公开(公告)号：US07126087B2

公开(公告)日：2006-10-24

申请号：US10912141

申请日：2004-08-06

申请人： Shigeto Kamata ,  Akihiro Kimura

发明人： Shigeto Kamata ,  Akihiro Kimura

IPC分类号： F27D11/00

CPC分类号： F27D99/0001 ,  F27B17/0016 ,  F27D9/00 ,  F27D19/00

摘要： A method of effecting high temperature vacuum heating and cooling suitable for conducting heat treatment to be performed on components used in a display apparatus. The heating/cooling method includes the steps of: heating a plate-like member placed in a reduced pressure atmosphere in a chamber by heating means opposed to the plate-like member; and cooling the plate-like member by a cooling plate which is opposed to the plate-like member, with the heating means therebetween, the cooling plate having a heat reflecting function. The cooling plate has an emissivity of not less than 0.50 but not more than 0.80 so as to minimize a sum of a requisite time for the heating step and a requisite time for the cooling step.

摘要翻译： 实现对在显示装置中使用的部件进行热处理的高温真空加热和冷却的方法。 加热/冷却方法包括以下步骤：通过与板状部件相对的加热装置将设置在减压气氛中的板状部件加热到室内; 并且通过与板状构件相对的冷却板将板状构件冷却，其间具有加热装置，冷却板具有热反射功能。 冷却板的发射率不低于0.50但不大于0.80，以便将加热步骤的必要时间和冷却步骤所需的时间的总和最小化。

公开(公告)号：US07039303B2

公开(公告)日：2006-05-02

申请号：US10943011

申请日：2004-09-17

申请人： Akihiro Kimura ,  Shigeto Kamata

发明人： Akihiro Kimura ,  Shigeto Kamata

IPC分类号： F26B19/00

CPC分类号： F26B5/04 ,  F26B25/08

摘要： On the occasion of producing an image display apparatus, in order to suppress the bend and breakage of a substrate by uniformly heating the substrate which constructs a chamber which contains the image display apparatus, a plurality of heaters are located in opposition to both sides of the substrate in a vacuum chamber, which are further surrounded by a heat reflecting member, a partitioning member is located between end faces of the substrate and the heat reflecting member, and the substrate is heated.

摘要翻译： 在制造图像显示装置的情况下，为了通过均匀加热构成包含图像显示装置的室的基板来抑制基板的弯曲和断裂，多个加热器位于与图像显示装置的两侧相对的位置 基板在进一步被热反射构件包围的真空室中，分隔构件位于基板的端面和热反射构件之间，并且基板被加热。

公开(公告)号：US20050034850A1

公开(公告)日：2005-02-17

申请号：US10885683

申请日：2004-07-08

申请人： Masanao Yoshimura ,  Takeshi Yakou ,  Akihiko Komura ,  Akihiro Kimura ,  Shigeto Kamata

发明人： Masanao Yoshimura ,  Takeshi Yakou ,  Akihiko Komura ,  Akihiro Kimura ,  Shigeto Kamata

IPC分类号： C03B29/02 ,  C03B32/00 ,  C03C23/00 ,  F27B17/00 ,  F27D19/00 ,  F27D99/00 ,  H01J9/24 ,  F01P7/10 ,  F28F27/00

CPC分类号： C03C23/007 ,  C03B29/025 ,  C03B32/00 ,  F27B17/0016 ,  F27D19/00 ,  F27D99/0001 ,  H01J9/241 ,  H01J9/242 ,  H01J2211/36

摘要： A heating/cooling method, a manufacturing method of an image displaying apparatus, a heating/cooling apparatus, and a heating/cooling processing apparatus, in which the heating and cooling of a substrate can be executed at a high speed are provided.

摘要翻译： 提供加热/冷却方法，图像显示装置的制造方法，加热/冷却装置和加热/冷却处理装置，其中可以高速执行基板的加热和冷却。

公开(公告)号：US08115391B2

公开(公告)日：2012-02-14

申请号：US12372287

申请日：2009-02-17

申请人： Akihiro Kimura ,  Masateru Yasuhara ,  Shigeto Kamata

发明人： Akihiro Kimura ,  Masateru Yasuhara ,  Shigeto Kamata

IPC分类号： H01J17/16 ,  H01L33/00

CPC分类号： H05K5/061

摘要： A hermetic envelope includes a first plate, a second plate, and a frame provided between the first plate and the second plate to form an interior space. A first bonding part is provided between the frame and the first plate to bond the frame and the first plate to each other, and a first abutting part is provided between the frame and the first plate, and positioned closer to the interior space than the first bonding part. A second bonding part is provided between the frame and the second plate to bond the frame and the second plate to each other, and a second abutting part is provided between the frame and the second plate and positioned closer to the interior space than the second bonding part. The second bonding part is positioned closer to the interior space than the first bonding part.

