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公开(公告)号：US08186410B2
公开(公告)日：2012-05-29
申请号：US12326340
申请日：2008-12-02
IPC分类号： B32B38/00
CPC分类号： B32B43/006 , B32B37/12 , B32B2038/1891 , B32B2457/14 , H01L21/67173 , H01L21/67346 , Y10S156/93 , Y10S156/941 , Y10T156/11 , Y10T156/1111 , Y10T156/19 , Y10T156/195 , Y10T156/1978 , Y10T279/11
摘要： A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10). This provides a separating device for (i) processing a laminate including a substrate and a support plate and (ii) separating the support plate from the substrate, which separating device performs the separating process efficiently.
摘要翻译： 根据本发明的分离装置将支撑板（14）与包括彼此结合的基板（12）和支撑板（14）的层叠体（10）的基板（12）分离。 分离装置包括：用于储存层压板（10）的第一储存部分（20）。 多个第一处理部（30），用于降低施加在所述基板（12）和所述支撑板（14）之间的粘合剂（13）的粘合力; 以及第一承载部（50），其能够在保持层叠体（10）的同时沿第一方向移动并将层压体（10）从第一收纳部（20）运送到第一处理部（30）。 利用第一承载部分（50），可以提供一个分离装置（100），该分离装置（100）直线移动以便承载层压板（10）。 这提供了一种分离装置，用于（i）处理包括基板和支撑板的层压板，以及（ii）将支撑板与基板分离，该分离装置有效地执行分离过程。
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公开(公告)号：US20090139662A1
公开(公告)日：2009-06-04
申请号：US12326340
申请日：2008-12-02
IPC分类号： B29C63/00
CPC分类号： B32B43/006 , B32B37/12 , B32B2038/1891 , B32B2457/14 , H01L21/67173 , H01L21/67346 , Y10S156/93 , Y10S156/941 , Y10T156/11 , Y10T156/1111 , Y10T156/19 , Y10T156/195 , Y10T156/1978 , Y10T279/11
摘要： A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10). This provides a separating device for (i) processing a laminate including a substrate and a support plate and (ii) separating the support plate from the substrate, which separating device performs the separating process efficiently.
摘要翻译： 根据本发明的分离装置将支撑板（14）与包括彼此结合的基板（12）和支撑板（14）的层叠体（10）的基板（12）分离。 分离装置包括：用于储存层压板（10）的第一储存部分（20）。 多个第一处理部（30），用于降低施加在所述基板（12）和所述支撑板（14）之间的粘合剂（13）的粘合力; 以及第一承载部（50），其能够在保持层叠体（10）的同时沿第一方向移动并将层压体（10）从第一收纳部（20）运送到第一处理部（30）。 利用第一承载部分（50），可以提供一个分离装置（100），该分离装置（100）直线移动以便承载层压板（10）。 这提供了一种分离装置，用于（i）处理包括基板和支撑板的层压板，以及（ii）将支撑板与基板分离，该分离装置有效地执行分离过程。
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公开(公告)号：US08167687B2
公开(公告)日：2012-05-01
申请号：US12309285
申请日：2007-05-24
CPC分类号： B24B41/068 , B24B7/228 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68318 , H01L2221/68327
摘要： A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.
摘要翻译： 晶片可以变薄而不发生凹坑。 支撑板1具有多个通孔10.晶片2的电路形成表面通过粘合构件4和厚度为100μm以上的凹坑防止构件3粘附到支撑板的一个表面，以及 在一个面上具有粘合剂层30粘附到另一个表面，因此通孔10的两端的开口被阻挡。 支撑板通过凹坑防止构件被真空吸附到支撑台上，并且将晶片的非电路形成面研磨/抛光以使晶片变薄。 剥去防止凹坑的构件，并且通过通孔将溶剂渗透到粘合构件中，以将晶片从支撑板上分离。
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公开(公告)号：US20090288780A1
公开(公告)日：2009-11-26
申请号：US12448499
申请日：2007-11-26
IPC分类号： B32B37/12
CPC分类号： H01L21/02002 , H01L21/67132 , H01L21/68757 , Y10T29/49998 , Y10T156/1062 , Y10T156/1798
摘要： To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.
摘要翻译： 为了提供具有高刚性的穿孔支撑板，用于通过插入粘合剂层来支撑晶片表面的穿孔支撑板包括用于偏转预防的加强部件。
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公开(公告)号：US20100024853A1
公开(公告)日：2010-02-04
申请号：US12448916
申请日：2008-01-11
IPC分类号： B08B3/12
CPC分类号： H01L21/67132 , H01L21/67086 , Y10T156/1111
摘要： In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit comprises: a supply part for supplying a support plate surface with a liquid solvent; a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region; and a vibration unit for vibrating the liquid solvent.
摘要翻译： 为了提供液体溶剂抵接单元，用于加速液体溶剂与存在于多孔支撑板和晶片之间的粘合剂的反应，液体溶剂抵接单元包括：用于向支撑板表面供应液体的供应部分 溶剂; 用于将供应的液体溶剂保持在支撑板表面上的孔形区域中的保持部分; 用于回收保留在孔形区域中的液体溶剂的回收部分; 以及用于振动液体溶剂的振动单元。
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公开(公告)号：US08449691B2
公开(公告)日：2013-05-28
申请号：US12448916
申请日：2008-01-11
IPC分类号： B08B3/00
CPC分类号： H01L21/67132 , H01L21/67086 , Y10T156/1111
摘要： In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit includes a supply part for supplying a support plate surface with a liquid solvent, a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region, and a vibration unit for vibrating the liquid solvent.
