公开(公告)号：US08387714B2

公开(公告)日：2013-03-05

申请号：US11854125

申请日：2007-09-12

申请人： Akiyoshi Uchijima ,  Koji Saito

发明人： Akiyoshi Uchijima ,  Koji Saito

IPC分类号： A01B51/00

CPC分类号： A01B59/06

摘要： A rear implement mounting frame construction for a tractor is disclosed. The construction comprises a pair of mounting frames attached respectively to right and left sides of a tractor body. Each of these mounting frames comprises a plate member having a plate thickness oriented along the right/left direction. Each mounting frame also includes a case mounting portion that is connected to a rear axle case of the tractor body and a vertical connecting portion formed rearwardly of the case mounting portion which connects a rear implement. A bent portion formed between the case mounting portion and the vertical connecting portion causes the vertical connecting portion to be disposed closer to the tractor body than the case mounting portion. A right/left distance between the vertical connecting portions is set smaller than a right/left distance between the case mounting portions.

摘要翻译： 公开了一种用于拖拉机的后部工具安装框架结构。 该结构包括分别安装在拖拉机主体的左侧和左侧的一对安装框架。 这些安装框架中的每一个包括具有沿着左右方向定向的板厚度的板构件。 每个安装框架还包括壳体安装部分，其连接到拖拉机主体的后轴箱和垂直连接部分，其形成在连接后部工具的壳体安装部分的后方。 形成在壳体安装部分和垂直连接部分之间的弯曲部分使垂直连接部分比壳体安装部分更靠近拖拉机主体设置。 垂直连接部之间的右/右距离被设定为小于壳体安装部之间的左右距离。

公开(公告)号：US20080202779A1

公开(公告)日：2008-08-28

申请号：US11854125

申请日：2007-09-12

申请人： Akiyoshi Uchijima ,  Koji Saito

发明人： Akiyoshi Uchijima ,  Koji Saito

IPC分类号： A01B59/06

CPC分类号： A01B59/06

摘要： A rear implement mounting frame construction for a tractor is disclosed. The construction comprises a pair of mounting frames attached respectively to right and left sides of a tractor body. Each of these mounting frames comprises a plate member having a plate thickness oriented along the right/left direction. Each mounting frame also includes a case mounting portion that is connected to a rear axle case of the tractor body and a vertical connecting portion formed rearwardly of the case mounting portion which connects a rear implement. A bent portion formed between the case mounting portion and the vertical connecting portion causes the vertical connecting portion to be disposed closer to the tractor body than the case mounting portion. A right/left distance between the vertical connecting portions is set smaller than a right/left distance between the case mounting portions.

摘要翻译： 公开了一种用于拖拉机的后部工具安装框架结构。 该结构包括分别安装在拖拉机主体的左侧和左侧的一对安装框架。 这些安装框架中的每一个包括具有沿着左右方向定向的板厚度的板构件。 每个安装框架还包括壳体安装部分，其连接到拖拉机主体的后轴箱和垂直连接部分，其形成在连接后部工具的壳体安装部分的后面。 形成在壳体安装部分和垂直连接部分之间的弯曲部分使垂直连接部分比壳体安装部分更靠近拖拉机主体设置。 垂直连接部之间的右/右距离被设定为小于壳体安装部之间的左右距离。

公开(公告)号：US08733554B2

公开(公告)日：2014-05-27

申请号：US12749774

申请日：2010-03-30

申请人： Fumio Sato ,  Takashi Yoshida ,  Toshiya Hirata ,  Koji Saito

发明人： Fumio Sato ,  Takashi Yoshida ,  Toshiya Hirata ,  Koji Saito

IPC分类号： B07B13/00 ,  B24B57/00 ,  B07B1/14

CPC分类号： B07B1/14 ,  B07B2201/04 ,  B24B57/00

摘要： An abrasive grains classifying apparatus is used to classify abrasive grains based on their sizes that can be determined by distances between mutually opposed surfaces of the respective abrasive grains. The abrasive grains classifying apparatus is provided with: a first gap portion 35 which includes two rollers 24 and 32 disposed at a predetermined distance L2 from each other and also which classifies the abrasive grains 60 into first abrasive grains 60b and 60c capable of passing through between the rollers 24 and 32 and second abrasive grains 60a incapable of passing through between the two rollers 24 and 32; and a second gap portion 54 which includes two rollers 54 and 69 disposed at a distance L3 smaller than the distance L2 in the first gap portion 35 from each other.

