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公开(公告)号:US4902551A
公开(公告)日:1990-02-20
申请号:US224911
申请日:1988-07-27
申请人: Akishi Nakaso , Toshiro Okamura , Haruo Ogino , Tomoko Watanabe , Yuko Kimura
发明人: Akishi Nakaso , Toshiro Okamura , Haruo Ogino , Tomoko Watanabe , Yuko Kimura
IPC分类号: B32B15/04 , C23C18/40 , C23C22/63 , C23C22/83 , H05K1/00 , H05K1/03 , H05K3/02 , H05K3/28 , H05K3/38 , H05K3/42 , H05K3/46
CPC分类号: C23C22/63 , B32B15/04 , C23C18/40 , C23C22/83 , H05K3/022 , H05K3/385 , H05K3/4652 , H05K1/0366 , H05K1/0393 , H05K2201/0355 , H05K2203/0315 , H05K2203/1157 , H05K3/281 , H05K3/427 , Y10S428/901 , Y10T156/1057 , Y10T29/49165 , Y10T428/24322
摘要: Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer, (b) after contacting with a metal piece made of copper or a metal nobler than copper, or (c) after contacting with an aqueous solution of alkali borohydride.
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公开(公告)号:US5690837A
公开(公告)日:1997-11-25
申请号:US576488
申请日:1995-12-21
申请人: Akishi Nakaso , Koichi Tsuyama , Kazuhisa Otsuka , Haruo Ogino , Yoshihiro Tamura , Teiichi Inada , Kazunori Yamamoto , Akinari Kida , Atsushi Takahashi , Yoshiyuki Tsuru , Shigeharu Arike
发明人: Akishi Nakaso , Koichi Tsuyama , Kazuhisa Otsuka , Haruo Ogino , Yoshihiro Tamura , Teiichi Inada , Kazunori Yamamoto , Akinari Kida , Atsushi Takahashi , Yoshiyuki Tsuru , Shigeharu Arike
CPC分类号: H05K3/4652 , H05K3/0055 , H05K2201/0209 , H05K2203/063 , H05K2203/0773 , H05K2203/0789 , H05K2203/0793 , H05K2203/0796 , H05K3/025 , H05K3/381
摘要: In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.
摘要翻译: 在制造多层印刷电路板的方法中,该多层印刷电路板包括至少包含铜箔和绝缘半固化粘合剂层的复合膜材料中的通孔钻孔,将所得薄膜材料层叠在内层电路基板上,电连接 具有外层铜箔的内层电路当流入孔中的粘合剂树脂被粗糙化时,或者当使用形成在载体上的具有小于12μm厚的铜箔的复合膜材料或特殊的缓冲材料 进一步层压在内层电路基板和膜材料的层压体上,提高了电连接的可靠性,并且通过简单的步骤可以提高电路密度。
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公开(公告)号:US5243144A
公开(公告)日:1993-09-07
申请号:US446816
申请日:1989-12-06
申请人: Haruo Ogino , Hiroharu Kamiyama , Akishi Nakaso
发明人: Haruo Ogino , Hiroharu Kamiyama , Akishi Nakaso
CPC分类号: H05K3/428 , H05K1/116 , H05K2201/094 , H05K2203/1383 , H05K3/429 , H05K3/4652
摘要: A circuit board having holes (a) and holes (b) therein with different electrically connecting structures and enlarged connecting areas with respect to an insulating substrate and circuit conductors formed on the insulating substrate is excellent in connection reliability and high in wiring density.
摘要翻译: 具有孔(a)和孔(b)的电路板具有不同的电连接结构和相对于绝缘基板和形成在绝缘基板上的电路导体的扩大连接区域,连接可靠性和布线密度高。
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