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    Process kit shield for plasma enhanced processing chamber
    5.
    发明授权
    Process kit shield for plasma enhanced processing chamber 有权
    用于等离子体增强处理室的工艺套件屏蔽

    公开(公告)号：US09343274B2

    公开(公告)日：2016-05-17

    申请号：US14178146

    申请日：2014-02-11

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Muhammad Rasheed ,  Donny Young ,  Kirankumar Savandaiah ,  Uday Pai

    IPC: C23C14/56 ,  C23C14/34 ,  C23C16/44 ,  C23C14/35 ,  H01J37/34 ,  H01J37/32 ,  H01J19/54

    CPC classification number: H01J37/3411 ,  C23C14/34 ,  C23C14/35 ,  C23C14/564 ,  C23C16/44 ,  H01J19/54 ,  H01J37/32495 ,  Y10T428/12528

    Abstract: Apparatus for processing substrates is disclosed herein. In some embodiments, an apparatus includes a first shield having a first end, a second end, and one or more first sidewalls disposed between the first and second ends, wherein the first end is configured to interface with a first support member of a process chamber to support the first shield in a position such that the one or more first sidewalls surround a first volume of the process chamber; and a second shield having a first end, a second end, and one or more second sidewalls disposed between the first and second ends of the second shield and about the first shield, wherein the first end of the second shield is configured to interface with a second support member of the process chamber to support the second shield such that the second shield contacts the first shield to form a seal therebetween.

    Abstract translation: 本文公开了用于处理衬底的设备。 在一些实施例中，一种装置包括具有第一端，第二端和设置在第一和第二端之间的一个或多个第一侧壁的第一屏蔽，其中第一端构造成与处理室的第一支撑构件 以将所述第一屏蔽件支撑在使得所述一个或多个第一侧壁围绕所述处理室的第一体积的位置; 以及第二屏蔽，其具有设置在所述第二屏蔽件的第一端和第二端之间并且围绕所述第一屏蔽的第一端，第二端和一个或多个第二侧壁，其中所述第二屏蔽的所述第一端被配置为与 处理室的第二支撑构件以支撑第二屏蔽，使得第二屏蔽件接触第一屏蔽件以在其间形成密封。

    Target retaining apparatus
    6.
    发明授权
    Target retaining apparatus 有权

    公开(公告)号：US10199204B2

    公开(公告)日：2019-02-05

    申请号：US14600915

    申请日：2015-01-20

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Srinivasa Yedla ,  Sundarapandian Reddy ,  Uday Pai ,  Kirankumar Savandaiah ,  Thanh X. Nguyen ,  Muhammad M. Rasheed ,  Jallepally Ravi

    IPC: H01J37/34

    Abstract: Embodiments of target retaining apparatus and substrate processing chambers incorporating same are provided herein. In some embodiments, a target retaining apparatus includes a housing including a first slot and a second slot; a cam movably disposed in the housing, wherein movement of the cam is constrained along the first slot; a retaining arm movably coupled to the cam, wherein movement of the retaining arm is constrained along the second slot; a linking member including a first end rotatably coupled to the cam and a second end rotatably coupled to the retaining arm; and a biasing element biasing the cam towards a first position in which the retaining arm extends away from the housing.

    Edge load ring
    8.
    发明授权
    Edge load ring 有权

    公开(公告)号：US11440159B2

    公开(公告)日：2022-09-13

    申请号：US17034541

    申请日：2020-09-28

    Applicant: Applied Materials, Inc.

    Inventor： Uday Pai ,  Jeonghoon Oh ,  Van H. Nguyen

    IPC: B24B37/32 ,  B24B37/30

    Abstract: Apparatus and methods relating to chemical mechanical polishing (CMP) are described herein. An edge load ring (ELR) is configured to fit inside a retaining ring of a CMP head. The ELR includes an annular body having an inner surface and an outer surface opposite the inner surface, the outer surface having a diameter configured to slip inside a retaining ring. The annular body includes a body portion formed from a first material and a bottom projection extending below the body portion. The bottom projection has a bottom surface facing away from the body portion, and the bottom projection is formed form a second material different from the first material. The annular body includes a venting feature formed through the annular body, the venting feature being in fluid communication between the inner and outer surfaces.

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