摘要翻译： 磨粒分级装置用于根据其各自的磨粒相互相对的表面之间的距离可确定的尺寸对磨粒进行分类。 磨粒分级装置设置有：第一间隙部分35，其包括彼此以预定距离L2设置的两个辊24和32，并且还将磨粒60分类成能够穿过第二磨粒60b和60c之间的第一磨粒60b和60c 辊24和32以及不能穿过两个辊24和32之间的第二磨料颗粒60a; 以及第二间隙部分54，其包括设置在比第一间隙部分35中的距离L2小的距离L3处的彼此相对的两个辊54和69。

公开(公告)号：US08685910B2

公开(公告)日：2014-04-01

申请号：US12845085

申请日：2010-07-28

申请人： Shigeru Yokoi ,  Kazumasa Wakiya ,  Koji Saito

发明人： Shigeru Yokoi ,  Kazumasa Wakiya ,  Koji Saito

IPC分类号： C11D7/50 ,  C11D11/00

CPC分类号： C11D11/0047 ,  C11D1/62 ,  C11D7/3209 ,  C11D7/3281 ,  C11D7/34 ,  G03F7/425 ,  G03F7/426

摘要： It is disclosed a cleaning liquid for stripping and dissolving a photoresist pattern having a film thickness of 10-150 μm, which contains (a) 0.5-15 mass % of a quaternary ammonium hydroxide, such as tetrapropylammonium hydroxide and tetrabutylammonium hydroxide, (b) 65-97 mass % of a water-soluble organic solvent, such as dimethylsulfoxide or a mixed solvent thereof with N-methyl-2-pyrrolidone, sulforane, etc., and (c) 0.5-30 mass % of water, and a method for treating a substrate therewith.

摘要翻译： 公开了一种用于剥离和溶解膜厚度为10-150μm的光致抗蚀剂图案的清洗液，其含有（a）0.5-15质量％的季铵氢氧化物，例如四丙基氢氧化铵和四丁基氢氧化铵，（b） 65-97质量％的水溶性有机溶剂，例如二甲基亚砜或其与N-甲基-2-吡咯烷酮，sulforane等的混合溶剂，和（c）0.5-30质量％的水，以及 用于处理基材。

公开(公告)号：US08617795B2

公开(公告)日：2013-12-31

申请号：US12223913

申请日：2007-02-15

申请人： Takahiro Senzaki ,  Koichi Misumi ,  Atsushi Yamanouchi ,  Koji Saito

发明人： Takahiro Senzaki ,  Koichi Misumi ,  Atsushi Yamanouchi ,  Koji Saito

IPC分类号： G03F7/40 ,  G03F7/004 ,  G03F7/038

CPC分类号： G03F7/038 ,  G03F7/0045 ,  G03F7/0385

摘要： Problem: Providing a photosensitive resin composition that has high sensitivity, sustains a slight shrinkage in volume when cured under heating and can form resist patterns having high-aspect profiles, and a pattern forming method using such a composition.Means for Resolution: A photosensitive resin composition characterized by containing (a) a polyfunctional epoxy resin, (b) a cationic polymerization initiator and (c) an aromatic polycyclic compound as a sensitizer (such as 2,3-dihydroxynaphthalene, 1,5-dihydroxynaphthalene or 2,6-dihydroxynaphthalene), which has at least two substituents capable of forming cross-links with component (a).

摘要翻译： 问题：提供一种具有高灵敏度的感光性树脂组合物，在加热下固化时能够容易地体积收缩，并且可以形成具有高外形轮廓的抗蚀剂图案，以及使用这种组合物的图案形成方法。 解决方法：一种感光性树脂组合物，其特征在于，含有（a）多官能环氧树脂，（b）阳离子聚合引发剂和（c）作为敏化剂的芳香族多环化合物（如2,3-二羟基萘， 二羟基萘或2,6-二羟基萘），其具有至少两个能够与组分（a）形成交联的取代基。

公开(公告)号：US08507180B2

公开(公告)日：2013-08-13

申请号：US12515872

申请日：2007-10-18

申请人： Yasushi Washio ,  Kazuhide Uno ,  Koichi Misumi ,  Takahiro Senzaki ,  Koji Saito ,  Nobuko Ohgake

发明人： Yasushi Washio ,  Mitsuaki Ohgake ,  Kazuhide Uno ,  Koichi Misumi ,  Takahiro Senzaki ,  Koji Saito

IPC分类号： G03F7/039

CPC分类号： G03F7/0045 ,  G03F7/0046 ,  G03F7/0397 ,  H01L21/0271

摘要： Disclosed are a chemically amplified positive-type photoresist composition for a thick film, a chemically amplified dry film for a thick film, and a method for producing a thick film resist pattern, all of which are capable of obtaining a satisfactory resist pattern with high sensitivity even on a substrate having a portion formed of copper on an upper surface thereof. The chemically amplified positive-type photoresist composition for a thick film comprises component (A) which includes at least one compound capable of producing an acid upon irradiation with an actinic ray or radiation, and component (B) which includes at least one resin whose alkali solubility increases by the action of an acid, in which the component (A) includes an onium fluorinated alkyl fluorophosphate having a specific structure.

