-
1.发明授权公开(公告)号：US12002614B2
公开(公告)日：2024-06-04
申请号：US16949573
申请日：2020-11-04
发明人： Johannes Stahr , Gerald Weidinger , Heinz Moitzi
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/24 , H01F27/2847 , H01F41/041 , H01F41/042 , H01F41/046 , H01F17/0033 , H05K1/181 , H05K1/185 , H05K2201/1003
摘要： An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.
-
公开(公告)号：US20240030095A1
公开(公告)日：2024-01-25
申请号：US18473775
申请日：2023-09-25
发明人： Mikael Andreas Tuominen , Seok Kim Tay , Johannes Stahr , Andreas Zluc , Timo Schwarz , Gerald Weidinger , Mario Schober
IPC分类号： H01L23/373 , H01L23/492 , H01L23/00 , H01L21/56
CPC分类号： H01L23/3737 , H01L23/492 , H01L24/20 , H01L24/19 , H01L21/56 , H01L2224/21 , H01L2224/2201 , H01L2224/19
摘要： An electronic package having a base structure; a layer stack formed over the base structure; and a component embedded at least partially within the base structure and/or within the layer stack. The layer stack has a decoupling layer structure, the decoupling layer structure with a decoupling material having a Young Modulus being smaller than 1 GPa.
-
3.发明公开公开(公告)号：US20240014142A1
公开(公告)日：2024-01-11
申请号：US18251875
申请日：2021-11-05
发明人： Mike Morianz , Johannes Stahr , Simon Pressler , Maria Prutti
IPC分类号： H01L23/538 , H01L23/00 , H01L25/07 , H01L25/00 , H01L23/373
CPC分类号： H01L23/5389 , H01L24/24 , H01L25/072 , H01L23/5384 , H01L25/50 , H01L24/82 , H01L23/3735 , H01L2224/24137 , H01L24/32 , H01L2224/32225 , H01L24/29 , H01L2224/29139 , H01L2224/73267 , H01L24/83 , H01L2224/8384 , H01L2224/82106 , H01L24/92 , H01L2224/92244 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/13055 , H01L2924/13091
摘要： A component carrier which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a first electronic component and a second electronic component arranged in the stack, a first block and a second block arranged in the stack below the first electronic component and the second electronic component, and a third block and a fourth block arranged in the stack above the first electronic component and the second electronic component, wherein said blocks are thermally conductive.
-
公开(公告)号：US11495513B2
公开(公告)日：2022-11-08
申请号：US16827193
申请日：2020-03-23
发明人： Johannes Stahr , Andreas Zluc , Mike Morianz , Heinz Moitzi
IPC分类号： H01L23/34 , H01L23/367 , H01L23/498 , H05K1/02 , H05K3/46
摘要： A component carrier with a stack that has at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a semiconductor component embedded in the stack, and a highly-conductive block embedded in the stack and being thermally and/or electrically coupled with the semiconductor component is illustrated and described.
-
公开(公告)号：US11264708B2
公开(公告)日：2022-03-01
申请号：US15546658
申请日：2016-01-26
发明人： Thomas Kristl , Martin Reiter , Johannes Stahr , Markus Leitgeb , Gernot Grober , Erich Schlaffer
摘要： An electronic assembly and a method for fabricating the same are disclosed. The assembly includes a component carrier, a wireless communication component and an antenna structure. The component carrier has at least one dielectric layer and a metallic layer. The wireless communication component is attached to the component carrier. The antenna structure is formed from a metallic material and is electrically connected with the wireless communication component. An opening formed in the component carrier extends from an upper surface into the interior of the component carrier. The antenna structure is formed at least partially at a wall of the opening.
-
公开(公告)号：US20210112666A1
公开(公告)日：2021-04-15
申请号：US16948937
申请日：2020-10-06
发明人： Heinz Moitzi , Johannes Stahr , Mike Morianz
摘要： A component carrier includes a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; a heat removing and electrically conductive base structure; a component which is connected to the base structure so as to at least partially protrude from the base structure and so as to be laterally at least partially covered by an electrically insulating material of the stack; and an electrically conductive top structure on or above a top main surface of the component. A method of manufacturing such a component carrier is disclosed.
-
7.发明申请公开(公告)号：US20210050141A1
公开(公告)日：2021-02-18
申请号：US16949573
申请日：2020-11-04
发明人： Johannes Stahr , Gerald Weidinger , Heinz Moitzi
摘要： An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.
-
8.发明授权公开(公告)号：US10356904B2
公开(公告)日：2019-07-16
申请号：US15310991
申请日：2015-05-13
发明人： Johannes Stahr , Wolfgang Schrittwieser , Mike Morianz , Christian Vockenberger , Markus Leitgeb
摘要： The invention relates to an electronic device having an electrically isolating support structure, an electrically conducting conductor path on a surface of the support structure, and an electrically conducting contact structure which extends from the surface into the support structure and is electrically connected to the conductor path at a connection point, thereby forming a common conductor track. The conductor path and the contact structure transition into each other in an enlargement-free manner at the connection point.
-
9.发明申请公开(公告)号：US20180182532A1
公开(公告)日：2018-06-28
申请号：US15851177
申请日：2017-12-21
发明人： Johannes Stahr , Gerald Weidinger , Heinz Moitzi
CPC分类号： H01F27/2804 , H01F17/0013 , H01F17/0033 , H01F27/24 , H01F27/2847 , H01F41/041 , H01F41/042 , H01F41/046 , H05K1/181 , H05K1/185 , H05K2201/1003
摘要： An inductor component includes a plurality of stacked layer structures made of component carrier material with electrically conductive plate structures, and a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings.
-
公开(公告)号：US09980380B2
公开(公告)日：2018-05-22
申请号：US15331987
申请日：2016-10-24
CPC分类号： H05K1/142 , H05K1/115 , H05K1/185 , H05K1/189 , H05K3/225 , H05K3/368 , H05K3/4691 , H05K3/4694 , H05K2201/0187 , H05K2201/09163 , H05K2201/09845 , H05K2203/1461 , Y10T29/49155
摘要： In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each compromise at least one conductive layer and/or at least one device or once conductive component, wherein printed circuit board regions to be connected to another one, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.
-
-
-
-
-
-
-
-
-
搜索结果
59 条记录 (耗时 0.041 秒)
