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    Semiconductor testing jig and semiconductor testing method performed by using the same
    1.
    发明授权
    Semiconductor testing jig and semiconductor testing method performed by using the same 有权
    采用半导体测试夹具和半导体测试方法

    公开(公告)号：US09347988B2

    公开(公告)日：2016-05-24

    申请号：US13829344

    申请日：2013-03-14

    申请人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

    发明人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

    IPC分类号： G01R31/00 ,  G01R31/28

    CPC分类号： G01R31/2886 ,  G01R31/2887 ,  G01R31/2889

    摘要： A semiconductor testing jig fixes a measurement target while it is held between a chuck stage and the measurement target. The semiconductor testing jig includes a base on which the measurement target is to be installed and which can be attached to the chuck stage. The base includes: a first main surface to become an installation surface for the measurement target; a second main surface opposite the first main surface and which is to contact the chuck stage; and a porous region containing a porous member. The porous region is provided selectively as seen in plan view, and penetrates through the base from the first main surface toward the second main surface.

    摘要翻译： 半导体测试夹具固定在夹持台与测量对象之间的测量对象。 半导体测试夹具包括其上要安装测量对象的基座，并且其可以附接到卡盘台。 基座包括：成为测量对象的安装表面的第一主表面; 与第一主表面相对并且与卡盘台接触的第二主表面; 以及包含多孔构件的多孔区域。 选择性地设置多孔区域，如俯视图所示，并且从第一主表面朝向第二主表面贯穿基部。

    Probe card
    2.
    发明授权
    Probe card 有权
    探针卡

    公开(公告)号：US09157931B2

    公开(公告)日：2015-10-13

    申请号：US13783081

    申请日：2013-03-01

    申请人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

    发明人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

    IPC分类号： G01R1/073 ,  G01R1/067

    CPC分类号： G01R1/073 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/07342

    摘要： It is an object of the present invention to provide a probe card capable of controlling generation of a scratch or an indentation in a connection pad and capable of controlling generation of heat in a connection pad and its vicinity having contacted a contact probe at low cost and in a simple way. A probe card includes a probe substrate, at least one contact probe electrically connected to a signal line provided to an insulating base of the probe substrate and fixed to the insulating base, and at least one engagement member installed on the contact probe at a position near a tip end portion of the contact probe. The engagement member has at least one engagement portion that makes abutting contact with another predetermined member during operation to restrain the operation of the contact probe.

    摘要翻译： 本发明的目的是提供一种探针卡，其能够控制在连接焊盘中产生划痕或凹陷，并能够以低成本接触接触探针的连接焊盘及其附近的热量产生， 以简单的方式。 探针卡包括探针基板，至少一个接触探针，电连接到提供到探针基板的绝缘基底并固定到绝缘基底的信号线，以及至少一个接合构件，安装在接触探针上的位置附近 接触探针的末端部分。 接合构件具有在操作期间与另一个预定构件邻接接触的至少一个接合部分，以限制接触探针的操作。

    Wafer suction method, wafer suction stage, and wafer suction system
    3.
    发明授权
    Wafer suction method, wafer suction stage, and wafer suction system 有权
    晶圆抽吸法，晶片吸附台和晶片抽吸系统

    公开(公告)号：US09312160B2

    公开(公告)日：2016-04-12

    申请号：US13617354

    申请日：2012-09-14

    申请人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

    发明人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

    IPC分类号： B25B11/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687

    CPC分类号： H01L21/67748 ,  H01L21/6838 ,  H01L21/68707 ,  Y10T29/49998

    摘要： A method of attaching a wafer by suction, includes a step of mounting a wafer on a right arm and a left arm of a transfer jig, moving the transfer jig toward a wafer suction stage in such a manner that a facing right arm surface of the right arm slides along and in contact with a first side surface of the wafer suction stage and a facing left arm surface of the left arm slides along and in contact with a second side surface of the wafer suction stage until the wafer comes to lie directly above a mounting surface of the wafer suction stage, mounting the wafer on the mounting surface by moving the transfer jig downward toward the wafer suction stage while maintaining the contacts, and attaching the wafer to the mounting surface by suction.

    摘要翻译： 通过抽吸附着晶片的方法包括将晶片安装在转移夹具的右臂和左臂上的步骤，将转移夹具朝向晶片吸入台移动，使得所述转子夹具的相对的右臂表面 右臂与晶片吸入台的第一侧表面滑动并与其接触，并且左臂的面向的左臂表面沿晶片吸入台的第二侧表面滑动并与其接触，直到晶片直接位于上方 晶片吸入台的安装面，通过在保持接触的同时将转移夹具向下移动到晶片吸入台，将晶片安装在安装面上，并通过抽吸将晶片安装在安装面上。

    Inspection apparatus
    4.
    发明授权
    Inspection apparatus 有权
    检验仪器

    公开(公告)号：US09188624B2

    公开(公告)日：2015-11-17

    申请号：US13741195

    申请日：2013-01-14

    申请人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

    发明人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

    IPC分类号： G01R31/02 ,  G01R31/26 ,  G01R31/28

    CPC分类号： G01R31/2601 ,  G01R31/2642 ,  G01R31/2875

    摘要： An inspection apparatus includes a probe substrate, a socket secured to the probe substrate, a heating element wire wound around the socket, a probe tip detachably connected to the socket, a stage on which an object to be measured is mounted, and a heating unit for heating the stage.