摘要翻译： 密封壳包括第一板，第二板和设置在第一板和第二板之间以形成内部空间的框架。 第一接合部设置在框架和第一板之间，以将框架和第一板彼此接合，并且第一邻接部分设置在框架和第一板之间，并且位于比第一板更接近内部空间的位置 粘接部分。 第二接合部设置在框架和第二板之间，以将框架和第二板彼此接合，并且第二抵接部分设置在框架和第二板之间，并且定位成比第二接合更靠近内部空间 部分。 第二接合部位于比第一接合部更靠近内部空间的位置。

公开(公告)号：US06962516B2

公开(公告)日：2005-11-08

申请号：US10236983

申请日：2002-09-09

申请人： Kazuhiro Ohki ,  Shigeto Kamata ,  Akihiro Kimura

发明人： Kazuhiro Ohki ,  Shigeto Kamata ,  Akihiro Kimura

IPC分类号： H01J9/44 ,  H01J9/02 ,  H01J9/39 ,  H01J9/00 ,  H01J9/42

CPC分类号： H01J9/025 ,  H01J9/027

摘要： A voltage applying apparatus including a holder, a probe and the like as voltage applying means enabling the application of a voltage to electrode wiring connected with electric conductors formed on a substrate on which the electrode wiring is formed. The apparatus is equipped with aligning means making the position of the probe follow to the changes of the position of the electrode wiring to coincide with them. The aligning means makes the position of the probe follow the position of the electrode wiring so that the probe aligns the electrode wiring by the thermal expansion of the holder.

摘要翻译： 一种电压施加装置，包括保持器，探针等作为电压施加装置，其能够施加与形成在其上形成有电极布线的基板上的电导体连接的电极布线的电压。 该装置配备有对准装置，使得探针的位置跟随电极布线的位置的变化与它们重合。 对准装置使探针的位置跟随电极布线的位置，使得探针通过保持器的热膨胀来对准电极布线。

公开(公告)号：US20050074230A1

公开(公告)日：2005-04-07

申请号：US10944760

申请日：2004-09-21

申请人： Shigeto Kamata ,  Akihiro Kimura

发明人： Shigeto Kamata ,  Akihiro Kimura

IPC分类号： H01L21/00 ,  B05D5/12 ,  F21V7/00 ,  G02B17/00

CPC分类号： H01L21/67109

摘要： In an apparatus for performing heating treatment of a structure composed of a substrate and a structure arranged on the front surface of the substrate, the latter structure having thermal capacity smaller than that of the substrate, heaters are arranged to be opposed to the front surface and the back surface of the substrate, respectively, and a cooling body is arranged at a position opposed to the back surface of the substrate to sandwich the heater of the back surface between the cooling body and the substrate. Thereby, the heating and the cooling of the substrate are performed rapidly to shorten the time of a heating process, and the deformation and the damage of the substrate at the time of heating are prevented.

摘要翻译： 在用于对由基板和布置在基板的前表面上的结构构成的结构进行加热处理的装置中，后者结构的热容量小于基板的热容量，加热器布置成与前表面相对， 基板的背面和冷却体配置在与基板的背面相对的位置，将背面的加热器夹在冷却体与基板之间。 因此，快速地进行基板的加热和冷却，缩短加热处理的时间，并且防止加热时的基板的变形和损坏。

公开(公告)号：US20050029243A1

公开(公告)日：2005-02-10

申请号：US10912141

申请日：2004-08-06

申请人： Shigeto Kamata ,  Akihiro Kimura

发明人： Shigeto Kamata ,  Akihiro Kimura

IPC分类号： F27B5/14 ,  F27B17/00 ,  F27D9/00 ,  F27D19/00 ,  F27D99/00

CPC分类号： F27D99/0001 ,  F27B17/0016 ,  F27D9/00 ,  F27D19/00

摘要： The present invention provides a method of effecting high temperature vacuum heating and cooling suitable for conducting heat treatment to be performed on components used in a display apparatus. The present invention's heating/cooling method comprises the steps of: heating a plate-like member placed in a reduced pressure atmosphere in a chamber by heating means opposed to the plate-like member; and cooling the plate-like member by a cooling plate which is opposed to the plate-like member, with the heating means therebetween, the cooling plate having a heat reflecting function. In one aspect of the present invention, the cooling plate is designed to have a emissivity of not less than 0.50 but not more than 0.80 so as to minimizes a sum of a requisite time for the heating step and a requisite time for the cooling step. In another aspect of the present invention, the plate-like member to be heated has two main surfaces differing from each in an in-plane distribution of emissivity and the heating means is opposed to one of the two main surfaces, which has a smaller distribution ratio, thereby realizing uniform and efficient heating/cooling.