摘要翻译： 为了提供液体溶剂抵靠单元，用于加速液体溶剂与存在于多孔支撑板和晶片之间的粘合剂的反应，液体溶剂抵靠单元包括用于向支撑板表面供给液体溶剂的供应部件 ，用于将所提供的液体溶剂保持在支撑板表面上的孔形区域中的保持部分; 用于回收保留在孔形区域中的液体溶剂的回收部分和用于使液体溶剂振动的振动单元。
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公开(公告)号：US20090325467A1
公开(公告)日：2009-12-31
申请号：US12309285
申请日：2007-05-24
CPC分类号： B24B41/068 , B24B7/228 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68318 , H01L2221/68327
摘要： A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.
摘要翻译： 晶片可以变薄而不发生凹坑。 支撑板1具有多个通孔10.晶片2的电路形成表面通过粘合构件4和厚度为100μm以上的凹坑防止构件3粘附到支撑板的一个表面，以及 在一个面上具有粘合剂层30粘附到另一个表面，因此通孔10的两端的开口被阻挡。 支撑板通过凹坑防止构件被真空吸附到支撑台上，并且将晶片的非电路形成面研磨/抛光以使晶片变薄。 剥去防止凹坑的构件，并且通过通孔将溶剂渗透到粘合构件中，以将晶片从支撑板上分离。
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公开(公告)号：US08080123B2
公开(公告)日：2011-12-20
申请号：US13036761
申请日：2011-02-28
CPC分类号： B29C63/0013 , B29L2031/3425 , Y10T156/1111 , Y10T156/1132 , Y10T156/1928
摘要： A method for stripping a supporting plate from a circuit-formed surface of a substrate to which it is bonded with an adhesive by using a plate which has a first penetrating hole formed in a substantially central portion thereof in the thickness direction, a second penetrating hole formed in a peripheral portion thereof in the thickness direction, and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate. The method involves supplying a solvent from outside to the first penetrating hole of the plate and to an associated first penetrating hole formed in a substantially central portion of the supporting plate; distributing the solvent from the first penetrating hole of the supporting plate through grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate; dissolving the adhesive with the solvent; and draining the solvent from a second penetrating hole connecting with the grooves and formed in a peripheral portion of the supporting plate and the second penetrating hole formed in the plate.
摘要翻译： 一种从其厚度方向的大致中央部形成有第一贯通孔的板剥离由基板的电路形成面与粘接剂抵接的支撑板的方法，第二贯通孔 在其厚度方向的周边部分形成有用于吸引形成在板的径向方向上的第一贯通孔和第二贯通孔之间的支撑板的孔。 该方法包括从外部向板的第一穿透孔和形成在支撑板的大致中心部分中的相关联的第一穿透孔提供溶剂; 从支撑板的第一贯通孔通过形成在支撑板的表面上的与粘合剂接触并与支撑板的第一穿透孔连接的槽分配溶剂; 用溶剂溶解粘合剂; 并且从与所述槽连接的第二贯通孔排出溶剂，并形成在所述支撑板的周边部分和形成在所述板中的所述第二贯通孔。
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9.发明授权公开(公告)号：US07919394B2
公开(公告)日：2011-04-05
申请号：US11517157
申请日：2006-09-07
CPC分类号： H01L21/78 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363
摘要： A method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate and the substrate are joined by using an adhesive layer, and a sheet is attached to the supporting plate. The surface of the supporting plate to which the sheet has been attached is mounted and fixed by attraction onto an attracting head. The surface of the semiconductor wafer on which no circuit device is formed is ground by a grinder in this state.
摘要翻译： 一种用于使基板变薄的方法和用于制造电路器件的方法，其可以防止支撑板的穿透图案被转移到基板的表面并防止基板表面的不均匀研磨 从发生。 支撑板和基板通过使用粘合剂层接合，并且片材附接到支撑板。 已经安装了片材的支撑板的表面通过吸引安装和固定到吸引头上。 在该状态下，通过研磨机研磨不形成电路器件的半导体晶片的表面。
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10.发明申请ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION 审中-公开胶粘组合物，胶粘剂和组合物的生产方法公开(公告)号：US20100178497A1
公开(公告)日：2010-07-15
申请号：US12377155
申请日：2007-08-03
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
IPC分类号： C08F120/18 , B32B27/36 , B32B27/32
CPC分类号： C09J133/10 , C09J7/381 , C09J125/14 , C09J2425/00 , C09J2433/00 , Y10T428/2891
摘要： Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, (meth)acrylic acid ester having a cyclic structure and alkyl (meth)acrylate having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesive strength under high temperature conditions, and alkali resistance, and easiness in stripping of an adhesive composition that has been processed at a high temperature. Consequently, there can be obtained an adhesive composition which has high heat resistance, adhesion strength under high temperature conditions, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.
摘要翻译： 公开了主要由通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯和具有链结构的（甲基）丙烯酸烷基酯）而得到的聚合物的粘合剂组合物。 单体组合物可以另外含有双官能单体，从而提高耐热性，高温条件下的粘合强度和耐碱性，以及在高温下处理的粘合剂组合物的剥离容易性。 因此，可以获得在高温条件下具有高耐热性，粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。
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