摘要翻译： 公开了一种用于厚膜的化学放大正型光致抗蚀剂组合物，用于厚膜的化学放大干膜，以及制造厚膜抗蚀剂图案的方法，所有这些都能够以高灵敏度获得令人满意的抗蚀剂图案 即使在其上表面上具有由铜形成的部分的基板上。 用于厚膜的化学放大正型光致抗蚀剂组合物包含组分（A），其包含至少一种能够在用光化学射线或辐射照射时能够产生酸的化合物，和组分（B），其包含至少一种其碱 通过酸的作用，溶解度增加，其中组分（A）包括具有特定结构的鎓氟化烷基氟磷酸酯。

公开(公告)号：US20120028550A1

公开(公告)日：2012-02-02

申请号：US13258127

申请日：2010-03-31

申请人： Satoru Uchiumi ,  Naoya Matsunaga ,  Masahiko Masuzaki ,  Koji Saito

发明人： Satoru Uchiumi ,  Naoya Matsunaga ,  Masahiko Masuzaki ,  Koji Saito

IPC分类号： B24B33/02 ,  B24B33/08

CPC分类号： B24B33/022 ,  B23B29/02 ,  B23B29/03446 ,  B23B29/03457 ,  B23B41/12 ,  B24B33/08

摘要： An arm 21 has a shape for grasping a part in a circumferential direction of a tool holder 7. The arm 21 is connected to the tool holder 7 with a bolt 23 inserted into a fixing hole 22 provided in a base side portion of the arm 21. A tapped hole 25 used for exchangeably attaching a cutting tool 24 is formed in a tip side portion of the arm 21. A groove part 26 extending in parallel to an axis of the tool holder 7 is formed in a position close to the base portion of the arm 21. Owing to the groove part 26, the arm 21 works as an elastic hinge when an external force is applied, so as to increase or decrease a radial dimension of the cutting tool 24 while keeping its parallelism to the axis of the tool.

摘要翻译： 臂21具有用于抓握工具架7的圆周方向的一部分的形状。臂21通过插入到设置在臂21的基部侧的固定孔22中的螺栓23连接到工具夹具7 在臂21的前端部形成有用于可切换地安装切削工具24的螺纹孔25.平行于刀架7的轴线延伸的槽部26形成在靠近基部的位置 通过槽部26，当施加外力时，臂21作为弹性铰链起作用，以便增加或减小切削工具24的径向尺寸，同时保持其与轴线的平行度 工具。

公开(公告)号：US07969505B2

公开(公告)日：2011-06-28

申请号：US11896641

申请日：2007-09-04

申请人： Koji Saito

发明人： Koji Saito

IPC分类号： H04N5/225 ,  H04N5/222 ,  G03B15/02 ,  F21V21/26

CPC分类号： G06F1/1616 ,  G06F1/1677 ,  G06F1/1684 ,  G06F1/1686 ,  H04N5/2256

摘要： An electronic device is disclosed that includes an operations unit disposed in a device main body for input operations, and a camera unit including a camera for image capturing and a light source that emits light for image capturing. A light irradiation position of the light source is variable so that the light source illuminates the operations unit.

摘要翻译： 公开了一种电子设备，其包括设置在用于输入操作的设备主体中的操作单元，以及包括用于图像捕获的相机和照射用于图像捕获的光的照相机单元。 光源的光照射位置是可变的，使得光源照亮操作单元。

公开(公告)号：US20100273405A1

公开(公告)日：2010-10-28

申请号：US12747225

申请日：2009-02-09

申请人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

发明人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

IPC分类号： B24B7/20 ,  B24B41/06 ,  B24B55/02

CPC分类号： B24B37/30

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光面（101a）的抛光台（100），被配置为将基板保持并压靠在抛光表面（101a）上的顶环体（2），以及设置在抛光表面 所述顶环体（2）的外周部分构造成按压所述抛光表面（101a）。 用于在衬底抛光期间接收从衬底施加到保持环（3）的侧向力的支点位于衬底的中心部分的上方。

公开(公告)号：US07754416B2

公开(公告)日：2010-07-13

申请号：US11720180

申请日：2005-11-28

申请人： Koichi Misumi ,  Koji Saito ,  Kaoru Ishikawa

发明人： Koichi Misumi ,  Koji Saito ,  Kaoru Ishikawa

IPC分类号： G03F7/26 ,  G03F7/40

CPC分类号： H05K3/108 ,  G03F7/0397 ,  G03F7/11 ,  H05K3/384 ,  H05K2201/0317

摘要： This process for producing a resist pattern includes: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type positive photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to said photoresist laminate, and the step of developing said (c) photoresist layer together with said (b) inorganic substance layer to form a resist pattern.

摘要翻译： 制造抗蚀剂图案的方法包括：（a）具有铜的上表面的载体的层叠步骤，（b）由无机物质源供给的无机物质构成的无机物质层，（c） 由化学放大型正性光致抗蚀剂组合物构成的光致抗蚀剂层，以获得光致抗蚀剂层压体，选择性地向所述光致抗蚀剂层压体照射活性光或放射线的步骤，以及将所述（c）光致抗蚀剂层与所述（b ）无机物质层以形成抗蚀剂图案。