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22 条记录 (耗时 0.032 秒)

    MEMS device and interconnects for same
    1.
    发明授权
    MEMS device and interconnects for same 失效
    MEMS器件和互连相同

    公开(公告)号：US07580172B2

    公开(公告)日：2009-08-25

    申请号：US11540485

    申请日：2006-09-29

    申请人： Alan G. Lewis ,  Manish Kothari ,  John Batey ,  Teruo Sasagawa ,  Ming-Hau Tung ,  Gregory D. U'Ren ,  Stephen Zee

    发明人： Alan G. Lewis ,  Manish Kothari ,  John Batey ,  Teruo Sasagawa ,  Ming-Hau Tung ,  Gregory D. U'Ren ,  Stephen Zee

    IPC分类号： G02F1/03 ,  G02B26/00

    CPC分类号： B81B7/0006 ,  B81B7/007 ,  B81B2201/047 ,  G02B26/001 ,  H02N1/006

    摘要： A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode and a mechanical layer of the device. In an embodiment, this conductive layer is a sacrificial layer that is subsequently removed to form a cavity between the electrode and the movable layer. The sacrificial layer is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer that preferably comprises aluminum.

    摘要翻译： 一种微机电系统装置，其具有在所述装置外部的电路和所述装置内的电极和可移动​​层中的至少一个之间的电互连。 电互连的至少一部分由与电极和器件的机械层之间的导电层相同的材料形成。 在一个实施例中，该导电层是牺牲层，其随后被去除以在电极和可移动​​层之间形成空腔。 牺牲层优选由钼，掺杂硅，钨或钛形成。 根据另一实施例，导电层是优选包括铝的可移动反射层。

    MEMS device and interconnects for same
    2.
    发明申请
    MEMS device and interconnects for same 失效
    MEMS器件和互连相同

    公开(公告)号：US20070103028A1

    公开(公告)日：2007-05-10

    申请号：US11540485

    申请日：2006-09-29

    申请人： Alan Lewis ,  Manish Kothari ,  John Batey ,  Teruo Sasagawa ,  Ming-Hau Tung ,  Gregory U'Ren ,  Stephen Zee

    发明人： Alan Lewis ,  Manish Kothari ,  John Batey ,  Teruo Sasagawa ,  Ming-Hau Tung ,  Gregory U'Ren ,  Stephen Zee

    IPC分类号： H02N11/00

    CPC分类号： B81B7/0006 ,  B81B7/007 ,  B81B2201/047 ,  G02B26/001 ,  H02N1/006

    摘要： A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode and a mechanical layer of the device. In an embodiment, this conductive layer is a sacrificial layer that is subsequently removed to form a cavity between the electrode and the movable layer. The sacrificial layer is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer that preferably comprises aluminum.

    摘要翻译： 一种微机电系统装置，其具有在所述装置外部的电路和所述装置内的电极和可移动​​层中的至少一个之间的电互连。 电互连的至少一部分由与电极和器件的机械层之间的导电层相同的材料形成。 在一个实施例中，该导电层是牺牲层，其随后被去除以在电极和可移动​​层之间形成空腔。 牺牲层优选由钼，掺杂硅，钨或钛形成。 根据另一实施例，导电层是优选包括铝的可移动反射层。

    METHOD OF MANUFACTURE FOR MICROELECTROMECHANICAL DEVICES
    3.
    发明申请
    METHOD OF MANUFACTURE FOR MICROELECTROMECHANICAL DEVICES 有权
    微电子设备制造方法

    公开(公告)号：US20090068781A1

    公开(公告)日：2009-03-12

    申请号：US12271793

    申请日：2008-11-14

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    Method of manufacture for microelectromechanical devices
    4.
    发明授权
    Method of manufacture for microelectromechanical devices 有权
    微机电装置的制造方法

    公开(公告)号：US07476327B2

    公开(公告)日：2009-01-13

    申请号：US10839329

    申请日：2004-05-04

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： B21D39/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    Method of manufacture for microelectromechanical devices
    9.
    发明授权
    Method of manufacture for microelectromechanical devices 有权
    微机电装置的制造方法

    公开(公告)号：US07704772B2

    公开(公告)日：2010-04-27

    申请号：US12271793

    申请日：2008-11-14

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。