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    PLASMA BLOCK WITH INTEGRATED COOLING
    3.
    发明申请
    PLASMA BLOCK WITH INTEGRATED COOLING 有权

    公开(公告)号：US20210335603A1

    公开(公告)日：2021-10-28

    申请号：US16856282

    申请日：2020-04-23

    Applicant: Applied Materials, Inc.

    Inventor： Tanmay P. Gurjar ,  Sumit S. Patankar ,  Sudhir R. Gondhalekar

    IPC: H01L21/02 ,  H01J37/305

    Abstract: Exemplary semiconductor processing systems may include a remote plasma source. The remote plasma source may include a first plasma block segment defining an inlet to an internal channel of the first plasma block segment. The first plasma block segment may also define a cooling channel between the internal channel of the first plasma block segment and a first exterior surface of the first plasma block segment. The remote plasma source may include a second plasma block segment defining an outlet from an internal channel of the second plasma block segment. The second plasma block segment may also define a cooling channel between the internal channel of the second plasma block segment and a first exterior surface of the second plasma block segment. The systems may include a semiconductor processing chamber defining an inlet fluidly coupled with the outlet from the remote plasma source.

    Seal for an assembly in a vapor deposition chamber
    4.
    外观设计
    Seal for an assembly in a vapor deposition chamber 有权

    公开(公告)号：USD1027120S1

    公开(公告)日：2024-05-14

    申请号：US29762536

    申请日：2020-12-17

    Applicant: Applied Materials, Inc.

    Designer： Yao-Hung Yang ,  Eric Ruhland ,  Saurabh M. Chaudhari ,  Dien-Yeh Wu ,  Philip Wayne Nagle ,  Aniruddha Pal ,  Sudhir R. Gondhalekar ,  Siamak Salimian ,  Scott Lin ,  Boon Sen Chan

    Abstract: FIG. 1 is top perspective view of a seal for an assembly in a vapor deposition chamber.
    FIG. 2 is a bottom perspective view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
    FIG. 3 is a top plan view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
    FIG. 4 is a bottom plan view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
    FIG. 5 is a front view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
    FIG. 6 is a rear view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
    FIG. 7 is a right side view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
    FIG. 8 is a left side view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1.
    FIG. 9 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1 showing details of an outer segment of the seal.
    FIG. 10 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1 showing details of a central segment of the seal.
    FIG. 11 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 1 showing details of an outer segment of the seal.
    FIG. 12 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 2 showing details of an outer segment of the seal.
    FIG. 13 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 3 showing details of a central segment of the seal.
    FIG. 14 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 4 showing details of a central segment of the seal.
    FIG. 15 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 6 showing details of an outer segment of the seal.
    FIG. 16 is an enlarged sectional view of a portion of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 7 showing details of an outer segment of the seal; and,
    FIG. 17 is a top plan view of the seal for an assembly in a vapor deposition chamber illustrated in FIG. 3 shown in a portion of an assembly (in phantom).
    The broken and phantom lines in the Figures illustrate unclaimed parts of the seal for an assembly in a vapor deposition chamber and form no part of the claimed design.

    Plasma block with integrated cooling
    5.
    发明授权
    Plasma block with integrated cooling 有权

    公开(公告)号：US11710630B2

    公开(公告)日：2023-07-25

    申请号：US16856282

    申请日：2020-04-23

    Applicant: Applied Materials, Inc.

    Inventor： Tanmay P. Gurjar ,  Sumit S. Patankar ,  Sudhir R. Gondhalekar

    IPC: H01L21/02 ,  H01J37/305 ,  C23F1/08 ,  C23C14/56 ,  H01J37/32

    CPC classification number: H01L21/02252 ,  C23C14/56 ,  C23F1/08 ,  H01J37/3053 ,  H01J37/32357 ,  H01J37/32522 ,  H01J2237/0437

    Abstract: Exemplary semiconductor processing systems may include a remote plasma source. The remote plasma source may include a first plasma block segment defining an inlet to an internal channel of the first plasma block segment. The first plasma block segment may also define a cooling channel between the internal channel of the first plasma block segment and a first exterior surface of the first plasma block segment. The remote plasma source may include a second plasma block segment defining an outlet from an internal channel of the second plasma block segment. The second plasma block segment may also define a cooling channel between the internal channel of the second plasma block segment and a first exterior surface of the second plasma block segment. The systems may include a semiconductor processing chamber defining an inlet fluidly coupled with the outlet from the remote plasma source.

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