公开(公告)号：US20170207151A1

公开(公告)日：2017-07-20

申请号：US14995572

申请日：2016-01-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen-Long LU ,  Chi-Chang LEE ,  Wei-Min HSIAO ,  Yuan-Feng CHIANG

IPC: H01L23/495 ,  H01L23/29 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49572 ,  H01L21/4825 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/145 ,  H01L23/147 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2224/83 ,  H01L2224/81

Abstract: A semiconductor package structure includes a conductive structure, at least two semiconductor elements and an encapsulant. The conductive structure has a first surface and a second surface opposite the first surface. The semiconductor elements are disposed on and electrically connected to the first surface of the conductive structure. The encapsulant covers the semiconductor elements and the first surface of the conductive structure. The encapsulant has a width ‘L’ and defines at least one notch portion. A minimum distance ‘d’ is between a bottom surface of the notch portion and the second surface of the conductive structure. The encapsulant has a Young's modulus ‘E’ and a rupture strength ‘Sr’, and L/(K×d)>E/Sr, wherein ‘K’ is a stress concentration factor with a value of greater than 1.2.