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公开(公告)号：US5179501A
公开(公告)日：1993-01-12
申请号：US840247
申请日：1992-02-24
CPC分类号： H05K1/0278 , H05K3/0061 , H05K5/003 , H05K1/189 , H05K2201/0338 , H05K2201/09109 , H05K2201/10189 , H05K2203/302
摘要： An electronic module assembly includes a relatively thin, bendable base plate having at least one bend axis along which the base plate is bent over on itself to provide an enclosure. An inner surface of the base plate supports at least one, and preferably two, relatively thicker metal plates, one on each side of the bend axis, each metal plate acting as a heatsink for circuit components mounted thereon.
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公开(公告)号：US4809057A
公开(公告)日：1989-02-28
申请号：US943529
申请日：1986-12-18
申请人： Alfred G. Ocken
发明人： Alfred G. Ocken
CPC分类号： H01L23/562 , H01L2924/0002 , Y10S257/909 , Y10T29/49146 , Y10T29/49171
摘要： An electrical component assembly (10), comprising a rectifier bridge, utilizes a protective cover (30) for mechanical protection of semiconductor diode dies (11, 12) mounted on an aluminum heat sink support carrier (16). Channels (37, 37B) with effective openings (40, 40A) therein are provided in a top surface (38) of the protective cover to facilitate applying an environmental sealing materail (45) through said channels and openings to the semiconductor diode dies of the electrical assembly as well as to various critical electrical interconnections (48) in the electrical assembly. By utilizing the mechanically protective cover to also provide for guiding the application of an environmental sealing material for the electrical assembly, extensive fixturing in providing a desired electrical assembly is minimized, the assembly is rendered more readily manufacturable, and protection of the assembly is provided even during the step of dispensing the sealing material.
摘要翻译： 包括整流器桥的电气部件组件（10）利用用于对安装在铝散热器支撑载体（16）上的半导体二极管管芯（11,12）进行机械保护的保护盖（30）。 在保护盖的顶表面（38）中设置有其中具有有效开口（40,40A）的通道（37,37B），以便通过所述通道和开口将环境密封材料（45）施加到所述保护盖的半导体二极管管芯 电组件以及电组件中的各种关键电互连（48）。 通过利用机械保护盖还提供引导用于电气组件的环境密封材料的应用，在提供期望的电气组件的情况下的广泛的固定被最小化，组件变得更容易制造，并且甚至提供组件的保护 在分配密封材料的步骤期间。
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公开(公告)号：US5416278A
公开(公告)日：1995-05-16
申请号：US024046
申请日：1993-03-01
申请人： Fred E. Ostrem , Alfred G. Ocken
发明人： Fred E. Ostrem , Alfred G. Ocken
IPC分类号： H05K1/00 , H05K1/02 , H05K1/05 , H05K1/11 , H05K3/00 , H05K3/30 , H05K3/34 , H05K3/36 , H05K3/40 , H05K3/44
CPC分类号： H05K3/44 , H05K3/363 , H05K1/0206 , H05K1/0393 , H05K1/05 , H05K1/111 , H05K2201/0195 , H05K2201/0305 , H05K2201/0347 , H05K2201/09554 , H05K2201/10666 , H05K2201/10977 , H05K3/0061 , H05K3/305 , H05K3/3452 , H05K3/4038
摘要： A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. Then, a quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103). During this reflow step, the structure of the adhesive layer (105) acts as a soldermask preventing the solder (113) from flowing outside of an area defined by the via (106).
摘要翻译： 通过连接构造馈通方法和相应的装置包括优选由铝材料组成的金属板（101）或刚性机构。 可焊接接触区域（103）位于板（101）上。 该接触区域（103）优选由通过等离子体喷涂工艺选择性地设置的铜材料构成。 接下来，将电绝缘性粘合剂层（105）设置在板（101）上。 该粘合剂层（105）具有穿过通孔（106），其穿过与接触区域（103）对齐。 然后，将优选由柔性复合聚酰亚胺材料构成的基板（109）设置在粘合剂层（105）上。 该柔性基板（109）具有穿过其中设置有可焊接区域（111）的通孔（110）。 然后，将一定量的焊料（113）设置在可焊接区域（111）上，并且组装（100）被加热，使得焊料（113）流入通孔（106）和（110），从而提供电气 包括通孔（110）的可焊接区域（111），焊料（113）和接触区域（103）的连接。 在该回流步骤期间，粘合剂层（105）的结构用作焊接掩模，防止焊料（113）流过由通孔（106）限定的区域的外部。
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公开(公告)号：US06172307B2
公开(公告)日：2001-01-09
申请号：US08410616
申请日：1995-03-24
申请人： Fred E. Ostrem , Alfred G. Ocken
发明人： Fred E. Ostrem , Alfred G. Ocken
IPC分类号： H01R909
CPC分类号： H05K3/44 , H05K1/0206 , H05K1/0393 , H05K1/05 , H05K1/111 , H05K3/0061 , H05K3/305 , H05K3/3452 , H05K3/363 , H05K3/4038 , H05K2201/0195 , H05K2201/0305 , H05K2201/0347 , H05K2201/09554 , H05K2201/10666 , H05K2201/10977
摘要： A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. Then, a quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103). During this reflow step, the structure of the adhesive layer (105) acts as a soldermask preventing the solder (113) from flowing outside of an area defined by the via (106).
