公开(公告)号：US20100102517A1

公开(公告)日：2010-04-29

申请号：US12606843

申请日：2009-10-27

Applicant: Ajay Kumar ,  Kevin J. Stanton

Inventor： Ajay Kumar ,  Kevin J. Stanton

IPC: F16J15/32

CPC classification number: A61C1/18 ,  A61B17/1624 ,  A61B17/1646 ,  A61B2017/00398 ,  A61B2090/0813 ,  A61B2217/005 ,  A61C1/057 ,  A61C1/10

Abstract: A system for enhanced sealing against intrusion of moisture and other contaminants for medical/dental handpieces having rotating or other moving elements driven by a motor within the handpiece. The enhanced sealing includes tandem seals on stepped diameters to provide additional flow pathway impediments. The tandem seals preferably include spring seals that are positioned in opposite directions to provide enhanced sealing against pressures in two different directions that occur during the pressurization and vacuum cycles of an autoclaving process. Additional enhancements include the use of annular sealing rings with x-shaped cross sections.

Abstract translation: 一种用于增强密封以防止湿气和其它污染物侵入医疗/牙科手机的系统，其具有由机头内的电动机驱动的旋转或其它移动元件。 增强的密封包括台阶直径的串联密封，以提供额外的流动路径障碍。 串联密封件优选地包括沿相反方向定位的弹簧密封件，以提供增强的密封，抵抗在高压灭菌过程的加压和真空循环期间发生的两个不同方向上的压力。 另外的增强包括使用具有x形横截面的环形密封圈。

公开(公告)号：US08641417B2

公开(公告)日：2014-02-04

申请号：US12606843

申请日：2009-10-27

Applicant: Ajay Kumar ,  Kevin J. Stanton

Inventor： Ajay Kumar ,  Kevin J. Stanton

IPC: A61C1/08 ,  A61C3/06 ,  A61C1/00

CPC classification number: A61C1/18 ,  A61B17/1624 ,  A61B17/1646 ,  A61B2017/00398 ,  A61B2090/0813 ,  A61B2217/005 ,  A61C1/057 ,  A61C1/10

Abstract: A system for enhanced sealing against intrusion of moisture and other contaminants for medical/dental handpieces having rotating or other moving elements driven by a motor within the handpiece. The enhanced sealing includes tandem seals on stepped diameters to provide additional flow pathway impediments. The tandem seals preferably include spring seals that are positioned in opposite directions to provide enhanced sealing against pressures in two different directions that occur during the pressurization and vacuum cycles of an autoclaving process. Additional enhancements include the use of annular sealing rings with x-shaped cross sections.

Abstract translation: 一种用于增强密封以防止湿气和其它污染物侵入医疗/牙科手机的系统，其具有由机头内的电动机驱动的旋转或其它移动元件。 增强的密封包括台阶直径的串联密封，以提供额外的流动路径障碍。 串联密封件优选地包括沿相反方向定位的弹簧密封件，以提供增强的密封，抵抗在高压灭菌过程的加压和真空循环期间发生的两个不同方向上的压力。 另外的增强包括使用具有x形横截面的环形密封圈。

公开(公告)号：US07789918B2

公开(公告)日：2010-09-07

申请号：US11547458

申请日：2004-08-09

Applicant: Deepak Kumar Tuli ,  Ajay Kumar Arora ,  Shanti Prakash ,  Rajiv Ranjan ,  Krishan Kumar Swami ,  Ajay Kumar ,  Rakesh Sarin ,  Ram Prakash Verma ,  Niranjan Raghunath Raje

Inventor： Deepak Kumar Tuli ,  Ajay Kumar Arora ,  Shanti Prakash ,  Rajiv Ranjan ,  Krishan Kumar Swami ,  Ajay Kumar ,  Rakesh Sarin ,  Ram Prakash Verma ,  Niranjan Raghunath Raje

IPC: C10L1/18 ,  C10L1/32 ,  C10M169/04

CPC classification number: C10L10/08 ,  C10L1/18 ,  C10L1/1881 ,  C10L1/19 ,  C10L1/191

Abstract: The present invention relates to a additive composition for use as lubricity improver for low sulphur diesel, comprising c) 0.1-10% by weight of ester derivative derived from cashew nut shell liquid (CNSL esters) of formula (I); f) 0.1-10% by weight of ester derivative derived from cashew nut shell liquid of formula (II); g) 50-95% by weight of free fatty acid of the formula RCOOH in which R represents an alkyl/alkenyl group with 12 to 24 carbon atoms. h) 1-30% by weight of synthetic esters derived by esterifying tri, tetra, penta hydric alcohols with carboxylic acids such as lauric, palmitic, linoleic, ricinoleic etc.