    摘要翻译： 一种检查装置，包括探针基板，固定到探针基板的插座，缠绕在插座上的加热元件线，可拆卸地连接到插座的探针末端，安装被测量对象的台，加热单元 用于加热舞台。

    Inspection apparatus and inspection method
    6.
    发明授权
    Inspection apparatus and inspection method 有权
    检验仪器和检验方法

    公开(公告)号：US08981805B2

    公开(公告)日：2015-03-17

    申请号：US13783060

    申请日：2013-03-01

    申请人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

    发明人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

    IPC分类号： G01R1/067 ,  G01R31/28

    CPC分类号： G01R1/06711 ,  G01R1/067 ,  G01R31/2863

    摘要： An inspection apparatus includes an insulating substrate, a probe pin having a body portion secured to the insulating substrate, a tip portion connected to one end of the body portion and disposed on the back surface side of the insulating substrate, and a connection portion connected to the other end of the body portion and disposed on the front surface side of the insulating substrate, and a heat-radiating terminal in contact with the connection portion, wherein a current is applied through the heat-radiating terminal and the probe pin to an object to measured, and wherein the heat-radiating terminal discharges heat from the probe pin.

    摘要翻译： 检查装置包括绝缘基板，具有固定到绝缘基板的主体部分的探针，与主体部分的一端连接并设置在绝缘基板的背面侧的端部，以及连接部 主体部分的另一端并且设置在绝缘基板的前表面侧，以及与连接部分接触的散热端子，其中通过散热端子和探针施加电流到物体 并且其中所述散热端从所述探针引出热量。

    Alkyl and aralkyl-substituted pyrrolocarbazole derivatives that stimulate platelet production
    8.
    发明授权
    Alkyl and aralkyl-substituted pyrrolocarbazole derivatives that stimulate platelet production 失效
    刺激血小板生成的烷基和芳烷基取代的吡咯并咔唑衍生物

    公开(公告)号：US5728709A

    公开(公告)日：1998-03-17

    申请号：US737194

    申请日：1996-11-08

    申请人： Yoji Ikuina ,  Chikara Murakata ,  Yutaka Saitoh ,  Yukimasa Shiotsu ,  Takako Iida ,  Tatsuya Tamaoki ,  Kinya Yamashita ,  Shiro Akinaga

    发明人： Yoji Ikuina ,  Chikara Murakata ,  Yutaka Saitoh ,  Yukimasa Shiotsu ,  Takako Iida ,  Tatsuya Tamaoki ,  Kinya Yamashita ,  Shiro Akinaga

    IPC分类号： C07D487/04 ,  A61K31/41 ,  A61K31/44

    CPC分类号： C07D487/04

    摘要： Described herein is a pyrrolocarbazole derivative and a pharmaceutically acceptable salt thereof having the following formula (I): ##STR1## wherein R.sup.1 is lower alkyl or aralkyl; R.sup.2 is hydrogen, substituted or unsubstituted lower alkyl, lower alkenyl, or substituted or unsubstituted aralkyl; R.sup.3, R.sup.4, R.sup.5, R.sup.6 and R.sup.7 may be the same or different, and are hydrogen, halogen, nitro, substituted or unsubstituted lower alkanoyl, NR.sup.9 R.sup.10, or OR.sup.11 ; R.sup.8 is hydrogen or is combined with R.sup.3 to form --CONR.sup.12 --; and when R.sup.1 is benzyl; R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 are not simultaneously hydrogen. A compound of the present invention stimulates platelet production and is useful for treatment of thrombocytopenia.

    摘要翻译： PCT No.PCT / JP96 / 00557 Sec。 371日期：1996年11月8日 102（e）1996年11月8日PCT PCT 1996年3月7日PCT公布。 公开号WO96 / 28447 日本1996年9月19日描述了具有下式（I）的吡咯并咔唑衍生物及其药学上可接受的盐：其中R 1是低级烷基或芳烷基; R2是氢，取代或未取代的低级烷基，低级链烯基或取代或未取代的芳烷基; R 3，R 4，R 5，R 6和R 7可以相同或不同，为氢，卤素，硝基，取代或未取代的低级烷酰基，NR 9 R 10或OR 11; R8是氢或与R3结合形成-CONR 12 - ; 当R1为苄基时; R2，R3，R4，R5，R6，R7和R8不同时为氢。 本发明的化合物刺激血小板产生，并且可用于治疗血小板减少症。