公开(公告)号：US09312160B2

公开(公告)日：2016-04-12

申请号：US13617354

申请日：2012-09-14

申请人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

发明人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

IPC分类号： B25B11/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67748 ,  H01L21/6838 ,  H01L21/68707 ,  Y10T29/49998

摘要： A method of attaching a wafer by suction, includes a step of mounting a wafer on a right arm and a left arm of a transfer jig, moving the transfer jig toward a wafer suction stage in such a manner that a facing right arm surface of the right arm slides along and in contact with a first side surface of the wafer suction stage and a facing left arm surface of the left arm slides along and in contact with a second side surface of the wafer suction stage until the wafer comes to lie directly above a mounting surface of the wafer suction stage, mounting the wafer on the mounting surface by moving the transfer jig downward toward the wafer suction stage while maintaining the contacts, and attaching the wafer to the mounting surface by suction.

摘要翻译： 通过抽吸附着晶片的方法包括将晶片安装在转移夹具的右臂和左臂上的步骤，将转移夹具朝向晶片吸入台移动，使得所述转子夹具的相对的右臂表面 右臂与晶片吸入台的第一侧表面滑动并与其接触，并且左臂的面向的左臂表面沿晶片吸入台的第二侧表面滑动并与其接触，直到晶片直接位于上方 晶片吸入台的安装面，通过在保持接触的同时将转移夹具向下移动到晶片吸入台，将晶片安装在安装面上，并通过抽吸将晶片安装在安装面上。

公开(公告)号：US09188624B2

公开(公告)日：2015-11-17

申请号：US13741195

申请日：2013-01-14

申请人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

发明人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

IPC分类号： G01R31/02 ,  G01R31/26 ,  G01R31/28

CPC分类号： G01R31/2601 ,  G01R31/2642 ,  G01R31/2875

摘要： An inspection apparatus includes a probe substrate, a socket secured to the probe substrate, a heating element wire wound around the socket, a probe tip detachably connected to the socket, a stage on which an object to be measured is mounted, and a heating unit for heating the stage.

摘要翻译： 一种检查装置，包括探针基板，固定到探针基板的插座，缠绕在插座上的加热元件线，可拆卸地连接到插座的探针末端，安装被测量对象的台，加热单元 用于加热舞台。

公开(公告)号：US09347988B2

公开(公告)日：2016-05-24

申请号：US13829344

申请日：2013-03-14

申请人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

发明人： Hajime Akiyama ,  Akira Okada ,  Kinya Yamashita

IPC分类号： G01R31/00 ,  G01R31/28

CPC分类号： G01R31/2886 ,  G01R31/2887 ,  G01R31/2889

摘要： A semiconductor testing jig fixes a measurement target while it is held between a chuck stage and the measurement target. The semiconductor testing jig includes a base on which the measurement target is to be installed and which can be attached to the chuck stage. The base includes: a first main surface to become an installation surface for the measurement target; a second main surface opposite the first main surface and which is to contact the chuck stage; and a porous region containing a porous member. The porous region is provided selectively as seen in plan view, and penetrates through the base from the first main surface toward the second main surface.

摘要翻译： 半导体测试夹具固定在夹持台与测量对象之间的测量对象。 半导体测试夹具包括其上要安装测量对象的基座，并且其可以附接到卡盘台。 基座包括：成为测量对象的安装表面的第一主表面; 与第一主表面相对并且与卡盘台接触的第二主表面; 以及包含多孔构件的多孔区域。 选择性地设置多孔区域，如俯视图所示，并且从第一主表面朝向第二主表面贯穿基部。

公开(公告)号：US09157931B2

公开(公告)日：2015-10-13

申请号：US13783081

申请日：2013-03-01

申请人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

发明人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

IPC分类号： G01R1/073 ,  G01R1/067

CPC分类号： G01R1/073 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/07342

摘要： It is an object of the present invention to provide a probe card capable of controlling generation of a scratch or an indentation in a connection pad and capable of controlling generation of heat in a connection pad and its vicinity having contacted a contact probe at low cost and in a simple way. A probe card includes a probe substrate, at least one contact probe electrically connected to a signal line provided to an insulating base of the probe substrate and fixed to the insulating base, and at least one engagement member installed on the contact probe at a position near a tip end portion of the contact probe. The engagement member has at least one engagement portion that makes abutting contact with another predetermined member during operation to restrain the operation of the contact probe.