Abstract translation: 本发明涉及一种用作低硫柴油的润滑改进剂的添加剂组合物，其包含c）0.1-10重量％衍生自式（I）的腰果壳液（CNSL酯）的酯衍生物; f）0.1-10重量％衍生自式（II）的腰果壳液的酯衍生物; g）50-95重量％的式RCOOH的游离脂肪酸，其中R表示具有12至24个碳原子的烷基/链烯基。 h）1-30重量％的通过酯化三，四，五羟基醇与羧酸如月桂酸，棕榈酸，亚油酸，蓖麻油酸等衍生的合成酯。

公开(公告)号：US20080098642A1

公开(公告)日：2008-05-01

申请号：US11547458

申请日：2004-08-09

Applicant: Deepak Kumar Tuli ,  Ajay Kumar Arora ,  Shanti Prakash ,  Rajiv Ranjan ,  Krishan Kumar Swami ,  Ajay Kumar ,  Rakesh Sarin ,  Ram Prakash Verma ,  Niranjan Raghunath Raje

Inventor： Deepak Kumar Tuli ,  Ajay Kumar Arora ,  Shanti Prakash ,  Rajiv Ranjan ,  Krishan Kumar Swami ,  Ajay Kumar ,  Rakesh Sarin ,  Ram Prakash Verma ,  Niranjan Raghunath Raje

IPC: C10L1/18

CPC classification number: C10L10/08 ,  C10L1/18 ,  C10L1/1881 ,  C10L1/19 ,  C10L1/191

Abstract: The present invention relates to a additive composition for use as lubricity improver for low sulphur diesel, comprising c) 0.1-10% by weight of ester derivative derived from cashew nut shell liquid (CNSL esters) of formula (I); f) 0.1-10% by weight of ester derivative derived from cashew nut shell liquid of formula (II); g) 50-95% by weight of free fatty acid of the formula RCOOH in which R represents an alkyl/alkenyl group with 12 to 24 carbon atoms. h) 1-30% by weight of synthetic esters derived by esterifying tri, tetra, penta hydric alcohols with carboxylic acids such as lauric, palmitic, linoleic, ricinoleic etc.

Abstract translation: 本发明涉及一种用作低硫柴油的润滑改进剂的添加剂组合物，其包含c）0.1-10重量％衍生自式（I）的腰果壳液（CNSL酯）的酯衍生物; f）0.1-10重量％衍生自式（II）的腰果壳液的酯衍生物; g）50-95重量％的式RCOOH的游离脂肪酸，其中R表示具有12至24个碳原子的烷基/链烯基。 h）1-30重量％的通过酯化三，四，五羟基醇与羧酸如月桂酸，棕榈酸，亚油酸，蓖麻油酸等衍生的合成酯。

公开(公告)号：US20170342086A1

公开(公告)日：2017-11-30

申请号：US15013616

申请日：2016-02-02

Applicant: Ajay Kumar

Inventor： Ajay Kumar

IPC: C07D491/153 ,  G01N21/65 ,  A61K31/337 ,  G01N33/574 ,  A61K31/4741

CPC classification number: C07D491/153 ,  A61K31/337 ,  A61K31/4741 ,  A61K45/06 ,  G01N21/658 ,  G01N33/57496 ,  G01N2333/47 ,  G01N2333/914 ,  A61K2300/00

Abstract: The disclosure provides compounds and methods for treating cancer by inhibiting the formation of cancer cells resistant to paclitaxel by preventing the formation of GBP1:PIM1 protein interaction during a chemotherapeutic treatment. These compounds and methods are able to treat cancer individually or in conjunction with paclitaxel.