摘要翻译： 本发明提供一种实现对在显示装置中使用的部件进行热处理的高温真空加热和冷却的方法。 本发明的加热/冷却方法包括以下步骤：通过与板状部件相对的加热装置将设置在减压气氛中的板状部件加热到室内; 并且通过与板状构件相对的冷却板将板状构件冷却，其间具有加热装置，冷却板具有热反射功能。 在本发明的一个方面，冷却板被设计为具有不小于0.50但不大于0.80的发射率，以使加热步骤的必要时间和冷却步骤的必要时间之和最小化。 在本发明的另一方面，待加热的板状构件具有两个主表面，每个在发射率的面内分布中各自不同，并且加热装置与两个主表面中的一个相对，分布较小 比例，从而实现均匀有效的加热/冷却。

公开(公告)号：US20090205849A1

公开(公告)日：2009-08-20

申请号：US12372287

申请日：2009-02-17

申请人： Akihiro Kimura ,  Masateru Yasuhara ,  Shigeto Kamata

发明人： Akihiro Kimura ,  Masateru Yasuhara ,  Shigeto Kamata

IPC分类号： H05K5/06

CPC分类号： H05K5/061

摘要： A hermetic envelope includes a first plate, a second plate, and a frame provided between the first plate and the second plate to form an interior space. A first bonding part is provided between the frame and the first plate to bond the frame and the first plate to each other, and a first abutting part is provided between the frame and the first plate, and positioned closer to the interior space than the first bonding part. A second bonding part is provided between the frame and the second plate to bond the frame and the second plate to each other, and a second abutting part is provided between the frame and the second plate and positioned closer to the interior space than the second bonding part. The second bonding part is positioned closer to the interior space than the first bonding part.

摘要翻译： 密封壳包括第一板，第二板和设置在第一板和第二板之间以形成内部空间的框架。 第一接合部设置在框架和第一板之间，以将框架和第一板彼此接合，并且第一邻接部分设置在框架和第一板之间，并且位于比第一板更接近内部空间的位置 粘接部分。 第二接合部设置在框架和第二板之间，以将框架和第二板彼此接合，并且第二抵接部分设置在框架和第二板之间，并且定位成比第二接合更靠近内部空间 部分。 第二接合部位于比第一接合部更靠近内部空间的位置。

公开(公告)号：US06937041B2

公开(公告)日：2005-08-30

申请号：US10789996

申请日：2004-03-02

申请人： Akihiro Kimura ,  Kazuhiro Oki ,  Shigeto Kamata

发明人： Akihiro Kimura ,  Kazuhiro Oki ,  Shigeto Kamata

IPC分类号： G01R1/06 ,  H01J9/02 ,  G01R31/02

CPC分类号： H01J9/02 ,  H01J2201/3165 ,  H01J2329/00 ,  Y10T29/49204

摘要： A probe for applying a voltage to lines provided on a substrate comprises (a) a conductive sheet, the conductive sheet including a mesh sheet in which linear members are woven into a mesh and a conductive material which coats the mesh sheet, (b) an elastic member for pressing the conductive sheet against the lines, and (c) a holding member for holding the conductive sheet and the elastic member together. The probe has improved electrical connectivity and durability, and achieves a reduction in size and facilitation of operations of an apparatus for manufacturing an electron source.

摘要翻译： 用于对设置在基板上的线施加电压的探针包括（a）导电片，所述导电片包括网状片，所述网片将线状构件编织成网状物，以及涂覆网片的导电材料，（b） 用于将导电片压靠在线上的弹性构件，以及（c）用于将导电片和弹性构件保持在一起的保持构件。 探针具有改善的电连接性和耐久性，并且实现了用于制造电子源的装置的操作的尺寸的减小和便利化。

公开(公告)号：US20050075031A1

公开(公告)日：2005-04-07

申请号：US10957839

申请日：2004-10-05

申请人： Shigeto Kamata ,  Kazuhiro Oki ,  Akihiro Kimura ,  Kazumasa Takatsu

发明人： Shigeto Kamata ,  Kazuhiro Oki ,  Akihiro Kimura ,  Kazumasa Takatsu

IPC分类号： H01J9/02 ,  H01J9/42

CPC分类号： H01J9/42 ,  H01J9/027 ,  H01J2201/3165 ,  H01J2329/00

摘要： In an electron source manufacturing apparatus, the quantity of heat generated from an electron source substrate is measured. A temperature of a support member for the electron source substrate is controlled based on the measured quantity of heat generated. A variation in performances of electron source substrates is suppressed, which increase their life.

摘要翻译： 在电子源制造装置中，测量从电子源基板产生的热量。 基于所测量的热量来控制电子源基板的支撑部件的温度。 抑制了电子源基板的性能变化，延长了使用寿命。