摘要翻译： 本发明的目的是提供一种探针卡，其能够控制在连接焊盘中产生划痕或凹陷，并能够以低成本接触接触探针的连接焊盘及其附近的热量产生， 以简单的方式。 探针卡包括探针基板，至少一个接触探针，电连接到提供到探针基板的绝缘基底并固定到绝缘基底的信号线，以及至少一个接合构件，安装在接触探针上的位置附近 接触探针的末端部分。 接合构件具有在操作期间与另一个预定构件邻接接触的至少一个接合部分，以限制接触探针的操作。

公开(公告)号：US09207257B2

公开(公告)日：2015-12-08

申请号：US13784727

申请日：2013-03-04

申请人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

发明人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

IPC分类号： G01R31/00 ,  G01R1/067 ,  G01R1/44 ,  G01R3/00 ,  G01R1/04

CPC分类号： G01R1/0408 ,  G01R1/06705 ,  G01R1/44 ,  G01R3/00

摘要： An inspection apparatus includes an insulating substrate, a socket in which a body portion having a through-hole in a wall thereof is integrally formed with a connection portion secured to the insulating substrate, and a contact probe detachably secured to the socket.

摘要翻译： 一种检查装置，包括：绝缘基板，具有在其壁上具有通孔的主体部分与固定到所述绝缘基板的连接部一体形成的插座和可拆卸地固定到所述插座的接触探针的插座。

公开(公告)号：US08981805B2

公开(公告)日：2015-03-17

申请号：US13783060

申请日：2013-03-01

申请人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

发明人： Akira Okada ,  Hajime Akiyama ,  Kinya Yamashita

IPC分类号： G01R1/067 ,  G01R31/28

CPC分类号： G01R1/06711 ,  G01R1/067 ,  G01R31/2863

摘要： An inspection apparatus includes an insulating substrate, a probe pin having a body portion secured to the insulating substrate, a tip portion connected to one end of the body portion and disposed on the back surface side of the insulating substrate, and a connection portion connected to the other end of the body portion and disposed on the front surface side of the insulating substrate, and a heat-radiating terminal in contact with the connection portion, wherein a current is applied through the heat-radiating terminal and the probe pin to an object to measured, and wherein the heat-radiating terminal discharges heat from the probe pin.

摘要翻译： 检查装置包括绝缘基板，具有固定到绝缘基板的主体部分的探针，与主体部分的一端连接并设置在绝缘基板的背面侧的端部，以及连接部 主体部分的另一端并且设置在绝缘基板的前表面侧，以及与连接部分接触的散热端子，其中通过散热端子和探针施加电流到物体 并且其中所述散热端从所述探针引出热量。

公开(公告)号：US08823360B2

公开(公告)日：2014-09-02

申请号：US13213778

申请日：2011-08-19

申请人： Hajime Akiyama ,  Akira Okada

发明人： Hajime Akiyama ,  Akira Okada

IPC分类号： G01R15/18

CPC分类号： G01R31/2884 ,  B82Y25/00 ,  G01R15/205 ,  G01R33/091 ,  G01R33/093 ,  G01R33/096 ,  G01R33/098 ,  H01F10/325 ,  H01F10/3254 ,  H01L2224/4846 ,  H01L2224/49111

摘要： A semiconductor device comprises: a semiconductor element including an electrode; a leading line electrically connected to the electrode, passing above the electrode, and led to a side thereof; and a current sensor sensing current flowing through the leading line. The current sensor includes a magneto-resistance element placed above the electrode and below the leading line. A resistance value of the magneto-resistance element varies linearly according to magnetic field generated by the current.