公开(公告)号：US20160365283A1

公开(公告)日：2016-12-15

申请号：US14738389

申请日：2015-06-12

Applicant: Wei-Sheng Lei ,  Mohammad Kamruzzaman Chowdhury ,  Brad Eaton ,  Ajay Kumar

Inventor： Wei-Sheng Lei ,  Mohammad Kamruzzaman Chowdhury ,  Brad Eaton ,  Ajay Kumar

IPC: H01L21/82 ,  H01L21/308 ,  H01J37/32 ,  H01L21/02 ,  H01L21/67 ,  H01L21/3065 ,  H01L21/268

CPC classification number: H01L21/82 ,  H01J37/32889 ,  H01J37/32899 ,  H01J2237/334 ,  H01J2237/335 ,  H01L21/02057 ,  H01L21/02076 ,  H01L21/3065 ,  H01L21/3081 ,  H01L21/3086 ,  H01L21/31105 ,  H01L21/31127 ,  H01L21/32131 ,  H01L21/67207 ,  H01L21/78

Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer including a plurality of integrated circuits includes forming a water soluble mask above the semiconductor wafer, the water soluble mask covering and protecting the integrated circuits. The method also includes baking the water soluble mask to increase the etch resistance of the water soluble mask. The method also includes, subsequent to baking the water soluble mask, patterning the water soluble mask with a laser scribing process to provide a water soluble patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The method also includes plasma etching the semiconductor wafer through the gaps in the water soluble patterned mask to singulate the integrated circuits.

Abstract translation: 对具有多个集成电路的每个晶片进行切割的半导体晶片的方法进行了说明。 在一个实例中，对包括多个集成电路的半导体晶片进行切割的方法包括在半导体晶片上形成水溶性掩模，所述水溶性掩模覆盖并保护集成电路。 该方法还包括烘烤水溶性面罩以增加水溶性面膜的耐蚀刻性。 该方法还包括在烘焙水溶性掩模之后，用激光划线工艺图案化水溶性掩模，以提供具有间隙的水溶性图案化掩模，暴露集成电路之间的半导体晶片的区域。 该方法还包括通过水溶性图案化掩模中的间隙等离子体蚀刻半导体晶片以对集成电路进行分离。

公开(公告)号：US20160315009A1

公开(公告)日：2016-10-27

申请号：US14697391

申请日：2015-04-27

Applicant: Wei-Sheng Lei ,  Brad Eaton ,  Jungrae Park ,  Ajay Kumar ,  James S. Papanu ,  Prabhat Kumar

Inventor： Wei-Sheng Lei ,  Brad Eaton ,  Jungrae Park ,  Ajay Kumar ,  James S. Papanu ,  Prabhat Kumar

IPC: H01L21/78 ,  H01L21/683 ,  H01L21/268 ,  H01L21/67 ,  H01L21/308 ,  H01L21/3065

CPC classification number: H01L21/78 ,  H01L21/268 ,  H01L21/3065 ,  H01L21/3086 ,  H01L21/67069 ,  H01L21/67207 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits on a front side of the semiconductor wafer includes adhering a back side the semiconductor wafer on the dicing tape of a substrate carrier. Subsequent to adhering the semiconductor wafer on a dicing tape, the dicing tape is treated with a UV-cure process. Subsequent to treating the dicing tape with the UV-cure process, a dicing mask is formed on the front side of the semiconductor wafer, the dicing mask covering and protecting the integrated circuits. The dicing mask is patterned with a laser scribing process to provide gaps in the dicing mask, the gaps exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is plasma etched through the gaps in the dicing mask layer to singulate the integrated circuits.

Abstract translation: 对具有多个集成电路的每个晶片进行切割的半导体晶片的方法进行了说明。 在一个示例中，在半导体晶片的正面上切割具有多个集成电路的半导体晶片的方法包括将半导体晶片的背面粘附在基板载体的切割带上。 在将半导体晶片粘附在切割带上之后，用UV固化工艺处理切割带。 在通过UV固化处理处理切割带之后，在半导体晶片的前侧形成切割掩模，该切割掩模覆盖并保护集成电路。 用激光刻划工艺对切割掩模进行图案化，以在切割掩模之间提供间隙，在半导体晶片的间隙暴露在集成电路之间。 通过切割掩模层中的间隙对半导体晶片进行等离子体蚀刻，以对集成电路进行分离。

