX ,  Jeonghoon OH

    IPC: H01J37/34 ,  C23C14/34 ,  C23C14/35

    Abstract: Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.

    LOCALLY HEATED MULTI-ZONE SUBSTRATE SUPPORT
    7.
    发明申请
    LOCALLY HEATED MULTI-ZONE SUBSTRATE SUPPORT 有权

    公开(公告)号：US20180019148A1

    公开(公告)日：2018-01-18

    申请号：US15676031

    申请日：2017-08-14

    Applicant: Applied Materials, Inc.

    Inventor： Michael S. COX

    IPC: H01L21/683 ,  H01L21/67

    CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  Y10T29/49083

    Abstract: Embodiments of the present disclosure provide an electrostatic chuck (ESC) having azimuthal temperature control. In one embodiment, the electrostatic chuck includes an insulating base, an encapsulating member disposed on the insulating base, a first plurality of electrodes and a second plurality of electrodes disposed at a first elevation in the encapsulating member, the first plurality of electrodes intervening with the second plurality of electrodes, and a plurality of heating elements disposed at a second elevation in the encapsulating member, the heating elements being arranged in the form of discrete sections.

    END EFFECTOR FOR TRANSFERRING A SUBSTRATE
    10.
    发明申请
    END EFFECTOR FOR TRANSFERRING A SUBSTRATE 有权
    用于传输基板的最终效应器

    公开(公告)号：US20150022935A1

    公开(公告)日：2015-01-22

    申请号：US14336650

    申请日：2014-07-21

    Applicant: Applied Materials, Inc.

    Inventor： Michael S. COX ,  Michel Anthony ROSA

    IPC: H01L21/683

    CPC classification number: H01L21/6831 ,  H01L21/67742

    Abstract: Embodiments of the present invention provide an end effector capable of generating an electrostatic chucking force to chuck a substrate disposed therein without damaging the substrate. In one embodiment, an end effector for a robot, the end effector includes a body having an electrostatic chucking force generating assembly, and a mounting end coupled to the body, the mounting end for coupling the body to the robot.

    Abstract translation: 本发明的实施例提供一种端部执行器，其能够产生静电吸持力以夹持设置在其中的衬底而不损坏衬底。 在一个实施例中，用于机器人的末端执行器，末端执行器包括具有静电夹紧力产生组件的主体，以及联接到主体的安装端，用于将主体联接到机器人的安装端。

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