摘要翻译： 通过连接构造馈通方法和相应的装置包括优选由铝材料组成的金属板（101）或刚性机构。 可焊接接触区域（103）位于板（101）上。 该接触区域（103）优选由通过等离子体喷涂工艺选择性地设置的铜材料构成。 接下来，将电绝缘性粘合剂层（105）设置在板（101）上。 该粘合剂层（105）具有穿过通孔（106），其穿过与接触区域（103）对齐。 然后，将优选由柔性复合聚酰亚胺材料构成的基板（109）设置在粘合剂层（105）上。 该柔性基板（109）具有穿过其中设置有可焊接区域（111）的通孔（110）。 然后，将一定量的焊料（113）设置在可焊接区域（111）上，并且组装（100）被加热，使得焊料（113）流入通孔（106）和（110），从而提供电气 包括通孔（110）的可焊接区域（111），焊料（113）和接触区域（103）的连接。 在该回流步骤期间，粘合剂层（105）的结构用作焊接掩模，防止焊料（113）流过由通孔（106）限定的区域的外部。
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公开(公告)号：US4872089A
公开(公告)日：1989-10-03
申请号：US286001
申请日：1988-12-19
CPC分类号： H05K7/12 , H01L23/4093 , H01L2924/0002
摘要： A heat sink assembly for a plurality of transistors includes specially-formed spring clips and a specially-formed heat sink to hold the transistors firmly on the heat sink, and a lead protector that mates with the heat sink to receive and protect the leads of the transistors during handling. The lead protector and the heat sink include integrally-formed fastener/alignment pins for aligning the lead protector with the heat sink, and for aligning the completed heat sink assembly with a circuit board and for holding the assembly securely fastened to the circuit board. A particular feature of the lead protector permits it to mate with heat sink in a first discrete position in which it receives and protects the transistor leads, and to more closely mate with the heat sink in a second discrete position in which the transistor leads pass through the lead protector and into target holes in the circuit board.
摘要翻译： 用于多个晶体管的散热器组件包括特别形成的弹簧夹和专门形成的散热器，以将晶体管牢固地保持在散热器上，以及引线保护器，其与散热器配合以接收和保护引线 处理过程中的晶体管。 引线保护器和散热器包括用于将引线保护器与散热器对准的整体形成的紧固件/对准销钉，以及用于将完整的散热器组件与电路板对准并将组件牢固地固定在电路板上。 引线保护器的特定特征允许它在第一离散位置与散热器配合，在该第一离散位置接收和保护晶体管引线，并且在晶体管引线通过的第二离散位置中与散热器更紧密地配合 导线保护器并插入电路板中的目标孔中。
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公开(公告)号：US4710657A
公开(公告)日：1987-12-01
申请号：US906570
申请日：1986-09-09
CPC分类号： H02K9/06 , H02K11/046 , H02K19/36 , H02K19/365 , H02K5/10 , H02K5/141
摘要： An inexpensive semi enclosed alternator provides high power prolonged operation in environments having particle contamination in the ambient atmosphere. An alternator housing has front and rear housing portions, and a drive shaft carrying a rotor assembly is within the housing. A drive shaft extension from the housing holds a fan assembly. The rear housing portion has cylindrical sidewalls joined to a closed end portion 27 and forms an air sealed cavity except for an open end facing the front housing portion. The front housing portion comprises cylindrical sidewalls, having through-openings therein, which terminate in a first end opening 31, facing rear housing open end 28, and a substantially open second end opening 30 facing the fan assembly and the ambient atmosphere. Preferably rotor and stator assemblies, and rectifying diodes, are positioned within the housing substantially between the through openings and the closed end portion of the rear housing. During normal drive shaft rotation, the fan assembly draws cooling ambient air into the housing through the through-openings 33, and this air is then drawn out of the housing through the second end opening 30 of the front housing portion. This causes cooling air turbulence within the housing, while not directly exposing most internal alternator components to particle contamination in the ambient atmosphere. A voltage regulator is provided in a sealed protective cavity external to the internal cavity. A heatsink which is part of the voltage regulator is utilized to form part of the walls that create the protective cavity.
摘要翻译： 廉价的半封闭交流发电机在环境空气中具有颗粒污染的环境中提供高功率延长的操作。 交流发电机壳体具有前和后壳体部分，并且承载转子组件的驱动轴在壳体内。 从壳体的驱动轴延伸部支撑风扇组件。 后壳体部分具有连接到封闭端部27的圆柱形侧壁，并且除了面向前壳体部分的开口端之外，形成空气密封腔。 前壳体部分包括在其中具有通孔的圆柱形侧壁，其终止于面向后壳体开口端28的第一端开口31中，以及面向风扇组件和环境大气的基本上开放的第二端开口30。 优选地，转子和定子组件以及整流二极管基本上位于壳体内的通孔和后壳体的封闭端部之间。 在正常的驱动轴旋转期间，风扇组件通过通孔33将冷却的环境空气吸入壳体中，然后该空气通过前壳体部分的第二端开口30从壳体中拉出。 这导致壳体内的冷却空气湍流，而不直接暴露大部分内部交流发电机组件到环境大气中的颗粒污染。 电压调节器设置在内腔外部的密封保护腔中。 作为电压调节器的一部分的散热器用于形成形成保护腔的壁的一部分。
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