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公开(公告)号:US11537038B2
公开(公告)日:2022-12-27
申请号:US17119331
申请日:2020-12-11
Applicant: ASML NETHERLANDS B.V.
Inventor: Nicolaas Rudolf Kemper , Sjoerd Nicolaas Lambertus Donders , Joost Jeroen Ottens , Edwin Cornelis Kadijk , Sergei Shulepov
Abstract: Embodiments of a drain in a lithographic projection apparatus are described that have, for example, a feature which reduces inflow of gas into the drain during a period when no liquid is present in the drain. In one example, a passive liquid removal mechanism is provided such that the pressure of gas in the drain is equal to the ambient gas pressure and in another embodiment a flap is provided to close off a chamber during times when no liquid needs removing.
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公开(公告)号:US12117721B2
公开(公告)日:2024-10-15
申请号:US18087320
申请日:2022-12-22
Applicant: ASML NETHERLANDS B.V.
Inventor: Nicolaas Rudolf Kemper , Sjoerd Nicolaas Lambertus Donders , Joost Jeroen Ottens , Edwin Cornelis Kadijk , Sergei Shulepov
CPC classification number: G03B27/42 , G03F7/70341 , G03F7/70716
Abstract: Embodiments of a drain in a lithographic projection apparatus are described that have, for example, a feature which reduces inflow of gas into the drain during a period when no liquid is present in the drain. In one example, a passive liquid removal mechanism is provided such that the pressure of gas in the drain is equal to the ambient gas pressure and in another embodiment a flap is provided to close off a chamber during times when no liquid needs removing.
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公开(公告)号:US12051607B2
公开(公告)日:2024-07-30
申请号:US17257900
申请日:2019-06-27
Applicant: ASML NETHERLANDS B.V.
Inventor: Patriek Adrianus Alphonsus Maria Bruurs , Dennis Herman Caspar Van Banning , Jan-Gerard Cornelis Van Der Toorn , Edwin Cornelis Kadijk
IPC: H01L21/67 , G01K1/14 , G01K11/125 , H01J37/20 , H01J37/244 , H01L21/68
CPC classification number: H01L21/67248 , G01K1/14 , G01K11/125 , H01J37/20 , H01J37/244 , H01L21/68 , H01J2237/20228 , H01J2237/20235
Abstract: A stage apparatus including: an object table configured to hold an object; a positioning device configured to position the object table and the object held by the object table; and a remote temperature sensor configured to measure a temperature of the object table and/or the object, wherein the remote temperature sensor comprises a passive temperature sensing element.
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公开(公告)号:US11942340B2
公开(公告)日:2024-03-26
申请号:US17811047
申请日:2022-07-06
Applicant: ASML Netherlands B.V.
Inventor: Jeroen Gerard Gosen , Te-Yu Chen , Dennis Herman Caspar Van Banning , Edwin Cornelis Kadijk , Martijn Petrus Christianus Van Heumen , Erheng Wang , Johannes Andreas Henricus Maria Jacobs
CPC classification number: H01L21/67201 , G03F7/70841 , G03F7/70858 , H01L21/67098
Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.
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公开(公告)号:US11430678B2
公开(公告)日:2022-08-30
申请号:US16514843
申请日:2019-07-17
Applicant: ASML Netherlands B.V.
Inventor: Jeroen Gerard Gosen , Te-Yu Chen , Dennis Herman Caspar Van Banning , Edwin Cornelis Kadijk , Martijn Petrus Christianus Van Heumen , Erheng Wang , Johannes Andreas Henricus Maria Jacobs
Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.
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公开(公告)号:US11158484B2
公开(公告)日:2021-10-26
申请号:US16805633
申请日:2020-02-28
Applicant: ASML Netherlands B.V.
Inventor: Dennis Herman Caspar Van Banning , Jeroen Gerard Gosen , Maarten Lambertus Henricus Ter Heerdt , Edwin Cornelis Kadijk
IPC: H01J37/20
Abstract: An e-beam inspection tool is disclosed, the tool comprising, an electron optics system configured to generate an electron beam, an object table configured to hold a specimen, a positioning device configured to position the object table, the positioning device comprising an actuator, wherein the positioning device further comprises a heating device configured to generate a heat load and a heat load controller to control the generated heat load at least partly based on an actuator heat load generated in the actuator.
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公开(公告)号:US10268128B2
公开(公告)日:2019-04-23
申请号:US15742168
申请日:2016-06-14
Applicant: ASML Netherlands B.V.
Inventor: Franciscus Johannes Joseph Janssen , Johannes Paul Marie De La Rosette , Edwin Cornelis Kadijk , Nicolas Alban Lallemant , Jan Liefooghe , Markus Rolf Werner Matthes , Marcel Johannus Elisabeth Hubertus Muitjens , Hubert Matthieu Richard Steijns , André Gillis Van De Velde , Marinus Aart Van Den Brink
IPC: G03F7/20 , H01S3/036 , H01S3/04 , H01S3/041 , H01S3/23 , H05G2/00 , F28C1/08 , H01S3/038 , H01S3/223
Abstract: A lithographic apparatus comprising an illumination system configured to condition a radiation beam, a support structure constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam, a substrate table constructed to hold a substrate, and a projection system configured to project the patterned radiation beam onto the substrate, the lithographic apparatus being provided with a first cooling fluid circuit which is configured to cool components to a first temperature, and provided with a second cooling fluid circuit which is configured to cool components to a second temperature that is lower than the first temperature.
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