摘要翻译： 半导体器件包括：包括电极的半导体元件; 电连接到电极的引线，通过电极上方并被引导到其一侧; 以及感测电流流经前导线的电流传感器。 电流传感器包括放置在电极上方和导线下方的磁阻元件。 磁阻元件的电阻值根据电流产生的磁场线性变化。

公开(公告)号：US09659795B2

公开(公告)日：2017-05-23

申请号：US13617215

申请日：2012-09-14

申请人： Akira Okada ,  Takaya Noguchi ,  Hajime Akiyama

发明人： Akira Okada ,  Takaya Noguchi ,  Hajime Akiyama

IPC分类号： H01L21/67

CPC分类号： H01L21/67028

摘要： A device includes a jig having a plate with through-holes formed therein and also having a frame formed on the plate so as to be able to accommodate a plurality of semiconductor chips in spaced relationship, a foreign matter capture member having a first charge section with a first flat surface and a second charge section with a second flat surface, the second charge section being insulated from the first charge section, charging means for positively charging the first flat surface and negatively charging the second flat surface, and sliding means for causing either the jig or the foreign matter capture member to slide relative to the other in such a manner that the through-holes of the jig are spaced a predetermined distance from the first and second flat surfaces. The through-holes are formed in different regions defined and surrounded by the frame.

公开(公告)号：US09117656B2

公开(公告)日：2015-08-25

申请号：US13595299

申请日：2012-08-27

申请人： Akira Okada ,  Takaya Noguchi ,  Hajime Akiyama

发明人： Akira Okada ,  Takaya Noguchi ,  Hajime Akiyama

IPC分类号： H01L21/30 ,  B08B6/00 ,  B08B5/04 ,  H01L21/00 ,  H01L21/02 ,  H01L21/67 ,  H01L21/673

CPC分类号： H01L21/02076 ,  B08B5/04 ,  B08B6/00 ,  H01L21/02041 ,  H01L21/02046 ,  H01L21/67 ,  H01L21/67028 ,  H01L21/673 ,  H01L21/67333

摘要： A semiconductor cleaning device includes an external electrode opposed to a side surface of the semiconductor device; a base configured to allow arrangement of the semiconductor device, and having an opening positioned between the side surface of the semiconductor device in the arranged state and the external electrode, and located below the side surface of the semiconductor device; a frame having an electrically insulating property, being in contact with the external electrode, arranged on the base and opposed to the side surface of the semiconductor device; and suction means connected to the opening in the base and being capable of taking in the foreign matter through the opening. Thereby, the semiconductor cleaning device and a semiconductor cleaning method that can remove the foreign matter adhered to the side surface of the semiconductor device and can prevent re-adhesion of the removed foreign matter can be obtained.

摘要翻译： 半导体清洁装置包括与半导体器件的侧表面相对的外部电极; 基座，被配置为允许半导体器件的布置，并且具有位于布置状态的半导体器件的侧表面之间的开口和外部电极，并且位于半导体器件的侧表面之下; 具有与外部电极接触的具有电绝缘性能的框架，布置在基座上并与半导体器件的侧表面相对; 以及连接到基座中的开口并且能够通过开口吸收异物的抽吸装置。 由此，可以获得能够除去附着在半导体装置的侧面的异物并能够防止除去的异物的再附着的半导体清洗装置和半导体清洗方法。

公开(公告)号：US20120161751A1

公开(公告)日：2012-06-28

申请号：US13213778

申请日：2011-08-19

申请人： Hajime Akiyama ,  Akira Okada

发明人： Hajime Akiyama ,  Akira Okada

IPC分类号： G01R15/18

CPC分类号： G01R31/2884 ,  B82Y25/00 ,  G01R15/205 ,  G01R33/091 ,  G01R33/093 ,  G01R33/096 ,  G01R33/098 ,  H01F10/325 ,  H01F10/3254 ,  H01L2224/4846 ,  H01L2224/49111

摘要： A semiconductor device comprises: a semiconductor element including an electrode; a leading line electrically connected to the electrode, passing above the electrode, and led to a side thereof; and a current sensor sensing current flowing through the leading line. The current sensor includes a magneto-resistance element placed above the electrode and below the leading line. A resistance value of the magneto-resistance element varies linearly according to magnetic field generated by the current.

摘要翻译： 半导体器件包括：包括电极的半导体元件; 电连接到电极的引线，通过电极上方并被引导到其一侧; 以及感测电流流经前导线的电流传感器。 电流传感器包括放置在电极上方和导线下方的磁阻元件。 磁阻元件的电阻值根据电流产生的磁场线性变化。