公开(公告)号：US20160086852A1

公开(公告)日：2016-03-24

申请号：US14491856

申请日：2014-09-19

Applicant: James M. Holden ,  Alexander N. Lerner ,  Ajay Kumar ,  Aparna Iyer ,  Alan Hiroshi Ouye

Inventor： James M. Holden ,  Alexander N. Lerner ,  Ajay Kumar ,  Aparna Iyer ,  Alan Hiroshi Ouye

IPC: H01L21/78 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/3065 ,  H01L21/308

Abstract: Methods of and carriers for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a cover ring for protecting a carrier and substrate assembly during an etch process includes an inner opening having a diameter smaller than the diameter of a substrate of the carrier and substrate assembly. An outer frame surrounds the inner opening. The outer frame has a bevel for accommodating an outermost portion of the substrate of the carrier and substrate assembly.

Abstract translation: 描述了半导体晶片切割的方法和载体，每个晶片具有多个集成电路。 在一个示例中，用于在蚀刻工艺期间保护载体和基底组件的盖环包括直径小于载体和基底组件的基底的直径的内部开口。 外框围绕内开口。 外框架具有用于容纳载体和基底组件的基底的最外部分的斜面。

公开(公告)号：US09196536B1

公开(公告)日：2015-11-24

申请号：US14497027

申请日：2014-09-25

Applicant: Jungrae Park ,  Wei-Sheng Lei ,  James S. Papanu ,  Brad Eaton ,  Ajay Kumar

Inventor： Jungrae Park ,  Wei-Sheng Lei ,  James S. Papanu ,  Brad Eaton ,  Ajay Kumar

IPC: H01L21/82 ,  H01L21/78 ,  H01L21/3065 ,  H01L21/67 ,  H01J37/32 ,  B23K26/40 ,  B23K26/36

CPC classification number: H01L21/3065 ,  H01J37/32 ,  H01J37/32889 ,  H01J37/32899 ,  H01J37/32926 ,  H01J2237/2487 ,  H01J2237/334 ,  H01J2237/3341 ,  H01J2237/335 ,  H01L21/02057 ,  H01L21/30655 ,  H01L21/3081 ,  H01L21/67069 ,  H01L21/67092 ,  H01L21/67115 ,  H01L21/78

Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a phase modulated laser beam profile laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

Abstract translation: 对具有多个集成电路的每个晶片进行切割的半导体晶片的方法进行了说明。 在一个例子中，对具有多个集成电路的半导体晶片进行切割的方法包括在半导体晶片上形成掩模，该掩模由覆盖并保护集成电路的层组成。 然后用相位调制的激光束轮廓激光划线工艺对掩模进行构图，以提供具有间隙的图案化掩模，暴露集成电路之间的半导体晶片的区域。 然后通过图案化掩模中的间隙对半导体晶片进行等离子体蚀刻，以对集成电路进行分离。

公开(公告)号：US20150311118A1

公开(公告)日：2015-10-29

申请号：US14272101

申请日：2014-05-07

Applicant: Wei-Sheng Lei ,  Brad Eaton ,  Ajay Kumar

Inventor： Wei-Sheng Lei ,  Brad Eaton ,  Ajay Kumar

IPC: H01L21/78 ,  H01L21/683

CPC classification number: H01L21/78 ,  H01L21/67092 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68377

Abstract: Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of scribing a semiconductor wafer having a plurality of integrated circuits involves adhering a backside of a semiconductor wafer to an inner portion of a carrier tape of a substrate carrier that includes a tape frame mounted above the carrier tape. The method also involves overlaying a protective frame above a front side of the semiconductor wafer and above an exposed outer portion of the carrier tape, the protective frame having an opening exposing an inner region of the front side of the semiconductor wafer. The method also involves laser scribing the front side of the semiconductor wafer with the protective frame in place.

Abstract translation: 对具有多个集成电路的各晶片的切割半导体晶片的方法和装置进行说明。 在一个示例中，划片具有多个集成电路的半导体晶片的方法包括将半导体晶片的背面粘附到包括安装在载带上方的带框架的基板载体的载带的内部。 该方法还包括将保护框架覆盖在半导体晶片的前侧上方并且在载带的暴露的外部部分上方，保护框架具有暴露半导体晶片的前侧的内部区域的开口。 该方法还包括用保护框架将半导体晶片的前侧激光划片就位。